IC Manufacturing, Package&Test


2024-12-19

[News] Taiwanese Foundries UMC and VIS Reportedly to Face Higher Depreciation Pressure Starting from 2025

IC Manufacturing, Package&Test

As TSMC keeps advancing in the most cutting-edge nodes, its foundry peers in Taiwan may have to deal with multiple challenges. In addition to the price war launched by their Chinese rivals, Taiwanese foundries focusing on legacy nodes, including UMC and TSMC’s affiliate VIS, will face significantl...

2024-12-18

[News] Taiwan’s Second Largest Foundry UMC Reportedly Denies Plans to Build a Fab in the U.S.

IC Manufacturing, Package&Test

As TSMC’s Arizona fab aims to start mass production in early 2025, whether United Microelectronics Corporation (UMC), another foundry giant in Taiwan, will follow suit attracts widespread attention. However, according to the latest report from the Central News Agency, the company has no plans to ...

2024-12-18

[News] TSMC’s Kumamoto Plant to Secure Initial Orders from Sony and Denso as Mass Production Nears

IC Manufacturing, Package&Test

TSMC's first fab in Kumamoto, Japan, is set to commence mass production by the end of 2024. According to a report from Commercial Times, citing Nikkei, the initial orders are expected to be supplied to Sony Group and Denso Corporation. According to Yuichi Horita, President of Japan Advanced Semic...

2024-12-18

[News] Samsung Reportedly Considering Partnership with TSMC to Jointly Produce Exynos 2500

IC Manufacturing, Package&Test

According to a report from Wccftech, Samsung Electronics may consider partnering with external foundries to produce its Exynos 2500 processor for the first time. The Wccftech report, citing Korean media outlet The Bell, notes that while TSMC is not explicitly mentioned, it remains the only alternati...

2024-12-17

[News] UMC Reportedly Wins Qualcomm Advanced Packaging Deal, Breaking TSMC’s Monopoly

IC Manufacturing, Package&Test

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...

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