Following its North America Technology Symposium, TSMC has shared fresh details on its CoWoS (Chip on Wafer on Substrate with silicon interposer) roadmap. According to Tom’s Hardware, Kevin Zhang, TSMC’s Senior Vice President and deputy COO, confirmed how companies like Cerebras and Tesla (with ...

While its rival ASML saw a huge decline for U.S. sales in the first quarter, ASM International, the most U.S.-exposed among European chip toolmakers, has revealed it has begun producing some of the tools on American soil to get ahead of mounting U.S. tariffs, with Arizona being one of the bases, acc...

In recent years, the U.S. has imposed export controls to block China’s access to advanced semiconductor technologies, prompting China to shift its focus to the legacy chip market. According to a report from Commercial Times, citing POLITICO, the European Court of Auditors (ECA) noted that China ha...

While Samsung has reportedly been wrestling with 3nm yield issues and the lack of orders from major clients, there may be light at the end of the tunnel. According to Sedaily, the company is now in the final stages of locking in a deal to produce Qualcomm’s Snapdragon 8 Elite 2 using its next-gen ...

Shortly after TSMC announced plans to mass-produce A14 in 2028, Intel appears ready to compete with an aggressive roadmap for 14A and 18A. According to Intel’s press release, Team Blue is preparing two more 18A variants and has begun sharing early 14A Process Design Kits (PDKs) with lead customers...