IC Manufacturing, Package&Test


2024-12-18

[News] Taiwan’s Second Largest Foundry UMC Reportedly Denies Plans to Build a Fab in the U.S.

IC Manufacturing, Package&Test

As TSMC’s Arizona fab aims to start mass production in early 2025, whether United Microelectronics Corporation (UMC), another foundry giant in Taiwan, will follow suit attracts widespread attention. However, according to the latest report from the Central News Agency, the company has no plans to ...

2024-12-18

[News] TSMC’s Kumamoto Plant to Secure Initial Orders from Sony and Denso as Mass Production Nears

IC Manufacturing, Package&Test

TSMC's first fab in Kumamoto, Japan, is set to commence mass production by the end of 2024. According to a report from Commercial Times, citing Nikkei, the initial orders are expected to be supplied to Sony Group and Denso Corporation. According to Yuichi Horita, President of Japan Advanced Semic...

2024-12-18

[News] Samsung Reportedly Considering Partnership with TSMC to Jointly Produce Exynos 2500

IC Manufacturing, Package&Test

According to a report from Wccftech, Samsung Electronics may consider partnering with external foundries to produce its Exynos 2500 processor for the first time. The Wccftech report, citing Korean media outlet The Bell, notes that while TSMC is not explicitly mentioned, it remains the only alternati...

2024-12-17

[News] UMC Reportedly Wins Qualcomm Advanced Packaging Deal, Breaking TSMC’s Monopoly

IC Manufacturing, Package&Test

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...

2024-12-16

[News] TSMC Reveals N2 Nanosheet Details: 35% Power Savings, 15% Performance Gain, Densest SRAM Cell Yet

IC Manufacturing, Package&Test

With its N2 (2nm-class) node beginning mass production in the latter half of 2025, TSMC revealed more details about it at the IEEE International Electron Device Meeting (IEDM) a couple of days ago. According to IEEE Spectrum and Tom’s Hardware, TSMC's new 2nm technology delivers up to 15% faster p...

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