IC Manufacturing, Package&Test


2024-10-04

[News] Despite 3nm Issues, Samsung Plans to Speed up 2nm/1.4nm Expansion Next Year

IC Manufacturing, Package&Test

Though still be struggling with low yield rates in 3nm, Samsung is reportedly ramping up its efforts to prepare for the mass production of 2nm and 1.4nm to compete with its longtime rival, TSMC. Citing industrial sources on Oct. 3rd, Business Korea reveals that the South Korean foundry giant is intr...

2024-10-04

[News] TSMC’s 2nm Wafers Reportedly Set to Double in Price, Benefitting IP/ Material Companies

IC Manufacturing, Package&Test

As TSMC has reportedly begun trial production of 2nm chips in its Baoshan Plant in Hsinchu, northern Taiwan, the schedule of mass producing 2nm in 2025 remains on track. A report by Commercial Times reveals that the price of 2nm wafers is expected to double compared to 4/5nm, which may exceed USD 30...

2024-10-04

[News] TSMC Announces Partnership Expansion with Amkor to Collaborate on Advanced Packaging in Arizona

IC Manufacturing, Package&Test

Amkor and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem. Amkor and TSMC have been closely collaborating to deliver high vo...

2024-10-04

[News] Russia Plans to Investment USD 2.54 billion by 2030 to Replace 70% of Foreign Chipmaking Tools

IC Manufacturing, Package&Test

In addition to China, Russia has also made semiconductors one of its major focuses. According to a report by Tom’s Hardware, which cites local media CNews, the country has set aside over 240 billion rubles (USD 2.54 billion) to fund a program aimed at replacing 70% of the foreign chipmaking equipm...

2024-10-03

[News] Packaging and Equipment Firms Accelerate FOPLP Deployment: Spotlight on 7 Taiwanese Companies

IC Manufacturing, Package&Test

The surging global demand for AI chips is straining advanced packaging capacity, driving a sharp focus on fan-out panel-level packaging (FOPLP) within Taiwan's semiconductor industry. According to a report by Commercial Times, major packaging and testing firms such as ASE and Powertech, alongside eq...

  • Page 21
  • 79 page(s)
  • 395 result(s)

Get in touch with us