IC Manufacturing, Package&Test


2024-09-09

[News] Netherlands Expands Export Control over ASML’s Two DUV Machines, Effective on September 7th

IC Manufacturing, Package&Test

In late August, it is said that the Netherlands mulls to ban ASML, the country’s semiconductor equipment giant, from conducting equipment maintenance and providing related backup components in China. Now the latest regulation has been revealed, as the Dutch government announced last Friday the exp...

2024-09-09

[News] TSMC’s Kumamoto Fab Influence Expands, Economic Spillover Effect Expected to Exceed JPY 10 Trillion

IC Manufacturing, Package&Test

TSMC's fab in Kikuyo, Kumamoto Prefecture, Japan (Kumamoto Fab 1) is expected to begin mass production by the end of 2024, with plans for a second fab in the region. Thus, the influence of TSMC's presence continues to expand, as per the latest estimates from local financial institutions. Over the...

2024-09-06

[News] Qualcomm Rumored to Consider Acquiring Parts of Intel’s Chip Design Business, with a Focus on PC Segment

IC Manufacturing, Package&Test

Amid crisis and various rumors, Intel might be finding a buyer for parts of its chip business? Citing sources familiar with the matter, the latest report by Reuters suggests that U.S. chip giant Qualcomm, which is known for its Snapdragon processors used in smartphones, has investigated the possibil...

2024-09-06

[News] Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development

IC Manufacturing, Package&Test

No eternal allies. No perpetual enemies. The old proverb seems so true when it comes to the semiconductor industry, when the world’s top foundry, TSMC, announced the collaboration with its rival Samsung, the second largest foundry globally, on the development of HBM4, according to the reports by K...

2024-09-06

[News] 300mm Wafer Fab Construction Picks up Steam Worldwide

IC Manufacturing, Package&Test

Amid the rising of emerging applications in the AI market, the booming demands for high-performance computing (HPC), high-bandwidth memory (HBM), CoWoS advanced packaging, and high-performance storage, have energized the wafer foundry industry. Given the broader applicability of 12-inch wafer in ...

  • Page 32
  • 79 page(s)
  • 395 result(s)

Get in touch with us