IC Manufacturing, Package&Test


2024-09-06

[News] Samsung Signals Will to Collaborate with Other Foundries on Basedie

IC Manufacturing, Package&Test

At the SEMICON Taiwan 2024, Samsung's Head of Memory Business, Jung Bae Lee, stated that as the industry enters the HBM4 era, collaboration between memory makers, foundries, and customers is becoming increasingly crucial. Reportedly, Samsung is prepared with turnkey solutions while maintaining fl...

2024-09-05

[News] Intel’s 18A Reportedly Runs into Trouble with Broadcom, while 20A Plan on Arrow Lake Cancelled

IC Manufacturing, Package&Test

Disappointing financial results. A 15% layoff of its workforce. Restructuring and cost-reduction plans which may include the sale of FPGA unit Altera and freezing its USD 32 billion German fab project. Now, there seems to be more bad news on the way for Intel, as its advanced nodes, specifically 18A...

2024-09-04

[News] Wafer Foundry Market Shows Signs of Recovery

IC Manufacturing, Package&Test

Recently, wafer foundry market has seen various dynamics from related manufacturers. TSMC is reportedly planning to build its third plant in Japan, while Samsung has delayed the construction of its Pyeongtaek P4/P5 chip plants to 2026, prioritizing the Texas Taylor wafer plant instead. Meanwhi...

2024-09-03

[News] Samsung and TSMC Unlikely to Be Buyers for Intel’s Rumored Foundry Business Sale

IC Manufacturing, Package&Test

As Intel has reportedly been working out options to navigate the company through crisis, its possible moves are said to include selling off Altera, putting a halt to its investment project in Germany, and though, less unlikely, sale of its foundry business. However, if this restructuring does happen...

2024-09-03

[News] Nanjing, China Achieved Breakthrough in Manufacturing Key SiC Chip for the First Time

IC Manufacturing, Package&Test

As per a recent announcement by Nanjing Release, the National Third-Generation Semiconductor Technology Innovation Center (Nanjing) has successfully developed a key technology for the manufacturing of trench-type silicon carbide (SiC) MOSFET chip after four years of independent research. This breakt...

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