TSMC continues to showcase its drive in the advanced packaging market. According to a report from MoneyDJ, TSMC has forecasted that CoWoS will remain in high demand through 2025, with potential for capacity to double in two consecutive years. TSMC is also entering the FOPLP (Fan-Out Panel-Level Pac...

As the industry is entering the Angstrom era with semiconductor giants eagerly applying EUV machines to the advanced nodes, more details about Samsung’s 2nm have surfaced. According to the latest report by TheElec, Samsung’s 2nm process will feature 30% more extreme ultraviolet (EUV) layers than...

In the Q2 earnings call today (July 18th), TSMC Chairman and CEO C.C. Wei introduced the concept of “Foundry 2.0,” redefining the foundry industry to further include sectors like packaging, testing, mask making, and others, the latest report by Technews noted. C.C. Wei pointed out that under ...

After Samsung announced a major breakthrough in 2nm, securing the first batch of orders from Japanese AI company Preferred Networks, its rival TSMC is also advancing. According to reports from Wccftech and ET News, TSMC is set to begin trial production of 2nm chips next week, which would reportedly ...

Samsung Electronics has received the first client for its 2nm process. According to the official press release from Samsung on July 9th, Samsung Electronics will provide turnkey semiconductor solutions using the 2nm process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to J...