IC Manufacturing, Package&Test


2024-07-02

[News] Taiwan Reportedly to Accommodate up to 20 More Large Plants Due to Power Constraints

IC Manufacturing, Package&Test

As semiconductor companies led by TSMC accelerate their pace for capacity expansion, benefiting the local supply chain, industry electricity consumption has emerged as a tough challenge for Taiwan. According to the latest report by the Economic Daily News, Taiwan can only accommodate 20 more large p...

2024-07-01

[News] TSMC Achieved a New Step in the Construction of its Third 2nm Fab

IC Manufacturing, Package&Test

Recently, TSMC reportedly got approval for the land change and environmental assessment of its third 2nm plant in Kaohsiung. It is reported that the Nanzih Industrial Park in Kaohsiung City will adapt to the changing needs of the global semiconductor industry supply chain and will carry out the d...

2024-06-27

[News] Samsung Refutes Rumors Regarding 3nm Wafer Defects as Groundless

IC Manufacturing, Package&Test

Rumors have been circulating regarding Samsung’s 3nm yield recently. The latest market speculation on June 25th alleged that Samsung’s foundry plant encountered a defect impacting 2,500 lots in the 3nm second-generation process, reportedly leading to a loss of 1 trillion won (USD 720 million), a...

2024-06-25

[News] Samsung Gains Early Market Entry Advantage in the Panel-Level Packaging Sector Ahead of TSMC

IC Manufacturing, Package&Test

TSMC is said to be entering the fan-out panel-level packaging (FO-PLP) sector, according to a previous report from Nikkei. Now, a report from Business Korea noted that Samsung is making significant strides in the PLP field, as the tech giant acquired the PLP business from Samsung Electro-Mechanics a...

2024-06-25

[News] Rising HBM Production by Samsung and SK Hynix Energizes Korea’s TC Bonder Industry

IC Manufacturing, Package&Test

Orders for thermal compression (TC) bonders from South Korean semiconductor equipment manufacturers are experiencing a surge, fueled by Samsung Electronics and SK Hynix ramping up their high-bandwidth memory (HBM) production. TC bonders play a pivotal role in HBM production by employing thermal comp...

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