IC Manufacturing, Package&Test


2024-05-28

[News] Russia Reportedly Completed the Manufacturing of a Lithography Machine for 350nm Chip Production

IC Manufacturing, Package&Test

According to foreign media reports on May 25, Russia's first lithography machine has been completed and is currently undergoing testing. Vasily Shpak, Deputy Minister of Industry and Trade of the Russian Federation, pointed out that this equipment can ensure the production of 350nm (0.35μm) chips. ...

2024-05-27

[News] China’s Big Fund Phase Three Commences, Injecting 344 Billion RMB into Semiconductor Industry Growth

IC Manufacturing, Package&Test

According to TianYanCha.com, the third phase of the National Integrated Circuit Industry Investment Fund Co., Ltd. has recently been established in China. The legal representative is Zhang Xin, with a registered capital of RMB 344 billion. The fund’s business scope includes private equity fund ...

2024-05-27

[News] Google Reportedly Shifts Orders from Samsung to TSMC for Its Upcoming Tensor G5 in the Pixel 10 Series

IC Manufacturing, Package&Test

Google has reportedly collaborated with TSMC on the upcoming Tensor G5 chip, slated for use in the Pixel 10 series smartphone to be released next year, according to media outlet Android Authority, based on information it spotted in trade databases. Google has been cooperating with Samsung on its ...

2024-05-27

[News] UMC’s Global and Local Orders Surge Amid U.S. Tariffs on China and Networking Market Recovery

IC Manufacturing, Package&Test

According to Taiwan's Economic Daily News, UMC has recently engaged in discussions with global giants such as Texas Instruments and Infineon about long-term cooperation plans. Additionally, Taiwan’s two leading IC design companies, MediaTek and Realtek, have seen their inventories of WiFi 6/6E chi...

2024-05-25

[News] Decipher TSMC’s Calm Take on High-NA EUV Lithography Machines: Who May Have the Last Laugh in the Angstrom Era?

IC Manufacturing, Package&Test

This May, we have witnessed two different approaches to the new High-NA EUV (high-numerical aperture extreme ultraviolet) lithography equipment between semiconductor giants. Intel has secured the first batch of High-NA EUV kits from ASML, which will allegedly be used on its 18A (1.8nm) and 14A (1.4n...

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