IC Manufacturing, Package&Test


2024-03-19

[News] Increasing Pressure on IDM 2.0 May Lead Intel to Delay or Abandon Investment Plans in Italy and France

IC Manufacturing, Package&Test

In 2022, Intel engaged in negotiations with the Italian government, planning to invest USD 5 billion in constructing a packaging and testing facility. This project would also receive subsidies from the Italian government, expected to cover 40% of the construction costs, along with additional subsidi...

2024-03-05

[News] Sony Reportedly Increases CIS Orders at TSMC’s Kumamoto Plant

IC Manufacturing, Package&Test

According to the Economic Daily News, the AI wave is ushering in a demand for updated specifications in CMOS Image Sensors (CIS), with the global CIS leader, Sony Corporation, aggressively positioning itself to take advantage of this trend. As part of the semiconductor industry's move towards locali...

2024-03-05

[News] PSMC Assists Tata in Fab Establishment through Technology Transfer

IC Manufacturing, Package&Test

According to TechNews, Taiwan's semiconductor foundry, PSMC (Powerchip Semiconductor Manufacturing Corporation) recently announced its collaboration with Tata Electronics in India to establish the country’s first 12-inch wafer fabrication plant in Dholera, Gujarat. In an interview on the 4th, Chai...

2024-02-20

[News] AI Market: A Battleground for Tech Giants as Six Major Companies Develop AI Chips

IC Manufacturing, Package&Test

In 2023, "generative AI" was undeniably the hottest term in the tech industry. The launch of the generative application ChatGPT by OpenAI has sparked a frenzy in the market, prompting various tech giants to join the race. As per a report from TechNews, currently, NVIDIA dominates the market by...

2024-02-19

[News] CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers Expand to Seize Opportunities

IC Manufacturing, Package&Test

With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power. Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations and manu...

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