According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 stacks of HBM...

Following the footsteps of PC makers such as Dell and HP, which reportedly aim to reduce the number of components made in China as quickly as possible, a report by technowvoice suggests that American networking giant Cisco is also joining the ranks, as it has now prohibited suppliers from providing ...

Intel has finally secured the USD 7.86 billion in direct funding under the U.S. CHIPS Act a couple of days ago. However, there is a premise: the company would not be allowed to sell its stake in the chipmaking unit at will, according to the latest report from Reuters. The report notes that the de...

Samsung has significantly reduced the amount of photoresist (PR) used during the photolithography process in its 3D NAND flash production, according to a report by The Elec. Citing industry sources, The Elec revealed that the Samsung has halved the volume of PR used in the production of its advan...

Samsung Electronics unveiled its year-end leadership reshuffle on November 27, aiming to drive the company's next phase of growth and bolster its future competitiveness, with a strong focus on the semiconductor business. Jeon Young-hyun, who was appointed head of the Device Solutions (DS) divisio...