The competition for dominance in 2nm semiconductor technology has intensified at the beginning of 2024, marking a crucial battleground among global foundry companies. As per a report from IJIWEI, major foundry enterprises such as Samsung Electronics, TSMC, and Intel are set to commence mass produ...

The U.S. Department of Commerce has initiated the "National Advanced Packaging Manufacturing Program (NAPMP) ," with materials and substrates being the first subsidized areas. Due to the close collaboration between IC testing and IC substrates, it is not ruled out that the IC substrate industry coul...

According to the report from TechNews, Intel CEO Pat Gelsinger, speaking at the World Economic Forum, stated that export sanctions from the United States, Japan, and the Netherlands are temporarily limiting China's development in semiconductor processes below 7 nanometers. Despite China's ongoing...

TSMC announced during its briefing on the 18th that, due to robust demand in the 2-nanometer market, it plans to add another fab to the initially planned two fabs in Kaohsiung. The company intends to use the 2-nanometer process for all three fabs in Kaohsiung, in addition to the originally planne...

TSMC Chairman Mark Liu discussed TSMC's global expansion during earnings conference yesterday, stating that progress in the construction of TSMC's facilities in Japan, the United States, and Germany will proceed according to the original plans. The Kumamoto facility in Japan is set to hold its openi...