IC Manufacturing, Package&Test


2024-01-18

[News] TSMC Earnings Conference: Q1 Revenue Estimated to Drop 6.2%, Expects Over 20% Annual Growth

IC Manufacturing, Package&Test

TSMC reported its Q4 2023 financial results, disclosing consolidated revenue of NT$625.53 billion, net income of NT$238.71 billion, and diluted earnings per share of NT$9.21 (US$1.44 per ADR unit). The figures show a flat year-over-year performance in revenue, with a 19.3% decrease in net income and...

2024-01-18

[News] TSMC’s SoIC Demand Heats Up, Reports Suggest Significant Capacity Expansion

IC Manufacturing, Package&Test

In the surge of AI advancements, a CoWoS expansion wave is rapidly underway, with TSMC showcasing ongoing ambitions in advanced packaging. According to MoneyDJ, recent industry reports suggest that TSMC is revising upward its capacity plans for SoIC (System-on-Integrated-Chips). By the end of thi...

2024-01-18

[News] TSMC’s Next-Gen Memory Breakthrough: Seizing Opportunities in AI and High-Performance Computing

IC Manufacturing, Package&Test

TSMC has achieved a breakthrough in next-generation MRAM memory-related technology, collaborating with the Industrial Technology Research Institute (ITRI) to develop a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip This SOT-MRAM array chip showcases an innovative computing ...

2024-01-18

[News] Price War Among Chinese, Taiwanese, and Korean Foundries? Chinese Foundries Reportedly Cutting Tape Out Prices

IC Manufacturing, Package&Test

China, Taiwan, and South Korea's foundry price war continues to heat up. Rumors of price reductions are circulating in the foundry industry, Chinese foundries allegedly lowering their tape out prices, attracting Taiwanese IC design companies to switch their orders. Companies including Samsung, G...

2024-01-17

[News] Intense Competition with Samsung and Intel in Advanced Processes; TSMC Speeds Up 2nm Progress

IC Manufacturing, Package&Test

The global foundry advanced process battle is reigniting, as reported by the Commercial Times. TSMC's 2-nanometer process at the Baoshan P1 wafer fab in Hsinchu is set to commence equipment installation as early as April, incorporating a new Gate-All-Around (GAA) transistor architecture and aiming f...

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