Dutch semiconductor equipment giant ASML has released its Q3 2023 financial report, showing a significant decline in orders for the third quarter, far below expectations. This suggests signs of weakened demand for ASML’s chip manufacturing equipment in the semiconductor industry during a lackluster economic climate. In its financial statement on the 18th, ASML revealed that the total value of orders received in the third quarter from July to September decreased by 42% compared to the previous quarter, amounting to 2.6 billion euros (approximately 2.8 billion USD). In contrast, analysts surveyed by Bloomberg had estimated an average order value of 4.5 billion euros.

ASML is the sole manufacturer of the cutting-edge semiconductor lithography equipment required for semiconductor production. Earlier this year, they experienced significant revenue growth as Chinese semiconductor firms rushed to place substantial orders before the U.S. export control measures came into effect.

During the video interview when announcing the financial results, ASML’s CFO Roger Dassen, stated that the overall economic situation has not improved,” There’s still pockets of inflation. We still see interest rates at pretty elevated levels. We still see GDP growth in some economies that is not where people expected that to be. Then I think there are quite some geopolitical tensions.”

ASML’s Q3: China Sales at 46% with Mature Process Clients

China accounted for 46% of ASML’s Q3 sales, higher than 24% in the second quarter and 8% in the first quarter. Taiwan accounted for 24% of sales, while South Korea accounted for 20%. As ASML’s CFO, Roger Dasse explained, the sales in China were notably high due to shipments serving mid-critical and mature nodes based on earlier purchase orders. Shifts in demand timing from other customers have raised our Chinese customers’ order-fill rate, resulting in increased sales in China. All shipments complied with export regulations.

In terms of equipment type sales in the third quarter, ASML sold a total of 105 new lithography machines, including 7 second-hand machines, categorized by product type as follows: 11 EUV machines, 32 ArFi (immersion DUV lithography machines), 9 ArF dry (dry DUV lithography machines), 44 KrF machines, and 16 I-Line machines.

Regarding terminal applications, lithography machines for manufacturing logic chips represented 76% of sales, while those for manufacturing memory chips accounted for 24% of sales. In terms of revenue, ArFi immersion lithography machines accounted for a substantial 48%, with EUV lithography machines at 35%.

“Our Chinese customers say: We are happy to take the machines that others don’t want,” Peter Wennink, ASML’s CEO said. “Because their fabs are ready. They can take the tools.”.

U.S. Export Rules Impact on ASML’s 1980Di Tool and Sales

ASML is targeted by U.S. efforts to curb the export of advanced technology to China. Earlier this year, the Biden administration convinced the Dutch government not to allow ASML to ship some immersion DUV equipment to China without a permit. These Dutch restrictions are scheduled to take effect on January 1st of the following year. Currently, ASML has already been prohibited from selling its most advanced EUV machines to China.

During the press conference after the financial report, Peter Wennink mentioned that despite the expanded export control lists implemented by the U.S. and Dutch governments, he expects strong demand from Chinese semiconductor manufacturers. Additionally, another ASML product not covered by the Dutch export permit rules for this year, the 1980Di deep ultraviolet exposure machine (DUV), has now been restricted according to the new export regulations announced by the U.S. on the 17th of the month.

1980Di is used to assist in the production of relatively advanced computer chips, as well as mid-range and older chips. Wennink stated, “In principle, the 1980 series will be subject to export control regulations, but only when… (they are) used in advanced semiconductor manufacturing.” He also mentioned that only a few Chinese semiconductor factories are considered “advanced.”

ASML anticipates steady operations in 2024

According to a report by Money DJ, ASML also announced its financial forecast for the fourth quarter of 2023, estimating net sales of approximately 6.7 billion to 7.1 billion euros, with a gross margin ranging from 50% to 51%. Research and development costs are estimated at around 1.03 billion euros, while selling and administrative expenses (SG&A) are estimated at 285 million euros. ASML confirms that, as previously anticipated, 2023 has seen robust growth, with a projected increase in net sales approaching 30% and a slight improvement in gross margin, compared to 2022.

ASML stated that the semiconductor industry is currently experiencing a cyclical downturn, with customers anticipating a turnaround in demand by the end of the year. Since customers remain uncertain about the strength and pace of the industry demand recovery, 2024 is expected to be a transitional year. The company is adopting a more conservative estimate, with 2024 revenue expected to be similar to 2023. Preparations are being made for significant growth in 2025.

Explore more:

• New Sanctions to Slash China’s Demand for High-End AI Servers to a Mere 3–4% in 2023, Says TrendForce
• [News] Huawei May Emerge as a Winner as the U.S. Tightens Export Restrictions
• [News] China’s Related Companies Brace by Stockpiling Due to New U.S. Chip Ban

(Image: ASML)

The United States has elevated its efforts to curtail the advancement of high-end chips in China. As reported by the CLS News, various companies within China have indicated they received advance notifications and have already amassed chip stockpiles. Analysts suggest that this new wave of bans implies a further restriction by the U.S. on China’s computational capabilities, making the development of domestically-manufactured GPUs in China a matter of utmost importance.

According to the latest regulations, chips, including Nvidia’s A800 and H800, will be impacted by the export ban to China. An insider from a Chinese server company revealed they received the ban notice at the beginning of October and have already stockpiled a sufficient quantity. Nevertheless, they anticipate substantial pressure in the near future. The procurement manager for a downstream customer of Inspur noted that they had proactively shared this information and urged potential buyers to act promptly if they require related products.

Larger companies like Tencent and Baidu are less affected by the ban due to their ample stockpiles. On October 17th, HiRain Technologies announced that its subsidiary had purchased 75 units of H800 and 22 units of A800 from supplier A and had resolved this issue two weeks ago.

(Image: NVIDIA)

The U.S. government tightened its control over exports of advanced computing and semiconductor manufacturing products to China on October 17th. The Entity List now includes more Chinese companies, including two prominent Chinese GPU manufacturers, Biren Technology and Moore Threads. These new restrictions further limit the export of Nvidia A800 and H800 chips.

The new regulations also block chips transferring to China through third-party countries, broadening the export restrictions to include Chinese overseas subsidiaries companies and additional 21 countries.

As reported from TechNews, Nomura Securities are unsurprising to Biren Technology and Moore Threads’ addition to the Entity List. These two chip makers primarily rely on TSMC as their main partner. Due to their limited production capacity, the influence on TSMC is anticipated to be minimal.

Since the U.S. initiated export controls on AI chips in October last year, operations of Biren Technology have continuously been affected. This new development is anticipated to have a relatively limited impact on the Chinese IC design market.

However, the import of ASML’s 1980i DUV model into China may be restricted without U.S. approval. Nomura Securities believe that this could negatively affect the Chinese semiconductor market, potentially causing delays in the expansion plans for 28nm production capacity for some Chinese semiconductor companies. These companies will also likely continue to postpone the purchase of domestic equipment.

Since the import of Nvidia A800, H800, and L40S into China might not be allowed, Nomura Securities consider this unfavorable news for the market. Nvidia may soon introduce new versions to comply with the new regulations. In this scenario, Huawei, with its capacity to design and manufacture advanced chips within China, may ultimately emerge as the most significant beneficiary in the Chinese market, as most Chinese GPU companies are already under sanctions.

The updated U.S. export restrictions also imply that more foreign manufacturers of AI chips will need to adjust their product specifications to meet the new requirements.

Explore more 

• Biden Tightens Export Restrictions to China, Nvidia’s Chips Impacted Most

(Image: Flickr)

According to TechNews on October 18th, The Biden administration has once again tightened restrictions on chip exports to China, and this includes Nvidia’s advanced AI chips.

In a recent press release, the U.S. government announced a renewed restrictions on exports of advanced computing and semiconductor manufacturing products to China. Notably, this includes Nvidia’s cutting-edge AI chips, which will be impacted and could potentially face restrictions on sales to China. The motive behind this action by the Biden administration is to prevent China from bolstering its military capabilities by accessing advanced U.S. technology.

Apart from Nvidia, chip products from industry giants like Intel and AMD might also encounter hurdles in their journey to China. In addition to the actual chips, products from semiconductor equipment manufacturers such as Lam Research, KLA, and Applied Materials may also face increased limitations when destined for China.

These new restrictions, as revealed by the U.S. government, are even more stringent than previous limitations on chip exports. Nvidia’s A800 and H800 chips are among those falling under these tightened restrictions. As a direct consequence, Nvidia’s stock price took a sharp dip, decreasing by nearly 5% on Tuesday.

Following the recent U.S. government ban, Nvidia’s spokesperson, Ken Brown, promptly assured that the company strictly adheres to all relevant regulations. Nvidia is committed to supporting a wide array of products across diverse industries. Given the global demand for Nvidia’s offerings, it’s anticipated that these restrictions will have no immediate, substantial impact on Nvidia’s financial performance.

In a bid to curtail China’s potential access to U.S. chips through third-party channels, these limitations now extend to include the overseas subsidiaries of Chinese firms. Furthermore, the updated regulations expand the list of countries subject to additional export license requirements for advanced chips to over 40 more nations. This expansion is driven by the concern that these countries might transfer chips to China and their presence on the U.S. arms embargo list.

Notably, the interim final rule revises ECCN 3A090 and 4A090 and enforces extra licensing prerequisites for exports to China and the D1, D4, and D5 country groups. These groups include nations like Saudi Arabia, the United Arab Emirates, and Vietnam, though Israel remains excluded.

To safeguard against China’s potential acquisition of U.S. chips through alternative routes, these restrictions have been extended to encompass overseas subsidiaries of Chinese corporations and involve 21 other countries.

However, reports from foreign media indicating that this new U.S. regulation will exempt certain consumer chips used in laptops, smartphones, and gaming consoles. Nonetheless, some chips may still necessitate prior notification and licensing from the U.S. government to be exported.

It’s noteworthy that the U.S. government’s list of newly restricted entities includes two prominent local GPU companies, Moore Thread Technology and Biren Technology. Following the U.S. ban, both firms promptly issued statements of strong protest.

Moore Thread expressed their strong objection, saying, “We are deeply concerned about the inclusion of Moore Thread in the Entity List by the U.S. Department of Commerce. Our company is actively engaging with various stakeholders, and we are assessing the impact of this development.”

Biren Technology also issued a statement, stating, “We vehemently oppose the U.S. Department of Commerce’s actions and will proactively appeal to relevant U.S. government departments, urging them to reconsider their stance.”
(Image: Nvidia)

(Data: US BIS)

Driven by emerging technologies like AI and high-performance computing, the semiconductor foundry industry increasingly emphasizes the importance of advanced manufacturing processes. Recently, the industry has seen significant developments. Intel announced that it has commenced large-scale production of its Intel 4 process node, while TSMC and Samsung are equally committed to advancing their advanced process technologies.

Intel’s Mass Production of Intel 4 Process Node

On October 15th, Intel China’s official public account revealed that Intel has initiated large-scale production of the Intel 4 process node using Extreme Ultraviolet Lithography (EUV) technology. According to Intel, they are making significant progress with their “Four Years, Five Nodes” plan. This plan aims to produce next-generation products that meet the computational demands driven by AI’s role in the “Siliconomy.”

Being the first process node produced by Intel using EUV lithography technology, Intel 4 offers substantial improvements in performance, efficiency, and transistor density compared to its predecessors. Intel 4 was unveiled at the Intel Innovation 2023 held in September this year.

In comparison to Intel 7, Intel 4 achieves a 2x reduction in area, providing high-performance computing (HPC) logic libraries and incorporating various innovative features.

In detail, Intel 4 simplifies the EUV lithography process, optimizing it for high-performance computing applications, supporting both low voltage (<0.65V) and high voltage (>1.1V) operations. Compared to Intel 7, Intel 4 boasts more than a 20% improvement in iso-power performance, and high-density Metal-Insulator-Metal (MIM) capacitors deliver outstanding power supply performance.

Intel 7 and Intel 4 are currently in large-scale production. Intel 3 is on track to meet its planned target by the end of 2023.

Intel’s Intel 20A and Intel 18A, which use Ribbon FET all-around gate transistors and PowerVia backside power delivery technology, are also progressing well, with a target of 2024. Intel will soon introduce the Intel 18A process design kit (PDK) for Intel Foundry Services (IFS) customers.

With the adoption of Intel 4 process nodes, the Intel Core i9 Ultra processor, codenamed “Meteor Lake,” will be released on December 14th this year, ushering in the AIPC era.

On Intel 3 process nodes, the energy-efficient E-core Sierra Forest processor will be launched in the first half of 2024, and the high-performance P-core Granite Rapids processor will follow closely.

Samsung’s 2nm Process Detailed Production Plan

Samsung has already commenced production of its second-generation 3nm chips and plans to continue focusing on 2nm chips.

On June 28th, Samsung Electronics unveiled its latest foundry technology innovations and business strategies at the 7th Samsung Foundry Forum (SFF) in 2023.

In the era of artificial intelligence, Samsung’s foundry program, based on advanced GAA process technology, offers robust support for customers in AI applications. To this end, Samsung has disclosed a detailed production plan and performance levels for its 2nm process. The plan is to achieve mass production for mobile applications by 2025 and respectively expand to HPC and automotive electronics in 2026 and 2027.

Samsung reports that the 2nm process (SF2) improves performance by 12% compared to the 3nm process (SF3), increases efficiency by 25%, and reduces the area by 5%.

Furthermore, reports indicated that Samsung is ensuring the production capacity for products using the next-generation EUV lithography machine, High-NA, in September. This equipment is expected to have a prototype by the end of this year and officially enter production next year.

TSMC’s Mass Production of 2nm by 2025

This year, TSMC has unveiled its latest advanced semiconductor manufacturing roadmap in various locations, including Santa Clara, California, and Taiwan. The roadmap covers a range of processes from 3nm to 2nm.

TSMC’s current roadmap for 3nm includes N3, N3E, N3P, N3X, and N3 AE, with N3 serving as the foundational version, N3E as an enhanced version with further cost optimization, N3P focusing on improved performance with a planned start in the second half of 2024, N3X targeting high-performance computing devices with a mass production goal in 2025, and N3 AE designed specifically for the automotive sector, offering greater reliability and the potential to shorten time-to-market by 2-3 years.

In the 2nm realm, TSMC is planning to achieve mass production of the N2 process by 2025. TSMC has reported that the N2 process will offer a 15% speed improvement over N3E at the same power or a 30% reduction in power consumption, with a 15% increase in transistor density. In September, media reports revealed that TSMC has formed a task force to accelerate 2nm pilot production and mass production, aiming for risk production next year and official mass production in 2025.

To ensure the smooth development of 2nm process technology, TSMC has initiated efforts in the upstream equipment sector. On September 12th, TSMC announced the acquisition of a 10% stake in IMS Nanofabrication, a subsidiary of Intel, for a price not exceeding $432.8 million. IMS specializes in the research and production of electron beam lithography machines, which find extensive applications in semiconductor manufacturing, optical component manufacturing, MEMS manufacturing, and more. The industry sees TSMC’s IMS acquisition as vital for developing crucial equipment and meeting the demand for 2nm process commercialization.

(Image: Intel)