IC Manufacturing, Package&Test


2023-10-31

[News] VIS Acquires AUO’s Singapore Plant for Advanced 12-inch Fab on Auto Chip  

IC Manufacturing, Package&Test

According to Economic Daily News, industry insiders said that Vanguard International Semiconductor (VIS) is in talks to acquire land and facilities from AUO's Singapore plant for its first 12-inch fab. The estimated investment for this project is a substantial US$2 billion. VIS is making a strategic...

2023-10-30

[News] TSMC’s Kumamoto Plant Prepares for 2024 Mass Production with 1000+ Employees, Followed by Taiwanese Material Suppliers’ Collaboration

IC Manufacturing, Package&Test

TSMC's new plant in Kumamoto, Japan, is bustling. With more than a thousand employees hard at work, it is on track to commence mass production in 2024. This venture signifies TSMC's commitment to meet customer demands and navigate geopolitical challenges by expanding its overseas production capabili...

2023-10-30

Exploring the Significance of 3D-SOC and 3D-IC in Cutting-Edge 3D Advanced Packaging

IC Manufacturing, Package&Test

As semiconductor manufacturing processes evolve more gradually, 3D packaging emerges as an effective means of prolonging Moore's Law and enhancing the computational prowess of ICs. Within the realm of 3D stacking technology, the Interuniversity Microelectronics Centre (imec) based in Belgium categor...

2023-10-27

[News] Progress and Adoption of Advanced Processes by Samsung, Intel, and TSMC

IC Manufacturing, Package&Test

In recent developments, Samsung Foundry, a subsidiary of Samsung Electronics, has disclosed that it has initiated discussions with major chip clients, gearing up to provide services utilizing 1.4nm and 2nm processes. It's been said that Samsung being ahead in the production of 3nm GAA (gate-all-a...

2023-10-27

[News] ASE Holdings Anticipates Doubling Revenue Share in Advanced Packaging for Next Year

IC Manufacturing, Package&Test

ASE Holdings conducted an earning conference on October 26th to unveil its Q3 financial results and offer insights into future business prospects. All eyes are on ASE's progress in CoWoS advanced packaging. Joseph Tung, the Chief Financial Officer (CFO) of ASE, expressed confidence in AI and ongoing...

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