IC Manufacturing, Package&Test


2023-10-18

[News] Huawei May Emerge as a Winner as the U.S. Tightens Export Restrictions

IC Manufacturing, Package&Test

The U.S. government tightened its control over exports of advanced computing and semiconductor manufacturing products to China on October 17th. The Entity List now includes more Chinese companies, including two prominent Chinese GPU manufacturers, Biren Technology and Moore Threads. These new restri...

2023-10-18

[News] Biden Tightens Export Restrictions to China, Nvidia’s Chips Impacted Most

IC Manufacturing, Package&Test

According to TechNews on October 18th, The Biden administration has once again tightened restrictions on chip exports to China, and this includes Nvidia's advanced AI chips. In a recent press release, the U.S. government announced a renewed restrictions on exports of advanced computing and semi...

2023-10-18

[News] Intel, Samsung, TSMC Race in Cutting-Edge Processes

IC Manufacturing, Package&Test

Driven by emerging technologies like AI and high-performance computing, the semiconductor foundry industry increasingly emphasizes the importance of advanced manufacturing processes. Recently, the industry has seen significant developments. Intel announced that it has commenced large-scale productio...

2023-10-17

[News] Rumored U.S. Tightens Export Ban on Chips to China, Affecting Chinese Chip Design Firms

IC Manufacturing, Package&Test

Reports indicate that the United States is poised to unveil an updated set of restrictions on chip exports to China this week. Beyond the previously reported tightening measures on AI chips and equipment exports, these new regulations are expected to restrict the supply to chip design companies. The...

2023-10-17

[News] TSMC Expected to Lower Capital Expenditure, Potentially Falling Below $30 Billion for the Year

IC Manufacturing, Package&Test

As TSMC's earnings call approaches, the market is abuzz with rumors that the company may revise down its capital expenditure target for this year. This potential adjustment is believed to be driven by delays in Intel's 3-nanometer outsourcing and the deferral of the production schedule for TSMC's 4-...

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