IC Manufacturing, Package&Test


2023-10-09

Differences Between 3D-SIP and 3D-SIC: Why Are TSMC, Intel, and Samsung All Actively Involved?

IC Manufacturing, Package&Test

As semiconductor fabrication technologies continue to advance, the number of transistors in integrated circuits (ICs) has steadily increased. Initially, ICs contained only tens of transistors, but as technology progressed, ICs integrating hundreds of thousands of transistors enabled the realization ...

2023-10-04

[News] ASE Unveils IDE, Intensifies Advance Packaging Pursuit with 50% Shorter Cycles

IC Manufacturing, Package&Test

Advanced Semiconductor Engineering, Inc. (ASE) has unveiled its Integrated Design Ecosystem™ (IDE) – a collaborative design toolkit, meticulously tailored to enhance advanced package architecture on the VIPack™ platform. This innovation streamlines the transition from single-die SoC to multi-d...

2023-10-04

[News] TSMC Kumamoto Plant Rumored to Install Equipment in October, Possibly Starting Production Early

IC Manufacturing, Package&Test

According to a report by China's media outlet Jiwei, Japanese officials recently released a photo of a meeting with Chairman Mark Liu of TSMC. Japan's Minister of Economy, Trade, and Industry, Yasutoshi Nishimura, updated his personal X account on the 1st of the month and posted a photo of the meeti...

2023-10-03

[News] TSMC Holds Earnings Conference on the 19th, Market Focuses on Six Key Areas

IC Manufacturing, Package&Test

According to a report by Taiwan's Economic Daily, TSMC is set to hold its Q3 earnings conference on October 19th. The market is eagerly anticipating insights from the company's top executives on six key areas: the latest semiconductor market outlook, Q3 financial forecasts, the status of 3-nanometer...

2023-10-02

[News] SMIC Places Two Years’ Worth of Orders with Taiwanese Supply Chain, Urges Swift Delivery

IC Manufacturing, Package&Test

According to Taiwan's Economic Daily, after disassembling Huawei's Mate 60 Pro smartphone, it has been revealed that the chips, including the Kirin 9000S, are produced by China's semiconductor foundry, SMIC, using their advanced 7-nanometer process. This development has brought attention to SMIC's m...

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