IC Manufacturing, Package&Test


2023-09-28

[News] Samsung’s 8-Inch Factory Halts 30% of Machines, Expected to Restart by Year-End

IC Manufacturing, Package&Test

According to a report by Taiwan's TechNews, Samsung Electronics' semiconductor foundry division, Samsung Foundry, has been operating at less than 50% utilization rate as of the second quarter due to weak demand for 8-inch wafer foundry services. Industry sources have revealed that Samsung Foundry ha...

2023-09-26

[News] TSMC’s 3nm Wins Big Qualcomm 5G Deal, Outshines Samsung, Intel

IC Manufacturing, Package&Test

According to a report from Taiwan's Economic Daily, TSMC's 3-nanometer technology has attracted another heavyweight client. Following Apple and MediaTek, it is rumored that Qualcomm will also commission TSMC to produce its next-generation 5G flagship chip using the 3-nanometer process. The chip is e...

2023-09-25

[News] TSMC Deploys Manpower to Support Longtan and Tainan Facilities Amid CoWoS and 3nm Demand

IC Manufacturing, Package&Test

According to Taiwan's Money DJ, the AI wave is showing no signs of slowing down. Led by NVIDIA, major players including AMD, Intel, and international chip giants are aggressively entering the AI arena, driving increasing demand for advanced packaging and advanced processes. Industry reports suggest ...

2023-09-25

[News] TSMC’s 3nm Capacity Hits 100,000 Wafers Next Year, Driven by New Projects

IC Manufacturing, Package&Test

According to a report by Taiwan's Money DJ, there's good news from TSMC regarding its 3nm node. Sources within the supply chain have disclosed that the number of new chip designs using the 3nm process, known as "New Tape-Outs" (NTOs), has surged. It's confirmed that customers including MediaTek, AMD...

2023-09-25

[News] UMC and ASE Weigh Price Increases in Booming Advanced Packaging Market

IC Manufacturing, Package&Test

According to a report by Taiwan's Economic Daily, TSMC is aggressively expanding its advanced packaging capacity. Recently, they placed an additional 30% order for equipment with manufacturers, leading to a doubling of order volumes for companies in the interposer supply chain, such as UMC and ASE G...

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