IC Manufacturing, Package&Test


2023-10-13

[News] TSMC’s Investor Meeting on the 19th with Market’s Attention on Five Key Topics

IC Manufacturing, Package&Test

TSMC is set to conduct an investor meeting on the 19th, with Morgan Stanley, UBS, and Bank of America Securities releasing their latest reports ahead of the event. These reports highlight five main areas of interest: 1. Q4 Operational Outlook 2. Future Gross Margin Trends 3. Potential Adjustmen...

2023-10-12

[News] Advanced Packaging in High Demand, TSMC and OAST Increasing Equipment Orders

IC Manufacturing, Package&Test

As AI demand continues to surge, TSMC (Taiwan Semiconductor Manufacturing Company) has initiated an extensive expansion plan for its CoWoS (Chip-on-Wafer-on-Substrate) production. Within the industry, reports suggest that TSMC, a leading semiconductor foundry, placed a significant wave of orders wit...

2023-10-10

[Report Highlights] China’s EDA Industry Enters a Period of Consolidation amidst Rapid Growth

IC Manufacturing, Package&Test

China's EDA Industry into Fast Development with Efforts of Downstream Industries, Capital and Policies Propel Within the broader context of China's push for semiconductor self-sufficiency in recent years, the domestic EDA (Electronic Design Automation) industry in China has undergone remarkable g...

2023-10-09

Differences Between 3D-SIP and 3D-SIC: Why Are TSMC, Intel, and Samsung All Actively Involved?

IC Manufacturing, Package&Test

As semiconductor fabrication technologies continue to advance, the number of transistors in integrated circuits (ICs) has steadily increased. Initially, ICs contained only tens of transistors, but as technology progressed, ICs integrating hundreds of thousands of transistors enabled the realization ...

2023-10-04

[News] ASE Unveils IDE, Intensifies Advance Packaging Pursuit with 50% Shorter Cycles

IC Manufacturing, Package&Test

Advanced Semiconductor Engineering, Inc. (ASE) has unveiled its Integrated Design Ecosystem™ (IDE) – a collaborative design toolkit, meticulously tailored to enhance advanced package architecture on the VIPack™ platform. This innovation streamlines the transition from single-die SoC to multi-d...

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