IC Manufacturing, Package&Test


2023-08-29

[News] CoWoS Demand Surges: TSMC Raises Urgent Orders by 20%, Non-TSMC Suppliers Benefit

IC Manufacturing, Package&Test

According to a report from Taiwan's TechNews, NVIDIA has delivered impressive results in its latest financial report, coupled with an optimistic outlook for its financial projections. This demonstrates that the demand for AI remains robust for the coming quarters. Currently, NVIDIA's H100 and A100 c...

2023-08-28

[News] NVIDIA’s Financial Forecast Stands Out, Yet Short-Term Semiconductor Market Weakness Remains

IC Manufacturing, Package&Test

NVIDIA Beats Expectations with Q2 Financial Results and Optimistic Q3 Outlook, But Overall Semiconductor Short-Term Prospects Remain Weak, According to Taiwan's Central News Agency. While the semiconductor industry remains subdued, NVIDIA stands out with robust operational performance and a posit...

2023-08-25

TrendForce Dives into NVIDIA’s Product Positioning and Supply Chain Shifts Post Earnings Release

IC Manufacturing, Package&Test

NVIDIA’s latest financial report for FY2Q24 reveals that its data center business reached US$10.32 billion—a QoQ growth of 141% and YoY increase of 171%. The company remains optimistic about its future growth. TrendForce believes that the primary driver behind NVIDIA’s robust revenue growth st...

2023-08-25

[News] NVIDIA Establishes Non-TSMC CoWoS Supply Chain, UMC Doubles Interposer Capacity

IC Manufacturing, Package&Test

According to a report from Taiwan's Commercial Times, NVIDIA is aggressively establishing a non-TSMC CoWoS supply chain. Sources in the supply chain reveal that UMC is proactively expanding silicon interposer capacity, doubling it in advance, and now planning to further increase production by over t...

2023-08-23

[News] TSMC Faces Capacity Shortage, Samsung May Provide Advanced Packaging and HBM Services to AMD

IC Manufacturing, Package&Test

According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

  • Page 71
  • 79 page(s)
  • 395 result(s)

Get in touch with us