IC Manufacturing, Package&Test


2023-08-21

[News] IC Design Chip Tape-Out Expected to Rebound at the Earliest Next Year

IC Manufacturing, Package&Test

According to Taiwan's Economic Daily, the consumer market is experiencing starkly low demand, causing IC design firms primarily relying on mature processes, such as those in driver ICs, power management ICs, CMOS image sensors (CIS), and microcontrollers (MCUs), to adopt a notably cautious approach ...

2023-08-21

[News] Speculations of TSMC Considering Third Fiscal Forecast Downgrade

IC Manufacturing, Package&Test

According to Taiwan's Commercial Times, TSMC continues to face challenges from ongoing price undercutting and competitive bidding in mature semiconductor manufacturing processes. Concerns arise about the company's ability to offset these challenges with AI-related orders. Reports from the market sug...

2023-08-17

Weak Demand Pressures TSMC, Samsung, Dongbu HiTek 8-inch Foundry Prices

IC Manufacturing, Package&Test

In recent market speculations, TSMC is rumored to have reduced its 8-inch wafer manufacturing quotes by as much as 30%, with subsequent reports suggesting that South Korean wafer foundries are following suit in lowering 8-inch wafer production prices. According to TrendForce's channel check, TSMC...

2023-08-17

[News] TSMC’s N3 and N4P Processes to Power Apple, Qualcomm, and MediaTek Chips

IC Manufacturing, Package&Test

According to a report by Taiwan's Commercial Times, global smartphone brands are set to introduce a series of flagship-level new products. Following the introduction of Apple's A17 chip using TSMC's 3-nanometer process, Qualcomm's next-generation processor Snapdragon 8 Gen 3 and MediaTek's Dimensity...

2023-08-16

Intel Cancels Tower Semiconductor Deal: TrendForce Analyzes Impact on Competitive Foundry Landscap

IC Manufacturing, Package&Test

Intel Corporation today announced that it has mutually agreed with Tower Semiconductor to terminate its previously disclosed agreement  to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022. In accordance...

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