IC Manufacturing, Package&Test


2021-09-15

Revenue of Top 10 IC Design (Fabless) Companies Reaches US$29.8 Billion for 2Q21, Though Growth May Potentially Slow in 2H21, Says TrendForce

IC Manufacturing, Package&Test

In view of the ongoing production capacity shortage in the semiconductor industry and the resultant price hike of chips, revenue of the top 10 IC design companies for 2Q21 reached US$29.8 billion, a 60.8% YoY increase, according to TrendForce's latest investigations. In particular, Taiwanese compa...

2021-09-11

Chipbond and UMC will likely strengthen their product R&D and market penetration via strategic partnership

IC Manufacturing, Package&Test

Leading driver IC OSAT company Chipbond and major foundry UMC announced on September 3 that the two companies established a strategic partnership via a stock swap, through which UMC (and its subsidiary UMC Capital) will hold 9.09% of Chipbond’s equity, while Chipbond will hold 0.62% of UMC’s equ...

2021-08-24

Analog IC Revenue for 2021 Projected to Reach US$67.9 Billion Due to Strong Demand from End Markets

IC Manufacturing, Package&Test

The analog IC industry is one with a long history of development and product adoption across various applications. Annual analog IC revenue reached US$53.9 billion in 2020. As the spread of the COVID-19 pandemic is gradually brought under control in China and the US this year, their domestic demand ...

2021-07-13

An Overview of IC Design and Equipment Suppliers Funded by China’s Big Fund Phase Two

IC Manufacturing, Package&Test

TrendForce’s latest investigations indicate that China has recently announced two additional investments funded via phase two of the CICF (China Integrated Circuit Industry Investment Fund, better known as the “Big Fund”). The first of these investments was announced on June 8, 2021 and totale...

2021-06-25

An Overview of China’s Third-Generation Semiconductor Industry in a Global Context

IC Manufacturing, Package&Test

Some of the advantages of third-generation semiconductors SiC and GaN include their ability to operate under high voltages, high temperatures (for SiC), and high frequencies(for GaN). Not only do these advantages allow manufacturers to significantly reduce the physical sizes of chips, but pe...

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