IC Manufacturing, Package&Test


2021-06-16

An Overview of the Most Competitive Domestic Equipment Substitutes as China Ramps up Its Semiconductor Independence Efforts

IC Manufacturing, Package&Test

In recent years, China has been aggressively pursuing the build-out of an independent semiconductor supply chain as it attempts to eschew dependence on foreign suppliers. The key to China’s success is whether it can establish domestic suppliers of semiconductor equipment. Looking at the current...

2021-06-08

How Will the COVID-19 Outbreak in KYEC Facilities Affect the Taiwanese Semiconductor Industry?

IC Manufacturing, Package&Test

As infections among employees from semiconductor backend testing leader KYEC make news headlines, the company suspended operations for two days and undertook facility-wide disinfections starting on June 4, although at the moment KYEC’s facility has yet to resume operations at full capacity. In the...

2021-01-13

TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce

IC Manufacturing, Package&Test

Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H...

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