To strengthen its semiconductor supply chain, the Chinese government is reportedly requiring domestic automakers, including BYD, to expand their procurement of locally-produced chips. The goal is to increase the proportion of domestically-sourced automotive chips to 25% by 2025.

According to a report from Nikkei on May 16th, the Chinese government has instructed major local automakers to increase the proportion of domestically-produced automotive chips they procure to 25% by 2025 from 10% currently. The Chinese authorities hope that by raising the procurement ratio of Chinese-made chips, they can accelerate the pace of independence for the country’s semiconductor supply chain.

As per the same report, the Chinese Ministry of Industry and Information Technology (MIIT), which is responsible for national automotive industry policy, has asked major Chinese automakers to increase the local procurement ratio of automotive chips to 20-25%. This request targets not only the major electric vehicle manufacturer BYD but also SAIC Motor, Dongfeng Motor, GAC Motor, and FAW Group.

However, this requirement is not mandatory; instead, it encourages automakers to expand their procurement of local chips through incentives. An industry source cited by the same report revealed that ultimately, the goal is for all automotive chips to be locally sourced.

The report further indicates that though the conflict between China and the U.S. in the semiconductor sector continues to intensify, manufacturing technologies used for automotive chips are usually not the most advanced, and therefore not subject to U.S. export controls.

This means that Chinese semiconductor manufacturers will be able to procure manufacturing equipment from overseas, bolstering their automotive chip businesses.

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TSMC reportedly plans to utilize 12nm and 5nm process nodes in manufacturing the latest HBM4 memory, according to a report by AnandTech. Citing TSMC’s executives, the world’s largest dedicated semiconductor foundry would employ two fabrication processes, N12FFC+ and N5, to integrate HBM4e memory with next-generation AI and HPC processors.

During TSMC’s presentation at its European Technology Symposium 2024, which took place on May 14th, the company revealed new details about the base dies it will produce for HBM4 using advanced logic processes.

According to a senior director of design and technology platform citing by the report, TSMC is currently working with HBM memory partners, including Micron, Samsung and SK Hynix, on advanced nodes targeting HBM4.

Earlier in mid-April, SK Hynix announced that it has signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, slated to be mass produced from 2026, through this initiative.

N12FFC+, believed to be more cost-effective, is expected to achieve HBM performance, while the N5 base die could offer more logic with significantly lower power.

In the symposium, TSMC stated that its 12FFC+ process is well-suited for HBM4 performance, enabling memory vendors to construct 12-Hi (48 GB) and 16-Hi (64 GB) stacks, with per-stack bandwidth exceeding 2 TB/second. It is also optimizing CoWoS-L and CoWoS-R for HBM4, which utilize over eight layers to support HBM4’s routing of over 2,000 interconnects with proper signal integrity.

These packaging solutions is said to provide interposers that can accommodate up to 8 times the reticle size, providing ample space for as many as 12 HBM4 memory stacks.

In addition, base dies produced with the N5 process will incorporate increased logic density, lower power consumption, and enhanced performance. However, the most significant advantage may lie in the extremely small interconnect pitches achievable with such advanced process technology, ranging from 6 to 9 microns. This capability will enable N5 base dies to be paired with direct bonding, facilitating the 3D stacking of HBM4 directly on top of logic chips. Direct bonding has the potential to significantly enhance memory performance, a crucial enhancement for AI and HPC chips constantly demanding higher memory bandwidth, according to the report.

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According to a report from the Korean media outlet TheElec, South Korea is planning to establish an AI semiconductor innovation center in Silicon Valley.

The Korean Semiconductor Industry Association (KSIA) announced on Wednesday that it would accept applications until May 30th for those interested in residing at the planned center. A committee will review the applicants in June, with the move-in process beginning in August for those who are selected.

This initiative is part of the Ministry of Trade, Industry and Energy’s project to promote system semiconductor technology for export. Launched in April, the project aims to establish research platforms in the US and China. The ministry is collaborating with industry associations like KSIA for this endeavor.

A KSIA spokesperson informed TheElec that the center will provide independent offices for three to four companies and feature a large, open space for additional companies. The center will reportedly offer support for companies’ prototype testing, verification, and other assistance.

The South Korea government has been aggressively working on strengthening the country’s position in the semiconductor industry, as a series of ambitious projects have been announced recently, the AI Chip innovation center in the U.S. being its latest endeavor.

Earlier in May, the South Korean government is said to be planning to introduce a comprehensive chip investment and research support plan, surpassing KRW 10 trillion (roughly USD 7.3 billion) in scale, to enhance its position in the critical semiconductor industry, as per a report from the Economic Daily News.

Meanwhile, the report from South Korean media outlet BusinessKorea stated that on May 2nd, the South Korean Ministry of Trade, Industry, and Energy announced the “Second Strategic Planning and Investment Council,” comprising of representatives from research institutes, universities, etc, approved 62 new R&D projects for 2025, including flagship projects and roadmaps in over 11 domains.

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The global electric vehicle market has begun to show signs of saturation, affecting the battery supply chain. According to a report from Korean media Maeil Business, in response to the downturn in battery demand, South Korea’s SK Group holding company, SK Innovation, intends to sell its subsidiary SK IE Technology (SKIET) to raise funds and strengthen its financial position.

The report cited sources, indicating that SK Innovation is actively seeking investors for capital injection and has begun negotiations. Additionally, the possibility of selling its battery material subsidiary, SKIET, may not be ruled out as a consideration to obtain cash for flexible use, in response to the shrinking appetite in the battery market.

As per a report from MoneyDJ, SK Innovation holds a 61.2% stake in SKIET, valued at KRW 2.5 trillion (approximately USD 1.8 billion).

Industry sources further pointed out that SK Innovation’s decision to sell SKIET is primarily driven by the need for additional funds to expand its electric vehicle battery business under SK On, including the expansion of its battery factories in the United States, according to the aforementioned reports.

Reportedly, SK On anticipates capital expenditures of KRW 7.5 trillion this year. However, the sources believe that whether SK Innovation can find a buyer for SKIET remains to be seen, given SKIET’s poor performance.

SK On’s clients include well-known automakers such as Ford, Volkswagen, and Hyundai. However, in a high-interest-rate environment, global electric vehicle sales have stalled, leading SK On to incur a significant operating loss of KRW 332 billion in the first quarter, far exceeding the KRW 18.6 billion loss in the previous quarter.

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(Photo credit: SK Innovation)

Paul de Bot, President of TSMC Europe, confirmed during a seminar in the Netherlands on May 14th that TSMC will start construction of its first chip plant in Europe in Dresden, eastern Germany. The project is scheduled to commence in the fourth quarter of this year, with production expected to begin in 2027.

Last August, TSMC announced the joint venture factory project in Germany, with a total investment of USD 11 billion. Apart from TSMC, Infineon, NXP, and Bosch each holds a 10% stake.

According to a report from Reuters, Kevin Zhang, Senior Vice President of Business Development and Overseas Operations Office at TSMC, stated that the project has received strong support from the European Union and the German government, thus TSMC is confident in obtaining subsidies under the European Chips Act.

Kevin Zhang stated that the semiconductor ecosystem in Europe is currently exciting, indicating that setting up a foundry in Germany would allow TSMC to directly access its major automotive customers.

It is understood that TSMC’s fab in Germany will initially focus on the 22-nanometer process, mainly producing automotive microcontrollers. There is a possibility of expanding to produce more advanced chips in the future.

In addition, Intel, another semiconductor giant, had also planned a significant investment of EUR 30 billion for constructing two new fabs in Magdeburg, Eastern Germany.

TSMC’s global expansion has reached locations in China, the United States, Japan, and Germany, solidifying its goal of being a “long-term and trustworthy provider of technology and capacity.”

TSMC’s Kumamoto Plant in Japan held its opening ceremony in February, with mass production expected to begin in the fourth quarter. Kevin Zhang also emphasized that TSMC will continue to expand its operations in Japan.

In response to growing customer demand, TSMC announced in February plans to begin construction of its Kumamoto Fab 2 by the end of the year, which will be its second, more advanced fab in Japan, scheduled to start operations by the end of 2027.

In contrast, the construction progress of its Arizona plant in the United States has been relatively slow. Due to the delay in the first phase’s production timeline from the end of 2024 to the first half of 2025, the production schedule for the second phase will also be postponed to start after 2027.

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