Taiwan Semiconductor Manufacturing Company (TSMC) has planned to build two fabs in Kumamoto Prefecture, Japan. Kumamoto’s newly appointed governor, Takashi Kimura, who took office in April, stated in an report from Bloomberg on May 11th that he would spare no effort to persuade TSMC to establish a third fab in the region. He has already proposed a visit to TSMC’s headquarters in Taiwan this summer to discuss related matters, aiming to transform Kumamoto into a semiconductor hub.

TSMC has not responded to this matter. While TSMC’s third fab in Kumamoto, as mentioned by Governor Kimura, has not materialized yet, and TSMC has not officially announced it, Bloomberg previously reported that TSMC is considering building a third fab in Japan, which would also be located in Kumamoto and produce more advanced chips.

Regarding the rumored TSMC Kumamoto Fab 3, Takashi Kimura stated, “We are prepared to give our full support.” He expressed his hope to attract numerous semiconductor-related enterprises and research institutions to Kumamoto, aiming to establish an industrial cluster similar to Taiwan’s Hsinchu Science Park. He also hopes Kumamoto will become a birthplace for various industries stemming from semiconductors, including AI, data centers, and autonomous driving technologies.

Kimura believes that during the preparations for TSMC’s first fab in Kumamoto, the region already possesses better-quality road and water infrastructure and an education system that better supports international school students, which could be advantageous.

TSMC’s Kumamoto Fab 1, a joint investment between TSMC, Sony Semiconductor Solutions Corporation, and Denso Corporation, was inaugurated in February. TSMC stated in an earlier press release that in response to customer demand, construction of the second JASM (TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture) fab is slated to begin by the end of 2024. The expansion of production capacity is also expected to optimize the overall cost structure and supply chain efficiency of JASM, with operations starting by the end of 2027.

In the future, the two fabs under JASM will enable a total monthly production capacity of over 100,000 12-inch wafers, providing 40-nanometer, 22/28-nanometer, 12/16-nanometer, and 6/7-nanometer processes for automotive, industrial, consumer, and high-performance computing (HPC) applications.

Capacity planning may be adjusted according to customer demand, with the Kumamoto fab directly creating a total of over 3,400 high-tech job opportunities. Through the investment, TSMC, Sony Semiconductor, Denso Corporation, and Toyota Motor Corporation hold approximately 86.5%, 6.0%, 5.5%, and 2.0% of the JASM shares, respectively.

The Kyushu Economic Research Association estimates that these fabs will contribute JPY 10.5 trillion (USD 67.4 billion) to the economy of Kumamoto Prefecture over the next decade.

Read more

• [News] Latest Overview on TSMC’s Global Expansion Initiatives
• [News] Rumored to Build Third Plant in Kumamoto, TSMC: Currently Focusing on Assessing the Construction of a Second Plant

(Photo credit: TSMC)

At its 2022 Tech Day, Samsung revealed the target to release advanced NAND chips with over 1000 layers by 2030. According to Wccftech, the South Korean memory giant now seems to get closer to the ambitious goal, as it plans to apply new ferroelectric” materials on the manufacturing of NAND.

At the latest VLSI Technology Symposium held in Honolulu, a doctoral student from the Electrical Engineering Department at the Korea Advanced Institute of Science and Technology (KAIST) shared how “hafnia ferroelectrics” may serve as a key enabler for low voltage & QLC 3D VNAND beyond 1K layer experimental demonstration and modeling, of which the interaction between charge trapping in the metal band and the ferroelectric switching effect could maximize the ‘positive feedback’ of dual effects, enable low operating voltage, a wide range of storage window, and negligible disturbance at a bias voltage of 9 V.

Though Samsung is not directly involved in the R&D process, according to Wccftech, the researchers are said to be directly linked to the company.

The news follows Samsung’s official announcement in April, confirming that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), boasted to improve the bit density by about 50% compared to the 8th-generation V-NAND, with the number of layers reaching 290, according a report by The Korea Economic Daily.

Industry sources cited by the report also revealed that Samsung’s future tenth-generation V-NAND is expected to reach 430 layers, which is scheduled to be released next year. Now the NAND ceiling may be able to hit 1000 layers, if the new ferroelectric materials work out fine.

Before Samsung, major storage giants such as Micron and SK Hynix had already surpassed the 200-layer milestone. Micron reached 232 layers with a storage density of 19.5Gb per square millimeter, while SK Hynix achieved 238 layers with a storage density of 14.4Gb per square millimeter. In early May, South Korea’s media outlet TheElec also revealed that SK Hynix has been exploring the potential of manufacturing 3D NAND at ultra-low temperatures, which may enable the company to produce its new-generation product with over 400 layers, with the help of Tokyo Electron (TEL).

(Photo credit: Samsung)

The South Korean government is said to be planning to introduce a comprehensive chip investment and research support plan, surpassing KRW 10 trillion (roughly USD 7.3 billion) in scale, to enhance its position in the critical semiconductor industry, as per a report from Economic Daily News.

According to a statement released by the South Korean Ministry of Planning and Finance on May 12th, Minister Choi Sang-mok stated during a meeting with local chip material, component, and equipment manufacturers that Seoul authorities are preparing a support scheme exceeding KRW 10 trillion in scale to aid all areas of the chip industry, including fabless semiconductor companies, chip materials, manufacturing equipment, etc., with details of this plan set to be announced shortly.

This plan may involve policy financing from the Korea Development Bank and the establishment of new funds through collaboration between state-owned and private financial institutions.

Given that large corporations like Samsung Electronics and SK Hynix already possess substantial resources, the South Korean government’s plan aims to support investments in small and medium-sized enterprises and in the backend process sector. This support will extend to investments in materials, components, equipment, chip design, and packaging processes to nurture the semiconductor ecosystem evenly.

Previously, South Korea announced the development of a large-scale chip cluster in the southern city of Yongin, with a total investment of USD 470 billion, looking to become the world’s largest semiconductor high-tech park.

As the United States and Japan continue to launch subsidy battles to attract semiconductor manufacturers to their respective countries, South Korea is also preparing a response plan.

The US government previously approved subsidies of up to USD 8.5 billion for US chip giant Intel and USD 6.6 billion for TSMC from CHIPs Act to alleviate future semiconductor supply constraints. The US government also announced on April 15th that it will provide up to USD 6.4 billion in subsidies to South Korean semiconductor giant Samsung Electronics for expanding advanced chip production capacity at its Texas plant.

In comparison, figures submitted by a subcommittee under Japan’s Ministry of Finance’s Fiscal System Council show that Japan will invest JPY 3.9 trillion (approximately USD 25.7 billion) over the next three years, equivalent to 0.71% of its GDP.

Read more

• [News] Samsung Receives USD 6.4 Billion Subsidy from US Government, Less than Intel and TSMC
• [News] Nikkei Highlights Japan’s Chip Subsidies Exceeding GDP Ratio of US, Germany, and France

(Photo credit: Samsung)

As a strategic technology empowering a new round of technological revolution and industrial transformation, AI has become one of the key driving forces for the development of new industrialization. Fueled by the ChatGPT craze, AI and its applications are rapidly gaining traction worldwide. From an industrial perspective, NVIDIA currently holds almost absolute dominance in the AI chip market.

Meanwhile, major tech companies such as Google, Microsoft, and Apple are actively joining the competition, scrambling to seize the opportunity. Meta, Google, Intel, and Apple have launched the latest AI chips in hopes of reducing reliance on companies like NVIDIA. Microsoft and Samsung have also reportedly made investment plans for AI development.

• Microsoft Announced an Investment Plan of over USD 11 Billion

Recently, according to multiple global media reports, Microsoft is developing a new AI mega-model called MAI-1. This model far exceeds some of Microsoft’s previously released open-source models in scale and is expected to rival well-known large models like Google’s Gemini 1.5, Anthropic’s Claude 3, and OpenAI’s GPT-4 in terms of performance. Reports suggest that Microsoft may demonstrate MAI-1 at the upcoming Build developer conference.

In response to the growing demand for AI computing, Microsoft recently announced a plan to invest billions of dollars in building AI infrastructure in Wisconsin. Microsoft stated that this move will create 2,300 construction jobs, and could contribute to up to 2,000 data center jobs when completing construction.

Furthermore, Microsoft will establish a new AI lab at the University of Wisconsin-Milwaukee to provide AI technology training.

Microsoft’s investment plan in the US involves an amount of USD 3.3 billion, which plus its investments previously announced in Japan, Indonesia, Malaysia and Thailand amount to over USD 11 billion in reference to AI-related field.

Microsoft’s recent announcements shows that it plans to invest USD 2.9 billion over the next two years to enhance its cloud computing and AI infrastructure in Japan, USD 1.7 billion within the next four years to expand cloud services and AI in Indonesia, including building data centers, USD 2.2 billion over the next four years in Malaysia in cloud computing and AI, and USD 1 billion to set up the first data center in Thailand, dedicated to providing AI skills training for over 100,000 people.

• Apple Reportedly Developing in-House AI Chip for Data Center

Apple has also unveiled its first AI chip, M4. Apple introduced that the neural engine in M4 chip is the most powerful one the company has ever developed, outstripping any neural processing unit in current AI PCs. Apple further emphasized that it will “break new ground” in generative AI this year, bringing transformative opportunities to users.

According to a report from The Wall Street Journal, Apple has been working on its own chips designed to run AI software on data center servers. Sources cited in the report revealed that the internal codename for the server chip project is ACDC (Apple Chips in Data Center). The report indicates that the ACDC project has been underway for several years, but it’s currently uncertain whether this new chip will be commissioned and when it might hit the market.

Tech journalist Mark Gurman also suggests that Apple will introduce AI capabilities in the cloud this year using its proprietary chips. Gurman’s sources indicate that Apple intends to deploy high-end chips (Similar to those designed for Mac) in cloud computing servers to handle cutting-edge AI tasks on Apple devices. Simpler AI-related functions will continue to be processed directly by chips embedded in iPhone, iPad, and Mac devices.

• Samsung might Start Pilot production for AI Inference Chip Mach-1

As per industry sources cited by South Korean media outlet ZDNet Korea, Samsung Electronics’ AI inference chip, Mach-1, is set to begin prototype production using a multi-project wafer (MPW) approach and is expected to be based on Samsung’s in-house 4nm process.

Previously at a shareholder meeting, Samsung revealed its plan to launch a self-made AI accelerator chip, Mach-1, in early 2025. As a critical step in Samsung’s AI development strategy, Mach-1 chip is an AI inference accelerator built on application-specific integrated circuit (ASIC) design and equipped with LPDDR memory, making it particularly suitable for edge computing applications.

Kyung Kye-hyun, head of Samsung Electronics’ DS (Semiconductor) division, stated that the development goal of this chip is to reduce the data bottleneck between off-chip memory and computing chips to 1/8 through algorithms, while also achieving an eight-fold improvement in efficiency. He noted that Mach-1 chip design has gained the verification of field-programmable gate array (FPGA) technology and is currently in the physical implementation stage of system-on-chip (SoC), which is expected to be ready in late 2024, with a Mach-1 chip-driven AI system to be launched in early 2025.

In addition to developing AI chip Mach-1, Samsung has established a dedicated research lab in Silicon Valley focusing on general artificial intelligence (AGI) research. The intention is to develop new processors and memory technologies capable of meeting future AGI system processing requirements.

Read more

• [News] Microsoft to Build AI Data Center at Former Foxconn Planned Panel Plant Site in Wisconsin
• [News] Apple Allegedly Developing AI Processor for Data Centers, with TSMC as Its Foundry Partner

(Photo credit: Pixabay)

As per a report from Reuters, US Commerce Secretary Raimondo stated on May 8th that the need for the government to take the threat posed by China-produced connected cars more seriously, suggesting potential “extreme action” to restrict or prohibit the import of such vehicles to prevent the leakage of data belonging to US citizens.

Regarding the national security risk investigation launched by Washington earlier this year into Chinese automobiles, Raimondo expressed concerns that Chinese connected vehicles could collect a vast amount of data about Americans, including who they are, what they say in their car, where they go to, as well as their patterns of driving.

Per Reuters, the US administration initiated a review in February this year on whether the import of Chinese automobiles poses a national security risk. Raimondo stated on May 8th that the Department of Commerce is reviewing the public’s comments on this review submitted before April 30th.

Read more

• [News] U.S. Imposes Further Sanctions, Revoking Intel and Qualcomm’s License to Supply Chips to Huawei
• [News] US Considers Sanctioning Huawei-Linked Chinese Chip Network, Huawei-Related Enterprises Blacklisted

(Photo credit: Pixabay)