On July 1, GlobalFoundries (GF), a major foundry player, announced that it has acquired Tagore Technology’s production-verified proprietary GaN (Gallium nitride) power IP portfolio, which refers to a high-power density solution designed to enable higher efficiency and better performance of automobile, IoT, and AI data center applications where power supply is widely used.

Founded in January 2011, Tagore Technology focuses on developing GaN-on-Si (Gallium nitride on silicon) semiconductor technology for RF and power management applications.

As part of the acquisition, a team of veteran engineers from Tagore, dedicated to developing GaN technology, will join GF. “With this acquisition, GF takes another step toward accelerating the availability of GaN and empowering our customers to build the next generation of power management solutions that will reshape the future of mobility, connectivity and intelligence,” said Niels Anderskouv, chief business officer at GF.

It is worth mentioning that in February 2024, GF received a direct subsidy of USD 1.5 billion under the US CHIPS and Science Act, with part of the funds allocated to the mass production of critical technologies, including GaN.

By combining this manufacturing capability with the technical expertise of the Tagore team, GF is well positioned to transform the efficiency of AI systems and enable lower power consumption particularly pivotal for edge or IoT devices.

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(Photo credit: GF)

According to a report from Reuters on July 4, consensus from 27 analysts compiled by LSEG SmartEstimate indicates that driven by the surge in demand for AI technology and the resulting rebound in memory prices, Samsung Electronics’ operating profit for Q2 2024 (ending June 30) is projected to skyrocket by 1,213% from KRW 670 billion in the same period last year to KRW 8.8 trillion (roughly USD 6.34 billion), marking the highest since Q3 2022.

Other memory giants are also optimistic about the operation afterwards. Take Micron as an example. Regarding the AI frenzy, Micron CEO Sanjay Mehrotra claimed that in the data center sector, rapidly growing AI demand enabled the company to grow its revenue by over 50% on a sequential basis.”

Mehrotra is also confident that Micron can deliver a substantial revenue record in fiscal 2025, with significantly improved profitability underpinned by our ongoing portfolio shift to higher-margin products.

On the other hand, SK Group also stated that by 2026, the group will invest KRW 80 trillion in AI and semiconductors, while continuing to streamline its businesses to increase profitability and return value to shareholders.

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(Photo credit: Samsung)

Google’s Tensor G4 could mark Samsung’s last mass-produced SoC, as earlier in May, Tensor G5 is reportedly adopting TSMC’s advanced 3nm process. Now here’s the latest development. According to a report by Wccftech, the chip, to be used in Google’s upcoming Pixel 10 lineup, has already reached tape-out, with mass production expected in 2025.

Google’s Tensor G5 would be its first fully self-designed smartphone SoC. Previous Tensor chips, somehow, were modifications from Samsung’s Exynos series, with Samsung being its foundry partner.

The report stated that Google’s decision to collaborate with TSMC is influenced by the Taiwanese semiconductor company’s established reliability in mass-producing wafers using its next-generation nodes.

Before Google, the foundry behemoth has already secured several major clients for its 3nm node. Both Qualcomm and Taiwanese smartphone fabless company MediaTek have reportedly adopted TSMC’s N3E node for their first 3nm chipsets. Apple’s upcoming A18 chips for iPhone 16 models, are said to be manufactured with TSMC’s N3E node as well, according to a report by Commercial Times.

On the other hand, regarding the progress of 3nm, Samsung is still struggling with the low yield rate for its latest Exynos 2500 processors. The company targets to increase the yield rate to over 60% before the product enters mass production, according to a previous report by Korean media outlet ZDNet Korea.

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• [News] Google Reportedly Shifts Orders from Samsung to TSMC for Its Upcoming Tensor G5 in the Pixel 10 Series

(Photo credit: Google)

According to a report from Notebookcheck citing market rumors, it’s suggested that the AMD Zen 6 architecture, codenamed Morpheus, will utilize 2nm and 3nm processes. The Zen 6 series includes three versions: Standard, Dense Classic, and Client Dense. Later rumors also indicate the architecture will feature three core configurations: 8-core (Zen 6), 16-core (Zen 6c), and 32-core (Zen 6c Extended).

The same report further indicates that, in the consumer market, the Zen 6 series will include high-end laptop versions like Medusa Point, platform versions for AM5 like Medusa Ridge, and versions suitable for both gaming laptops and desktops like Medusa Halo. AMD plans to launch the Zen 6 architecture in the second quarter of 2025, with production starting by the end of 2025, though mass production might be delayed to 2026.

AMD unveiled Strix Point at COMPUTEX 2024, featuring a combination of the Zen 5 series and RDNA 3.5 architecture. Strix Point’s launch was delayed by two quarters due to issues related to AMD’s plans for 3nm production, which were eventually canceled.

AMD also had plans for Strix Halo, rumored to use TSMC’s N3E process for producing IOD (input/output die) chips similar to Medusa Halo. Strix Halo’s launch was also delayed, possibly due to issues with the IOD chip.

Compared to the Zen 5 series architecture, the Zen 6 series is expected to feature a nearly redesigned memory controller and a new scheduling program. The Zen 6 architecture represents a significant overhaul similar to the Zen 2 architecture, with substantial changes. AMD is said to be looking to finalize the Zen 6 series design by the third quarter and commence production in 2025.

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(Photo credit: AMD)

As memory prices and demand rise, memory manufacturers Nanya Technology and Winbond have resumed normal production, no longer reducing output as they did last year. TrendForce and industry sources cited in a report from Liberty Times Net also indicate that memory shipments will continue to recover in the third quarter.

Reportedly, memory manufacturers’ utilization rates have reached 90% to 100%, surpassing the 60% to 70% utilization rates of mature process foundries.

Last year, in response to market conditions, Winbond adjusted its inventory and reduced production at its Taichung plant by up to 30-40%. This year, as market demand has rebounded, production has resumed, with capacity now at full utilization, producing 58,000 wafers per month.

Moreover, Winbond’s Kaohsiung plant has introduced new capacity equipment, increasing monthly production from 10,000 to 14,000 wafers and upgrading processes from 25nm to 20nm.

Winbond’s General Manager, Pei-Ming Chen, stated that the company is currently operating at full capacity utilization, with shipments exceeding production. This indicates a continuous decrease in inventory levels and a rise in customer demand. He then expected the second half of the year to be better than the first, with DDR3 and DDR4 contract prices increasing each quarter, aiding the company’s core profitability.

Nanya Technology Increases Production, Aims to Turn Losses into Profits in Q3

Nanya Technology adjusted production levels dynamically last year, reducing output by up to 20%. However, production has gradually increased this year.

Nanya Technology anticipates improving DRAM market conditions and prices quarter by quarter, with the industry overall trending positively and a chance to return to profitability in the third quarter.

Nanya Technology reported consolidated revenue of NTD 3.363 billion (roughly USD 103 million) for June, up 0.35% month-on-month and 36.83% year-on-year, marking the second-highest level this year. Accumulated consolidated revenue for the first half of the year was NTD 19.424 billion (roughly USD 596 million), an increase of 44.4% year-on-year.

On the other hand, chairperson Doris Hsu of GlobalWafers, a major silicon wafer manufacturer, recently stated that currently, there is stronger demand for high-performance computing (HPC) and memory applications, while demand in automotive and industrial applications is weak. Demand for mobile applications is increasing, and customers are continuing to digest inventory, leading to a more conservative approach towards procurement.

TrendForce reports that a recovery in demand for general servers—coupled with an increased production share of HBM by DRAM suppliers—has led suppliers to maintain their stance on hiking prices. As a result, the ASP of DRAM in the third quarter is expected to continue rising, with an anticipated increase of 8–13%. Among this, DDR3 & DDR4 prices expected to increase by 3–8% in Q3.

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• [News] Jensen Huang Confirms NVIDIA Approaches Certification of Samsung’s HBM Chips
• HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024, Says TrendForce

(Photo credit: Nanya Technology)