According to a report from Economic Daily News, Innolux President James Yang announced on August 5 that the company is advancing its semiconductor fan-out panel-level packaging (FOPLP) with three key processes, targeting to enter mass production as soon as year-end. The chip-first process tech...

According to a report from Commercial Times, despite ongoing turbulence in the semiconductor industry, including Intel's capital expenditure cuts and reported bottlenecks in NVIDIA's B-series GPU, TSMC's leading position in the industry may remain unshaken. The sources cited in the report note...

Automotive chip market, previously enjoying robust growth among the semiconductor sector, is now showing signs of slowing down. According to a report from WeChat account DRAMeXchange, the major foundry UMC announced that it expects customer inventories in the communications, consumer electronics,...

According to a report from Tom’s Hardware citing industry sources, it’s indicated that Chinese memory giant ChangXin Memory Technologies (CXMT) has started mass production of HBM2. If confirmed, this is approximately two years ahead of the expected timeline, although the yield rate for HBM2 is s...

According to a report from The Information, NVIDIA's "world's most powerful AI chip," the GB200, is said to be experiencing yield issues, leading to a one-quarter delay in mass shipments. As per sources cited by a report from the Economic Daily News, it's suggested that the problem likely lies i...