As a strategic technology empowering a new round of technological revolution and industrial transformation, AI has become one of the key driving forces for the development of new industrialization. Fueled by the ChatGPT craze, AI and its applications are rapidly gaining traction worldwide. From an industrial perspective, NVIDIA currently holds almost absolute dominance in the AI chip market.

Meanwhile, major tech companies such as Google, Microsoft, and Apple are actively joining the competition, scrambling to seize the opportunity. Meta, Google, Intel, and Apple have launched the latest AI chips in hopes of reducing reliance on companies like NVIDIA. Microsoft and Samsung have also reportedly made investment plans for AI development.

• Microsoft Announced an Investment Plan of over USD 11 Billion

Recently, according to multiple global media reports, Microsoft is developing a new AI mega-model called MAI-1. This model far exceeds some of Microsoft’s previously released open-source models in scale and is expected to rival well-known large models like Google’s Gemini 1.5, Anthropic’s Claude 3, and OpenAI’s GPT-4 in terms of performance. Reports suggest that Microsoft may demonstrate MAI-1 at the upcoming Build developer conference.

In response to the growing demand for AI computing, Microsoft recently announced a plan to invest billions of dollars in building AI infrastructure in Wisconsin. Microsoft stated that this move will create 2,300 construction jobs, and could contribute to up to 2,000 data center jobs when completing construction.

Furthermore, Microsoft will establish a new AI lab at the University of Wisconsin-Milwaukee to provide AI technology training.

Microsoft’s investment plan in the US involves an amount of USD 3.3 billion, which plus its investments previously announced in Japan, Indonesia, Malaysia and Thailand amount to over USD 11 billion in reference to AI-related field.

Microsoft’s recent announcements shows that it plans to invest USD 2.9 billion over the next two years to enhance its cloud computing and AI infrastructure in Japan, USD 1.7 billion within the next four years to expand cloud services and AI in Indonesia, including building data centers, USD 2.2 billion over the next four years in Malaysia in cloud computing and AI, and USD 1 billion to set up the first data center in Thailand, dedicated to providing AI skills training for over 100,000 people.

• Apple Reportedly Developing in-House AI Chip for Data Center

Apple has also unveiled its first AI chip, M4. Apple introduced that the neural engine in M4 chip is the most powerful one the company has ever developed, outstripping any neural processing unit in current AI PCs. Apple further emphasized that it will “break new ground” in generative AI this year, bringing transformative opportunities to users.

According to a report from The Wall Street Journal, Apple has been working on its own chips designed to run AI software on data center servers. Sources cited in the report revealed that the internal codename for the server chip project is ACDC (Apple Chips in Data Center). The report indicates that the ACDC project has been underway for several years, but it’s currently uncertain whether this new chip will be commissioned and when it might hit the market.

Tech journalist Mark Gurman also suggests that Apple will introduce AI capabilities in the cloud this year using its proprietary chips. Gurman’s sources indicate that Apple intends to deploy high-end chips (Similar to those designed for Mac) in cloud computing servers to handle cutting-edge AI tasks on Apple devices. Simpler AI-related functions will continue to be processed directly by chips embedded in iPhone, iPad, and Mac devices.

• Samsung might Start Pilot production for AI Inference Chip Mach-1

As per industry sources cited by South Korean media outlet ZDNet Korea, Samsung Electronics’ AI inference chip, Mach-1, is set to begin prototype production using a multi-project wafer (MPW) approach and is expected to be based on Samsung’s in-house 4nm process.

Previously at a shareholder meeting, Samsung revealed its plan to launch a self-made AI accelerator chip, Mach-1, in early 2025. As a critical step in Samsung’s AI development strategy, Mach-1 chip is an AI inference accelerator built on application-specific integrated circuit (ASIC) design and equipped with LPDDR memory, making it particularly suitable for edge computing applications.

Kyung Kye-hyun, head of Samsung Electronics’ DS (Semiconductor) division, stated that the development goal of this chip is to reduce the data bottleneck between off-chip memory and computing chips to 1/8 through algorithms, while also achieving an eight-fold improvement in efficiency. He noted that Mach-1 chip design has gained the verification of field-programmable gate array (FPGA) technology and is currently in the physical implementation stage of system-on-chip (SoC), which is expected to be ready in late 2024, with a Mach-1 chip-driven AI system to be launched in early 2025.

In addition to developing AI chip Mach-1, Samsung has established a dedicated research lab in Silicon Valley focusing on general artificial intelligence (AGI) research. The intention is to develop new processors and memory technologies capable of meeting future AGI system processing requirements.

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• [News] Microsoft to Build AI Data Center at Former Foxconn Planned Panel Plant Site in Wisconsin
• [News] Apple Allegedly Developing AI Processor for Data Centers, with TSMC as Its Foundry Partner

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As per a report from Reuters, US Commerce Secretary Raimondo stated on May 8th that the need for the government to take the threat posed by China-produced connected cars more seriously, suggesting potential “extreme action” to restrict or prohibit the import of such vehicles to prevent the leakage of data belonging to US citizens.

Regarding the national security risk investigation launched by Washington earlier this year into Chinese automobiles, Raimondo expressed concerns that Chinese connected vehicles could collect a vast amount of data about Americans, including who they are, what they say in their car, where they go to, as well as their patterns of driving.

Per Reuters, the US administration initiated a review in February this year on whether the import of Chinese automobiles poses a national security risk. Raimondo stated on May 8th that the Department of Commerce is reviewing the public’s comments on this review submitted before April 30th.

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• [News] U.S. Imposes Further Sanctions, Revoking Intel and Qualcomm’s License to Supply Chips to Huawei
• [News] US Considers Sanctioning Huawei-Linked Chinese Chip Network, Huawei-Related Enterprises Blacklisted

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On May 9th, China’s leading semiconductor foundry, SMIC International, announced its financial report for the first quarter of this year. It revealed a revenue of USD 1.75 billion, a year-on-year increase of 19.7%, and a net profit of USD 71.8 million, marking a significant 68.9% decrease compared to the same period last year, falling below market expectations of USD 76.8 million.

According to its financial data, SMIC’s gross profit margin for the first quarter of this year was 13.7%, not only lower than the 16.4% in the fourth quarter of 2023 but also significantly lower than the 20.8% in the first quarter of 2023.

Per a report from Economic Daily News, SMIC’s management stated that global customer’s willingness for restocking had increased in the first quarter, with the company shipping 1.79 million 8-inch equivalent wafers, a 7% increase from the previous quarter. The capacity utilization rate reached 80.8%, up 4 percentage points from the previous quarter.

For the second quarter of this year, SMIC estimates that the early pull-in demand from some customers is still ongoing, with the company giving revenue guidance of a 5% to 7% increase from the previous quarter. With the expansion of production capacity, depreciation is increasing each quarter, the gross margin guidance is between 9% and 11%.

SMIC further indicated that, assuming no significant changes in the external environment for the full year, the company’s goal is for sales revenue growth to exceed the industry average.

In addition, China’s second-largest semiconductor foundry, Hua Hong, also released its first-quarter financial report, with revenue of CNY 3.297 billion, a year-on-year decrease of 24.62%, and a net profit of CNY 220 million, a year-on-year decrease of 78.76%.

Hua Hong estimates that its main business for the second quarter of 2024 will be between USD 470 million and 500 million, with a gross margin of approximately 6% to 10% for its main business.

Regarding the development of China’s foundry industry, TrendForce previously reported that from 2023 to 2027, propelled by policies and incentives promoting local production and IC development, China’s mature process capacity is anticipated to grow from 29% this year to 33% by 2027. Leading the charge are giants like SMIC, HuaHong Group, and Nexchip. Globally, the ratio of mature (>28nm) to advanced (<16nm) processes is projected to hover around 7:3.

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• [News] Sales Decline Leads to Sharp Profit Drop for SMIC in 2023
• [News] SMIC’s Net Profit Halved Last Year, Faces Further Reductions This Year

(Photo credit: SMIC)

Intel has secured its supply of the new High-NA EUV (high-numerical aperture extreme ultraviolet) lithography equipment from ASML, which the semiconductor heavyweight will allegedly use on its 18A (1.8nm) and 14A (1.4nm) nodes, according to reports from TheElec and Wccftech.

According to sources cited by TheElec, the Dutch fab equipment maker is manufacturing five units of the kit this year, which will all go to Intel, while Samsung and SK Hynix are expected to wait until the second half of 2025 to obtain the aforementioned equipment.

For companies aiming to produce 2-nanometer chips, High-NA EUV lithography equipment may be critical, with each unit priced at over 5 trillion Korean won (approximately US$ 370 million), indicating Intel’s total investment on ASML’s first batch of High-NA EUV kits may amount to US$ 2 billion, according to TheElec and Wccftech.

Intel has confirmed in mid-April that it has received and assembled the industry’s first High-NA EUV lithography system, which is expected to be able to print features up to 1.7x smaller than existing EUV tools. This will enable 2D feature scaling, resulting in up to 2.9x more density.

Compared to 0.33NA EUV, High NA EUV (or 0.55NA EUV) can deliver higher imaging contrast for similar features, which enables less light per exposure, thereby reducing the time required to print each layer and increasing wafer output.

Intel expects to use both 0.33NA EUV and 0.55NA EUV alongside other lithography processes in developing and manufacturing advanced chips, starting with product proof points on Intel 18A in 2025 and continuing into production of Intel 14A.

According to TSMC’s press release in late April, A16, TSMC’s next technology on its roadmap which will combine its Super Power Rail architecture with nanosheet transistors, is scheduled for production in 2026. However, citing Kevin Zhang, TSMC’s senior vice president of business development, Reuters reported that TSMC does not believe it needs to use ASML’s new High-NA EUV lithography tool machines to build the A16 chips.

(Photo credit: ASML)

According to a report from Bloomberg, Intel, the chip giant, expects its revenue for the current quarter to be impacted after the US government revoked chip sales licenses to Huawei. Intel estimates that its revenue for the second quarter of this year will be below USD 13 billion, though still within the previously projected range of USD 12.5 billion to 13.5 billion. The company’s full-year financial forecast remains unchanged, with both revenue and profits expected to grow.

The U.S. government has reportedly revoked the licenses of Intel and Qualcomm to supply semiconductor chips used in laptops and handsets to Huawei. According to Reuters citing sources, some companies received notices on May 7th, and the revocation of the licenses took immediate effect.

Huawei unveiled its first AI notebook last month, which is powered by Intel chips. This has sparked dissatisfaction among some US lawmakers, who have called for the revocation of related export licenses.

In 2019, the US government added Huawei to the “Entity List,” prohibiting suppliers from providing goods to Huawei without an export license. However, US suppliers such as Intel and Qualcomm were granted permission to continue supplying certain chips to Huawei, including central processors for laptops and 4G smartphone chips.

Amid the escalating US-China tech war, these export licenses have allowed some companies to maintain stable revenue from the Chinese market.

Huawei has become the epicenter of the US-China trade conflict, with the US restricting Huawei’s access to Qualcomm’s latest 5G chips and implementing comprehensive controls on NVIDIA’s AI chips, limiting Huawei’s business growth. On the other hand, China has initiated countermeasures, demanding the telecom industry to cease using foreign chips by 2027.

The US Republican Representative Elise Stefanik believes that revoking the licenses will strengthen U.S. national security, protect U.S. intellectual property rights, and thus weaken the technological advancement capabilities of communist China.

Akash Palkhiwala, Qualcomm’s CFO, stated in early May that as the Chinese telecom industry shifts towards 5G development and stops procuring Qualcomm’s approved 4G chips, the company anticipates earning no revenue from Huawei by 2025.

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• [News] U.S. Imposes Further Sanctions, Revoking Intel and Qualcomm’s License to Supply Chips to Huawei
• [News] U.S. Department of Commerce Claims Huawei Chips Not as Advanced, Lag Behind U.S. Chips by Several Years

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