As the semiconductor industry continues to advance, it has sparked an arms race among Samsung, Intel, and TSMC in acquiring extreme ultraviolet (EUV) equipment. When asked about when TSMC would adopt the extremely expensive High Numerical Aperture EUV (High-NA EUV) lithography equipment, as per a re...

Recently, it was reported that Huawei filed a patent infringement lawsuit against MediaTek in a Chinese local court. According to a report from TechNews, in response, MediaTek and its subsidiaries, HFI Innovation and MTK Wireless, have initiated countermeasures by filing a lawsuit against Huawei in ...

According to Reuters, engineers at Amazon's chip lab in Austin, Texas, recently tested highly confidential new servers. Per the Economic Times, the director of engineering at Amazon's Annapurna Labs under AWS Rami Sinno revealed that these new servers feature Amazon’s AI chips, which can compete ...

According to a report from Commercial Times, TSMC's advanced processes continue to experience strong demand, with major tech companies such as Apple, Qualcomm, NVIDIA, and AMD nearly fully booking TSMC's 3nm capacity, while the order visibility extends into 2025. As per the same report, the suppl...

According to a report from UDN, China's largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the "JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project." The project will soon be com...