Kioxia, one of the world’s major NAND manufacturer, anticipates a strong market outlook, emphasizing a full recovery this season in key NAND applications such as PCs and smartphones.

According to a report from the Economic Daily News, coupled with an expected surge in demand for new laptops and smartphones driven by AI, NAND chip prices, which increased by 20% last season, are likely to continue rising this season, marking the fourth consecutive price hike. The industry’s future appears quite promising.

Benefiting from the recovering NAND market, Kioxia reported its first revenue growth in seven quarters and profitability for the first time in six quarters. During an investor conference, Kioxia noted that NAND chip prices in US dollar rose by approximately 20% last season, continuing an upward trend for three consecutive quarters, with the company’s quarterly shipment volume increasing by about 5% to 9%.

Kioxia emphasized that this season sees a recovery trend in key NAND end applications such as PCs and smartphones. Additionally, a new wave of laptop and smartphone upgrades driven by AI is expected, along with data centers requiring higher-capacity solid-state drives (SSDs) to support AI applications. All these factors positively impact the NAND industry.

Kioxia is reportedly optimistic that the proliferation of AI and the increase in memory capacity will continue to drive long-term growth in the NAND market. Due to disciplined production output by NAND chip manufacturers, the price increase trend is expected to continue this season, making the industry’s future prospects quite optimistic.

Taiwanese NAND manufacturer ADATA believes that although upstream NAND suppliers are gradually returning to profitability and steadily increasing capacity utilization rates, their approach to pricing and capacity planning remains rational. Coupled with a noticeable recovery in demand for enterprise and data center SSDs, ADATA is reportedly optimistic that NAND chip prices will continue to rise in a stable manner, per the same report from Economic Daily News.

As per a research from TrendForce on March 6, in 4Q23, Samsung still firmly held the top position in the NAND Flash market, with its market share increasing from 31.4% in the previous quarter to 36.6%; SK Group, with its market share increasing from 20.2% in the previous quarter to 21.6%, stood in the second place quarterly revenue.

Following them were Western Digital, whose market share decreased from 16.9% in the previous quarter to 14.5%, Kioxia, whose market share decreased from 14.5% in the previous quarter to 12.6%, and Micron, whose market share decreased from 12.5% in the previous quarter to 9.9%.

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(Photo credit: Kioxia)

To strengthen its semiconductor supply chain, the Chinese government is reportedly requiring domestic automakers, including BYD, to expand their procurement of locally-produced chips. The goal is to increase the proportion of domestically-sourced automotive chips to 25% by 2025.

According to a report from Nikkei on May 16th, the Chinese government has instructed major local automakers to increase the proportion of domestically-produced automotive chips they procure to 25% by 2025 from 10% currently. The Chinese authorities hope that by raising the procurement ratio of Chinese-made chips, they can accelerate the pace of independence for the country’s semiconductor supply chain.

As per the same report, the Chinese Ministry of Industry and Information Technology (MIIT), which is responsible for national automotive industry policy, has asked major Chinese automakers to increase the local procurement ratio of automotive chips to 20-25%. This request targets not only the major electric vehicle manufacturer BYD but also SAIC Motor, Dongfeng Motor, GAC Motor, and FAW Group.

However, this requirement is not mandatory; instead, it encourages automakers to expand their procurement of local chips through incentives. An industry source cited by the same report revealed that ultimately, the goal is for all automotive chips to be locally sourced.

The report further indicates that though the conflict between China and the U.S. in the semiconductor sector continues to intensify, manufacturing technologies used for automotive chips are usually not the most advanced, and therefore not subject to U.S. export controls.

This means that Chinese semiconductor manufacturers will be able to procure manufacturing equipment from overseas, bolstering their automotive chip businesses.

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(Photo credit: iStock)

TSMC reportedly plans to utilize 12nm and 5nm process nodes in manufacturing the latest HBM4 memory, according to a report by AnandTech. Citing TSMC’s executives, the world’s largest dedicated semiconductor foundry would employ two fabrication processes, N12FFC+ and N5, to integrate HBM4e memory with next-generation AI and HPC processors.

During TSMC’s presentation at its European Technology Symposium 2024, which took place on May 14th, the company revealed new details about the base dies it will produce for HBM4 using advanced logic processes.

According to a senior director of design and technology platform citing by the report, TSMC is currently working with HBM memory partners, including Micron, Samsung and SK Hynix, on advanced nodes targeting HBM4.

Earlier in mid-April, SK Hynix announced that it has signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, slated to be mass produced from 2026, through this initiative.

N12FFC+, believed to be more cost-effective, is expected to achieve HBM performance, while the N5 base die could offer more logic with significantly lower power.

In the symposium, TSMC stated that its 12FFC+ process is well-suited for HBM4 performance, enabling memory vendors to construct 12-Hi (48 GB) and 16-Hi (64 GB) stacks, with per-stack bandwidth exceeding 2 TB/second. It is also optimizing CoWoS-L and CoWoS-R for HBM4, which utilize over eight layers to support HBM4’s routing of over 2,000 interconnects with proper signal integrity.

These packaging solutions is said to provide interposers that can accommodate up to 8 times the reticle size, providing ample space for as many as 12 HBM4 memory stacks.

In addition, base dies produced with the N5 process will incorporate increased logic density, lower power consumption, and enhanced performance. However, the most significant advantage may lie in the extremely small interconnect pitches achievable with such advanced process technology, ranging from 6 to 9 microns. This capability will enable N5 base dies to be paired with direct bonding, facilitating the 3D stacking of HBM4 directly on top of logic chips. Direct bonding has the potential to significantly enhance memory performance, a crucial enhancement for AI and HPC chips constantly demanding higher memory bandwidth, according to the report.

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(Photo credit: TSMC)

According to a report from the Korean media outlet TheElec, South Korea is planning to establish an AI semiconductor innovation center in Silicon Valley.

The Korean Semiconductor Industry Association (KSIA) announced on Wednesday that it would accept applications until May 30th for those interested in residing at the planned center. A committee will review the applicants in June, with the move-in process beginning in August for those who are selected.

This initiative is part of the Ministry of Trade, Industry and Energy’s project to promote system semiconductor technology for export. Launched in April, the project aims to establish research platforms in the US and China. The ministry is collaborating with industry associations like KSIA for this endeavor.

A KSIA spokesperson informed TheElec that the center will provide independent offices for three to four companies and feature a large, open space for additional companies. The center will reportedly offer support for companies’ prototype testing, verification, and other assistance.

The South Korea government has been aggressively working on strengthening the country’s position in the semiconductor industry, as a series of ambitious projects have been announced recently, the AI Chip innovation center in the U.S. being its latest endeavor.

Earlier in May, the South Korean government is said to be planning to introduce a comprehensive chip investment and research support plan, surpassing KRW 10 trillion (roughly USD 7.3 billion) in scale, to enhance its position in the critical semiconductor industry, as per a report from the Economic Daily News.

Meanwhile, the report from South Korean media outlet BusinessKorea stated that on May 2nd, the South Korean Ministry of Trade, Industry, and Energy announced the “Second Strategic Planning and Investment Council,” comprising of representatives from research institutes, universities, etc, approved 62 new R&D projects for 2025, including flagship projects and roadmaps in over 11 domains.

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(Photo credit: iStock)

The global electric vehicle market has begun to show signs of saturation, affecting the battery supply chain. According to a report from Korean media Maeil Business, in response to the downturn in battery demand, South Korea’s SK Group holding company, SK Innovation, intends to sell its subsidiary SK IE Technology (SKIET) to raise funds and strengthen its financial position.

The report cited sources, indicating that SK Innovation is actively seeking investors for capital injection and has begun negotiations. Additionally, the possibility of selling its battery material subsidiary, SKIET, may not be ruled out as a consideration to obtain cash for flexible use, in response to the shrinking appetite in the battery market.

As per a report from MoneyDJ, SK Innovation holds a 61.2% stake in SKIET, valued at KRW 2.5 trillion (approximately USD 1.8 billion).

Industry sources further pointed out that SK Innovation’s decision to sell SKIET is primarily driven by the need for additional funds to expand its electric vehicle battery business under SK On, including the expansion of its battery factories in the United States, according to the aforementioned reports.

Reportedly, SK On anticipates capital expenditures of KRW 7.5 trillion this year. However, the sources believe that whether SK Innovation can find a buyer for SKIET remains to be seen, given SKIET’s poor performance.

SK On’s clients include well-known automakers such as Ford, Volkswagen, and Hyundai. However, in a high-interest-rate environment, global electric vehicle sales have stalled, leading SK On to incur a significant operating loss of KRW 332 billion in the first quarter, far exceeding the KRW 18.6 billion loss in the previous quarter.

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(Photo credit: SK Innovation)