According to a report from Bloomberg, Intel, the chip giant, expects its revenue for the current quarter to be impacted after the US government revoked chip sales licenses to Huawei. Intel estimates that its revenue for the second quarter of this year will be below USD 13 billion, though still within the previously projected range of USD 12.5 billion to 13.5 billion. The company’s full-year financial forecast remains unchanged, with both revenue and profits expected to grow.

The U.S. government has reportedly revoked the licenses of Intel and Qualcomm to supply semiconductor chips used in laptops and handsets to Huawei. According to Reuters citing sources, some companies received notices on May 7th, and the revocation of the licenses took immediate effect.

Huawei unveiled its first AI notebook last month, which is powered by Intel chips. This has sparked dissatisfaction among some US lawmakers, who have called for the revocation of related export licenses.

In 2019, the US government added Huawei to the “Entity List,” prohibiting suppliers from providing goods to Huawei without an export license. However, US suppliers such as Intel and Qualcomm were granted permission to continue supplying certain chips to Huawei, including central processors for laptops and 4G smartphone chips.

Amid the escalating US-China tech war, these export licenses have allowed some companies to maintain stable revenue from the Chinese market.

Huawei has become the epicenter of the US-China trade conflict, with the US restricting Huawei’s access to Qualcomm’s latest 5G chips and implementing comprehensive controls on NVIDIA’s AI chips, limiting Huawei’s business growth. On the other hand, China has initiated countermeasures, demanding the telecom industry to cease using foreign chips by 2027.

The US Republican Representative Elise Stefanik believes that revoking the licenses will strengthen U.S. national security, protect U.S. intellectual property rights, and thus weaken the technological advancement capabilities of communist China.

Akash Palkhiwala, Qualcomm’s CFO, stated in early May that as the Chinese telecom industry shifts towards 5G development and stops procuring Qualcomm’s approved 4G chips, the company anticipates earning no revenue from Huawei by 2025.

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• [News] U.S. Imposes Further Sanctions, Revoking Intel and Qualcomm’s License to Supply Chips to Huawei
• [News] U.S. Department of Commerce Claims Huawei Chips Not as Advanced, Lag Behind U.S. Chips by Several Years

(Photo credit: iStock)

Samsung Electronics is ramping up its entry into the semiconductor glass substrate market by advancing its equipment procurement and installation to September, with trial production slated to begin in the fourth quarter, one quarter earlier than originally planned. According to a report from South Korean media outlet ETNews, Samsung Electronics aims to commence mass production of glass substrates for high-end System-in-Package (SiP) applications starting in 2026.

In order to manufacture highly complex multi-chiplet SiPs, Samsung has decided to expedite the trial production schedule at its Sejong plant in South Korea to gain more expertise in glass substrate manufacturing. Samsung’s competitor, Intel, also plans to offer packaging technology on glass substrates in the future.

Reportedly, Samsung Electronics plans to have all necessary equipment installed on the trial production line by September and commence operations in the fourth quarter. Partners for the trial production line include companies such as Philoptics, Chemtronics, Joongwoo M-Tech, and Germany’s LPKF, which will provide equipment components.

According to a report from Tom’s Hardware, Compared to traditional organic substrates, glass substrates offer significant advantages, including excellent flatness, which enhances exposure and focusing capabilities, as well as outstanding dimensional stability suitable for next-generation chip interconnects with multiple small chips. Additionally, glass substrates exhibit better thermal and mechanical stability, making them suitable for high-temperature durable applications in data centers.

Intel has been developing glass substrates for nearly a decade and plans to introduce commercial products by 2030. Intel believes that the characteristics of glass substrates will significantly increase interconnect density, which is crucial for efficient power transmission and signal routing in advanced SiP technology.

Previously, Intel also elaborated on its progress on the glass-based substrate packaging technology. According to Intel’s previous press release, glass substrates can tolerate higher temperatures, offer 50% less pattern distortion, and have ultra-low flatness for improved depth of focus for lithography as well as the dimensional stability needed for extremely tight layer-to-layer interconnect overlay.

As a result of these distinctive properties, a 10x increase in interconnect density is possible on glass substrates. Furthermore, improved mechanical properties of glass enable ultra-large form-factor packages with very high assembly yields.

Meanwhile, Absolics, a subsidiary of SKC America, aims to start production of glass substrates for customers as early as the second half of 2024.

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• [News] Samsung Bullish on Glass Substrate Applications, Setting Up Production Line for Mass Production Starting in 2026
• [News] Glass Substrates in Advanced Packaging With Intel Leads, TSMC Quietly Innovates

(Photo credit: Intel)

SK Hynix has reportedly decided to sell the subsidiary equipment of its Chinese manufacturing plant to an investment company owned by the Wuxi Municipal Government, leading to speculation that SK Hynix may be withdrawing from its Chinese manufacturing business.

According to reports from The Korea Economy Daily and Reuters, industry sources have revealed that SK Hynix’s subsidiary, SK Hynix System IC, which operates 8-inch wafer manufacturing, recently held a board meeting and decided to sell a 21.3% stake in SK Hynix System IC (Wuxi) for KRW 205.4 billion (roughly USD 150.8 million) to Wuxi Industry Development Group.

Additionally, as per the Reuter’s report, SK Hynix System IC said it will also sell its intangible assets, including process technology to its Wuxi unit for KRW 123.8 billion.

The sources cited by The Korea Economy Daily‘s report have revealed that Wuxi Industry Development Group has additionally issued new shares to acquire a 28.6% stake, indicating that SK hynix is highly likely to sell nearly 50% of its shares.

Just in March, per a report from Chosun Daily, SK Hynix planned the closure of its Shanghai-based company established in 2006, shifting its focus to Wuxi, where its semiconductor manufacturing plant is located, making it the new business hub in China. However, this recent withdrawal suggests that SK hynix may be considering a complete exit from the Chinese semiconductor foundry market.

SK Hynix’s decision to downsize its Chinese foundry business comes amid a worsening semiconductor market, compounded by aggressive capacity expansions by domestic companies, making it difficult to maintain competitiveness. Additionally, China is actively expanding its 8-inch wafer plants to counter US export restrictions and is heavily investing in nurturing leading domestic foundry enterprises such as SMIC and Hua Hong Semiconductor.

As per data from the National Bureau of Statistics of China, semiconductor capacity in China surged by 40% in the first quarter, with SMIC’s overall capacity increasing by over 12%, despite a slowdown in foundry demand.

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• [News] Three-way Contest for HBM Dominance, Uncertainties Surrounding China’s Supply Chain Involvement
• [News] Increasing HBM Capacity to Sustain Market Share, SK Hynix Rumored to Upgrade Wuxi Plant

(Photo credit: SK Hynix)

Microsoft President Brad Smith announced the investment of USD 3.3 billion to construct an artificial intelligence data center in Wisconsin, aiming to make the state a core driver of the innovation economy. Notably, the site of the facility was originally intended for a LCD panel plant promised by Foxconn six years ago.

According to Microsoft’s press release, the AI data center in Wisconsin is expected to create 2,300 union construction opportunities by 2025 and will provide long-term employment opportunities over the next several years.

Microsoft’s press release highlights that this investment will be utilized for constructing cloud computing and artificial intelligence infrastructure, establishing the first AI co-innovation lab in the United States focused on the manufacturing industry, and promoting AI training programs with the goal of enabling over 100,000 Wisconsin residents to acquire necessary AI skills.

The press release also notes that Microsoft will collaborate with Gateway Technical College to establish a Data Center Academy, aiming to train more than 1,000 students within five years, equipping them to enter roles in data centers or information technology departments.

Microsoft’s new facility in Racine County, Wisconsin, was originally intended to be the site of a LCD panel plant planned by Foxconn, a subsidiary of Hon Hai Precision Industry Co., Ltd. (Foxconn Group), according to a report by CNA.

In June 2018, then-chairman of Foxconn, Terry Gou, and then-US President Donald Trump attended the groundbreaking ceremony for the panel plant. Foxocnn announced an investment of USD 10 billion, and Trump described the project as the “8th wonder of the world.”

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• [News] Microsoft Reportedly Stockpiling AI Chips to Boost Hardware Capability
• [News] Breaking Away from NVIDIA Dependency, Microsoft Reportedly Developing In-House AI Server High-Speed Network Card

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The latest challenger has emerged in the battle for dominance in China’s GPU and graphics card market. China’s LinJoWing has unveiled its self-developed second-generation graphics processing chip, the GP201, reportedly boasting performance metrics surpassing that of AMD’s E8860 embedded graphics card.

According to a report from global media outlet Tom’s Hardware, LinJoWing, despite being only three years old, has demonstrated with its GP201 GPU performance comparable to AMD’s E8860 integrated graphics card from a decade ago. While the GPU is already in production and available in China, it has yet to surface on American shopping websites.

As per a report from Chinese media outlet IT Home, the GP201 outperforms the AMD E8860 embedded graphics card in various aspects such as 3D performance, 2D polygon rendering, ellipse rendering, pixel and image shifting, window rendering, and support for the domestic OpenCL library platform.

Additionally, LinJoWing’s GP201 GPU supports multiple Chinese-made processors and operating systems, with single-precision floating-point computing power reaching 1.2 Tflops. It supports 4K 60Hz display and H.265 decoding, with a maximum power consumption of 30W. Currently, five models of the GPU have been released in full-height, half-height, MXM, and other forms.

Tom’s Hardware believes that the performance of the GP201 is actually unimpressive. NVIDIA’s entry-level product, the GT 1030, released in 2017, matches the GP201 in terms of clock speed, TFLOPS, and power consumption, with eBay prices generally below $50. The GT 1030 benefits from mature NVIDIA drivers, making it difficult for LinJoWing to reach this level. However, LinJoWing’s ability to enter production after only three years of establishment gives it a competitive edge over other Chinese graphics cards.

This year, LinJoWing also surpassed its competitor Loongson in the low-end GPU market. However, challenging its biggest competitor, Moore Threads, will require further effort. Currently, Moore Threads’ flagship GPU’s specifications can rival NVIDIA’s RTX 3060 Ti.

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• [News] China Allegedly Orders Telecom Companies to Phase Out Foreign Chips, Impacting Intel and AMD
• [News] AMD Reportedly Faces Obstacles in Selling Custom AI Chips to China

(Photo credit: AMD)