According to the latest spot prices for memory from TrendForce, due to the Chinese New Year holiday, the spot market is experiencing a limited number of released quotes and very few transactions for DRAM. The trading momentum in the NAND Flash spot market has also not shown any improvement. Details are as follows:

DRAM Spot Market:

Chinese OEMs are winding down their operations due to the upcoming Lunar New Year holiday. As a result, the spot market is experiencing a limited number of released quotes and very few transactions. Sellers’ quotes continue to drive the spot price rally, but there is not much actual demand. Although DRAM suppliers are withholding the amount of products going into the spot market, this has a limited effect in terms of sustaining the rally. The average spot price of mainstream chips (i.e., DDR4 1Gx8 2666MT/s) rose by 0.52% from US$1.922 last week to US$1.932 this week.

NAND Flash Spot Market:

Transaction momentum is not yet revitalized from the spot market, with market activities carrying on from that of last week under the absence of buy orders for retail NAND Flash products. Module houses are currently hoping that promotions from Chinese New Year would amplify order dynamics, which are seemingly quite difficult for the time being. The 512Gb TLC wafer spot stayed flat this week at US$3.437.

TSMC officially gives the green light to the second fab in Kumamoto, Japan! On January 6th, TSMC, Sony Semiconductor Solutions Corporation (SSS), DENSO Corporation (DENSO), and Toyota Motor Corporation (Toyota) jointly announced further investment in TSMC’s Japanese subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (JASM).

The collaboration is expected to construct JASM’s second fab in Japan, dedicated to the 6/7-nanometer advanced process. The new facility is expected to commence operations by the end of 2027, with a total investment exceeding USD 20 billion, strongly supported by the Japanese government.

TSMC has stated that in this investment venture with JASM, TSMC, SSS, DENSO, and Toyota hold approximately 86.5%, 6.0%, 5.5%, and 2.0% of JASM shares, respectively. Toyota Motor Corporation is a new major shareholder following this capital increase, indicating its potential involvement in automotive electronics initiatives.

TSMC has further indicated that the construction of JASM’s second fab in Japan is set to commence at the end of 2024. The expansion in production capacity is expected to optimize overall cost structure and supply chain efficiency.

With two fabs in Kumamoto, TSMC anticipates in the press release that JASM’s total monthly production capacity will exceed 100,000 12-inch wafers, offering process technologies ranging from 40nm, 22/28nm, 12/16nm, to 6/7nm for automotive, industrial, consumer, and high-performance computing (HPC) applications. Capacity planning may be further adjusted based on customer demand.

For JASM’s first fab, it is planned to commence production by the end of the year. The initial facility, costing USD 8.6 billion, received subsidies of JPY 478 billion (approximately USD 3.23 billion) from the Japanese government.

The primary process of the first fab are 22/28nm and 12/16nm, with a monthly production capacity of around 50,000 12-inch wafers. Located in Kikuyo-cho, Kikuyo-gun, Kumamoto Prefecture, Kyushu, construction of the facility was announced in November 2021, ground was broken in April 2022, and construction was completed within two years.

JASM’s first fab is set to open on February 24, 2024, with mass production scheduled by the end of the year. The facility is a joint venture between Taiwan and Japan, with TSMC holding the majority of shares, Sony Semiconductor Manufacturing Corporation (SSMC) of Japan holding approximately 20%, and Toyota Group’s DENSO holding about 10%.

Read more

• [News] TSMC Reportedly Announcing Kumamoto Plant 2 in Japan, while U.S. Subsidies Expected by End of March
• [News] Multiple Fabs in Japan to Commence Production Post-2024 Boosting Industry

In late December 2023, reports surfaced indicating OpenAI CEO Sam Altman’s intention to raise funds to construct a semiconductor plant, ensuring a secure supply of AI chips.

According to a report from the Washington Post on January 24, 2024, Sam Altman has engaged with US congressional members to discuss the construction of the semiconductor plant, including considerations of timing and location, highlighting his increasingly fervent ambition to establish the facility.

TrendForce’s Insights:

• Rising AI Computing Demands Heighten Sam Altman’s Concerns About Chip Supply

The rapid emergence of AI-generated content (AIGC) undoubtedly stood out as a highlight of 2023, closely tied to the quality and efficiency of the large language models (LLMs) used. Take OpenAI’s ChatGPT, for instance, which employs the GPT-3.5 model released in 2020. With 175 billion training parameters, it surpasses its predecessor, GPT-2, by over 100 times, itself being over 10 times larger than the initial GPT from 2018.

In pursuit of better content quality, diversified outputs, and enhanced efficiency, the continuous expansion of model training parameters becomes an inevitable trend. While efforts are made to develop lightweight versions of language models for terminal devices, the cloud-based AI computing arena anticipates a continued expansion of language model training parameters, moving towards the “trillion” scale.

Due to the limited growth rate of AI chip performance, coping with the rapidly increasing model training parameters and the vast amount of data generated by the flourishing development of cloud-based AIGC applications inevitably requires relying on more AI chips. This situation continues to exert pressure on the chip supply chain.

Given that the demand for AI computing is escalating faster than the growth rate of chip performance and capacity, it’s understandable why Sam Altman is concerned about chip supply.

• Sam Altman to Seek Collaboration with Foundries for Plant Construction Goal

The construction of advanced process fabs is immensely costly, with estimates suggesting that the construction cost of a single 3nm fab could amount to billions of dollars. Even if Sam Altman manages to raise sufficient funds for plant construction, there remains a lack of advanced semiconductor process and packaging technology, not to mention capacity, yield, and operational efficiency.

Therefore, it is anticipated that Sam Altman will continue to seek collaboration with sfoundries to achieve his factory construction goal.

Looking at foundries worldwide, TSMC is undoubtedly the preferred partner. After all, TSMC not only holds a leading position in advanced processes and packaging technologies but also boasts the most extensive experience in producing customized AI chips.

While Samsung and Intel are also suitable partners from a localization perspective, considering factors like production schedules and yield rates, choosing TSMC appears to be more cost-effective.

(Photo credit: OpenAI)

Samsung’s flagship mobile processor, the Exynos 2400, produced using the 4LPP+ process technology, currently boasts a yield rate of approximately 60%, as per sources cited by TechNews. While this figure falls short of competitors, notably TSMC’s N4P process technology with yields surpassing 70%, it represents a significant improvement from Samsung’s own 25% yield rate over a year ago.

Samsung’s Exynos 2400 flagship mobile processor is the company’s first to utilize Fan-Out Wafer-Level Packaging (FOWLP). Samsung claims that FOWLP technology enhances heat resistance by 23% and boosts multicore performance by 8%. Consequently, the Exynos 2400 mobile processor delivers commendable performance in the latest 3DMark Wild Life benchmark tests.

In fact, Samsung previously announced plans to commence mass production of the SF3 chip in the second half of 2024, followed by the introduction of its 2-nanometer process technology between 2025 and 2026.

Industry sources cited in the report also indicate that Samsung’s foundry business has begun trial production for its second-generation 3-nanometer process technology, SF3. Furthermore, the company aims to increase its yield rate to over 60% within the next six months.

It is noteworthy that Samsung’s 3nm technology is highly aggressive compared to TSMC’s approach, which will transition to GAA transistors with its 2nm process. Samsung’s first-generation 3nm process already incorporates GAA transistor technology, specifically the MBCFET (Multi-Bridge Channel Field-Effect Transistor), known as SF3E, or 3GAE technology.

As per WeChat account ic211ic cited sources in the report, Samsung’s 3nm GAA technology utilizes wider nanosheets compared to the narrow nanowire GAA technology, offering higher performance and energy efficiency. With the 3nm GAA technology, Samsung can adjust the channel width of nanosheet transistors to optimize power consumption and performance, meeting diverse customer requirements.

Additionally, the flexibility of GAA design is highly advantageous for Design-Technology Co-Optimization (DTCO), contributing to achieving better Power, Performance, and Area (PPA) advantages.

In comparison to Samsung’s 5nm process, the first-generation 3nm process reduces power consumption by 45%, enhances performance by 23%, and decreases chip area by 16%. The upcoming second-generation 3nm process is expected to further reduce power consumption by 50%, boost performance by 30%, and reduce chip area by 35%.

(Photo credit: Samsung)

Industry sources cited by Reuters have revealed that Huawei, the Chinese telecommunications giant, is slowing down the production of its high-end Mate 60 series smartphone due to surging demand in the AI chip market and production constraints. Instead, the company has decided to prioritize the production of AI chips from its Ascend series, diverging from the Kirin chips used in the Mate 60 series.

According to a report by Reuters on January 5th, Huawei is utilizing a plant to simultaneously produce chips from the Ascend series and the Kirin series. The current plan is to prioritize the production of Ascend chips over Kirin chips, although the exact starting date for this arrangement has not been disclosed.

On the other hand, the production volume of Huawei’s Mate 60 series, launched in August last year, has been hampered by low chip yields. Reportedly, Huawei is actively working to improve chip yields, and it is hoped that the mentioned production adjustment will be a short-term measure.

It’s worth noting that many Huawei products have recently been affected by production bottlenecks. The computation components for Huawei’s assisted driving system have encountered production issues due to shortages of components.

This has led to delays in the delivery of flagship models from Changan Automobile, Chery Automobile, and Seres. Changan Automobile and Chery Automobile have already filed complaints and are currently in negotiations with Huawei.

Reports have indicated that since 2019, the U.S. government has imposed sanctions on Huawei, citing national security concerns, thereby cutting off Huawei’s access to advanced chip manufacturing equipment and technology and weakening its smartphone division. In response, Huawei denies posing any security risks and is actively working to rebuild its business.

In addition, Bloomberg previously reported that the Chinese government has also been directly investing to assist Huawei in building its chip supply chain since 2019, creating an exclusive supply chain for Huawei in response to the tighten restrictions.

In October 2023, the U.S. further strengthened restrictions on the export of advanced chips and chip manufacturing equipment to China, building upon previous limitations. This move forced Chinese customers to turn to domestic alternatives. Huawei’s Ascend 910B chip is considered the most competitive non-NVIDIA chip available in the Chinese market.

Huawei has maintained a low profile regarding its chip manufacturing capabilities and objectives. There is limited public information about its progress or how it successfully produces advanced chips.

In August 2023, during U.S. Commerce Secretary Gina Raimondo’s visit to China, Huawei launched the Mate 60 series, garnering significant market attention.

(Photo credit: Huawei)