While driving advances in HBM, foundry, and advanced packaging, AI generative applications also boosted the demand and sales of semiconductor equipment. Recently, Japanese semiconductor equipment giant DISCO announced that its non-consolidated (individual) shipments for April to June 2024 amounte...

As the demand for AI chips surges, orders for thermal compression (TC) bonders, which play a critical role in HBM (high-bandwidth memory) manufacturing, are also heating up. To further gain market momentum, South Korean chip packaging equipment manufacturer Hanmi Semiconductor plans to launch 2.5...

According to a report from Wccftech, Huawei's Kirin 9100 processor is scheduled to be unveiled later this year, rumored to be manufactured using SMIC's 5nm process. Its performance is reported to surpass that of the Qualcomm Snapdragon 8 Gen 2, and it will be featured in the entire Mate 70 series o...

Peter Wennink, former CEO of ASML, recently stated in an interview with Dutch broadcaster BNR that the chip war between China and the US lacks factual basis and is entirely driven by ideology. According to reports from Reuters and the Commercial Times, Wennink also anticipated that this chip war wi...

With the widespread adoption of AI, the demand for GPUs and high-bandwidth memory (HBM) is soaring. The Semiconductor Equipment Association of Japan (SEAJ) has revised its forecast for sales of Japanese-made semiconductor equipment, predicting that for the first time in history, sales will exceed J...