According to a report from The Information, NVIDIA's "world's most powerful AI chip," the GB200, is said to be experiencing yield issues, leading to a one-quarter delay in mass shipments. As per sources cited by a report from the Economic Daily News, it's suggested that the problem likely lies i...

As the demand for AI GPUs increases, TSMC's advanced packaging capacity for CoWoS is struggling to keep up. Recently, according to a report from Commercial Times, NVIDIA has reportedly turned to Intel for advanced packaging solutions. According to industry sources cited by the same report, TS...

Amid the heating tech war between the U.S. and China, and the stringent sanctions imposed to prevent China from obtaining cutting-edge chips, it appears that China is still able to find its way out. According to a report by Tom’s Hardware, citing the New York Times, the latest tactic of China woul...

TSMC's fan-out (InFO) packaging process will no longer be exclusively used by Apple. According to a report from Commercial Times, it's revealed that Google's self-developed Tensor chips for their phones will switch to TSMC's 3nm process next year and will also start using InFO packaging. TSMC...

According to STDaily citing a recent report on the official website of Okinawa Institute of Science and Technology Graduate University (OIST) in Japan announced that, the university has designed an extreme ultraviolet (EUV) lithography technology that surpasses the standard boundary of semiconducto...