Semiconductors


2024-01-10

[News] Microchip’s Disappointing Financial Report Raises Caution in the Semiconductor Industry

On January 8th, leading U.S. microcontroller (MCU) and analog IC manufacturer Microchip raised concerns, stating that the revenue for the last quarter would experience a more significant decline than previously estimated, falling short of overall expectations.

The market perceives Microchip’s financial report as an alarm, revealing the continued sluggishness in sectors such as automotive and consumer electronics. These areas heavily rely on mature process production for related products, impacting mature process-focused foundries like UMC (United Microelectronics Corporation) and Vanguard International Semiconductor (VIS).

Industry sources analyze that Microchip’s warning of poor financial results indicates that, amid the unstable overall economic situation, further observation might be necessary for evaluating this year’s semiconductor market conditions.

Microchip is the global leader in the 8-bit microcontroller market, with a wide range of chip applications that virtually span across all industries. Its customer base exceeds 125,000 in industrial, automotive, consumer, defense, communication, and computer markets. Due to its diverse coverage and extensive customer base, Microchip is regarded as a crucial indicator for observing the semiconductor market.

Market expectations were initially optimistic that, after last year’s industry inventory adjustments, the overall semiconductor market conditions would gradually recover this year. Additionally, the anticipation of new trends such as AI smartphones and AI PCs was expected to drive mid-to-long-term demand in the industry.

However, Microchip’s concern seems to introduce more uncertainty into the market. According to Microchip’s latest projections, the revenue for the third quarter of the fiscal year ending in December is expected to decrease by approximately 22%, surpassing the earlier estimated range of 15% to 20% and significantly exceeding Wall Street’s forecast of 17%.

Microchip’s CEO, Ganesh Moorthy, mentioned in a press release: “The weakening economic environment that our customers and distributors faced during the December 2023 quarter resulted in many of them wanting to receive a lower level of shipments as they took actions to further de-risk their inventory positions.”

Moorthy pointed out that many customers, in their ongoing management of operational activities at the end of the last quarter, extended the closure time of facilities.

He stated, ” The impact of these and related factors was that certain backlog that we had planned to ship when we provided our guidance on November 2, 2023 did not ship to customers before the end of the December quarter. ”

Microchip will release its complete financial report for the last quarter on February 1st.

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(Photo credit: Microchip)

Please note that this article cites information from Economic Daily News

2024-01-10

[Insights] Light Trading, Stable DRAM and NAND Flash Spot Prices

Based on TrendForce’s weekly memory spot price trends released every Wednesday, due to the year-end holiday period, the spot market for DRAM and NAND Flash experiences light trading, and prices remain relatively stable. For details, please refer to the information below:

DRAM Spot Market:

Due to the year-end holiday period, the spot market has been quiet recently and showed no notable price fluctuations. The spot market is also relatively unaffected by smartphone brands’ restocking activities, so the overall sentiment is fairly conservative. Some spot sellers have begun to raise quotes for DRAM chips since January 2, but the demand quantities are insufficient to push up transaction prices. The average spot price of mainstream chips (i.e., DDR4 1Gx8 2666MT/s) rose by 2.54% from US$1.773 last week to US$1.818 this week.

NAND Flash Spot Market:

Transactions have been rather sluggish from the spot market amidst the holiday period, with no apparent price fluctuations. The spot market is not as affected by the recent stock-up demand for smartphones and SSD, and has been relatively conservative in general sentiment, where the lack of demand is insufficient in pulling up concluded prices even with the aggressive ramp up of wafer quotations among several sellers since the beginning of the year. 512Gb TLC wafer has dropped by 0.29% in spot prices, arriving at US$3.117.

2024-01-10

[News] SK Hynix Aims for Doubling Market Value in 3 Years, Considering Alteration On its Production Cut Plan for Q1

SK Hynix CEO Kwak Noh-Jung expressed optimism at the Consumer Electronics Show (CES) in the United States, stating that artificial intelligence (AI) chips would propel SK Hynix’s market value to double within three years, reaching KRW 200 trillion (approximately USD 152 billion).

Kwak also revealed plans to adjust the DRAM production reduction policy in the first quarter, while anticipating changes in NAND Flash production strategy in the latter half of the year.

At the CES exhibition in Las Vegas, Kwak emphasized that generative AI is gradually becoming widespread, and memories are increasingly crucial. With the advancement of AI systems, customer demands for memory will become more diverse. Kwak highlighted the development of a platform to offer customized options for various customers.

“If we prepare the products we are currently producing well, pay attention to maximising investment efficiency and maintaining financial soundness, I think we can attempt to double the current market capitalisation of 100 trillion won to 200 trillion won within three years,” Kwak said.

Kwak further stated in the CES: “There are only three HBM providers in the market. What I can say for sure is that SK Hynix is a clear leader in the HBM space.”

For the current HBM market, as reported by TrendForce earlier, SK hynix holds the lead in HBM3 production, serving as the principal supplier for NVIDIA’s server GPUs.

Samsung, on the other hand, is focusing on satisfying orders from other CSPs. The gap in market share between Samsung and SK hynix is expected to narrow significantly in 2023 due to an increasing number of orders for Samsung from CSPs. Both firms are predicted to command similar shares in the HBM market sometime between 2023 to 2024—collectively occupying around 95%.

Meanwhile, when asked if SK Hynix would ease its current chip production reduction policy, Kwak responded that the company’s policies are flexible and will be adjusted based on different product categories.

He mentioned that SK Hynix might change its DRAM production reduction policy in the first quarter, while adjustments for NAND Flash are anticipated to take place in the latter half of the year.

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(Photo credit: SK Hynix)

Please note that this article cites information from Reuters and Bloomberg

2024-01-09

[News] ASML Senior Management’s Asian Tour, First Stop Reportedly TSMC

ASML, a key chipmaking equipment supplier, is reported to have its incoming CEO, Christophe Fouquet, visiting Taiwan soon. According to Commercial Times citing from supply chain sources, it’s suggested that he will meet with TSMC and other related suppliers to discuss next-generation EUV equipment.

In 2008, Christophe Fouquet joined ASML, holding various management positions. He currently serves as Executive Vice President and Chief Business Officer. In April, he will succeed CEO Peter Wennink, who has held the position since July 2013, upon Wennink’s retirement at the completion of his term.

The high-level visit from ASML’s management to TSMC raises questions about whether it pertains to potential orders for the new “High-NA EUV” (High Numerical Aperture Extreme Ultraviolet Lithography System). TSMC has yet to confirm this, but the company is exploring various possibilities, including investments in advanced packaging.

Industry sources indicate that the cost of High-NA EUV exceeds USD 300 million. Considering the cost-effectiveness balance, TSMC is not in a hurry to adopt it. The primary reason is the imminent need to establish a plant in the United States. It is estimated that future capital expenditures will significantly lean towards expanding production facilities overseas.

Under the U.S. chip export restrictions, ASML halted the shipment of EUV equipment to China in 2019. Under continued pressure from the U.S., the company recently canceled some shipments of Deep Ultraviolet Lithography equipment (DUV) to China.

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(Photo credit: ASML)

Please note that this article cites information from Commercial Times 

2024-01-09

[News] Completion of TSMC’s Kumamoto Plant, Grand Opening on 2/24

TSMC’s foundry in Kumamoto, Japan, has been completed. Currently, the tool-in is underway, with a grand opening ceremony scheduled for February 24th, 2024.

Following this, trial production will commence, with mass production expected by the year-end. The Taiwanese semiconductor supply chain is optimistic about TSMC’s continued investment in local facilities, with plans for establishing service points in Japan.

According to reports from Japanese news source Kyodo News, TSMC’s Kumamoto plant is operated by its Japanese subsidiary, Jasm. Construction commenced in April 2022, with a 24-hour rush to completion. The office building facilities were inaugurated in August 2023, and the four-story, two-basement fab was also completed by the end of last year. The cleanroom’s total area, where production takes place, is approximately 45,000 square meters.

After the grand opening ceremony of TSMC’s Kumamoto plant, trial production will begin, with mass production scheduled by the end of this year. The plant aims to produce 22/28nm and 12/16nm process chips, targeting a monthly capacity of 55,000 wafers. Joint venture partners at the facility include Sony’s subsidiary Sony Semiconductor Solutions and Denso.

According to Japanese media Nikkei Asia, TSMC is currently assessing the construction of a second plant in Kumamoto. The estimated total investment for this new facility is around JPY 2 trillion, and the Japanese Ministry of Economy, Trade, and Industry is considering a subsidy of approximately JPY 900 billion, surpassing the amount for the first plant. TSMC plans to utilize the Kumamoto Fab 2 for the production of 6nm chips. There is potential for further investment in a third plant in the future.

As per a report from Liberty Times Net, with optimism for TSMC’s opportunities in Japan, Taiwan’s semiconductor supply chain is establishing service points in the country.

Cleanroom and MEP (Mechanical, Electrical, Plumbing) integration engineering service provider, Marketech International Corp., has set up a subsidiary in Japan to cater to major clients. Topco Scientific Co. has established SHUNKAWA CO., LTD. in Japan and a branch in Kumamoto to offer specialized chemical warehouse services to major clients.

Analytical testing facility, MA-tek, established a lab in Nagoya over four years ago and expanded with a second lab in Kumamoto last September due to increased demand. Following suit, MSSCORPS Co. plans to establish a testing and analytical center in Tokyo, Japan.

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(Photo credit: TSMC)

Please note that this article cites information from Kyodo NewsNikkei Asia and Liberty Times Net

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