According to a report from South Korean media The Chosun Daily, Samsung Electronics is set to increase wafer input by approximately 30% this quarter at its NAND Flash production lines in Pyeongtaek, South Korea, and Xi’an, China. However, Samsung remains cautious about further production increases to avoid impacting NAND Flash price trends.

The report indicates that while Samsung’s NAND Flash production lines can exceed 2 million wafers in a quarter at full capacity, internal targets for wafer output in the second to fourth quarters are capped at 1.2 million wafers each, maintaining overall utilization rate at around 50%.

Market expectations cited in the same report suggest that Samsung Electronics will reaffirm its stance on reducing NAND Flash production during the first quarter earnings call later this month. In the previous earnings call, Samsung noted persistent high levels of NAND Flash inventory among major customers, necessitating continued aggressive production cuts.

The same report further indicates that SK hynix has set a quarterly cap of around 600,000 wafers for NAND Flash production, with overall utilization rate ranging between 50% and 60%.

As per TrendForce’s data, it has projected a strong 13–18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and WDC boosting their production capacity utilization rates from Q1 this year, other suppliers have kept their production strategies conservative. The slight dip in Q2 NAND Flash purchasing—compared to Q1—does not detract from the overall market’s momentum, which continues to be influenced by decreasing supplier inventories and the impact of production cuts.

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• [News] Memory Manufacturers’ Price Hikes Prompt Backlash, Module Suppliers Hesitate to Follow
• [News] Micron Expects 4-6% Quarterly DRAM Supply Impact Post Taiwan Earthquake

(Photo credit: Samsung)

Driven by AI-driven demand for optical communication and ASICs, Marvell, a major network IC design company, is accelerating its AI-related business. According to a report from Commercial Times, the revenue from this segment is expected to grow from USD 200 million in fiscal year 2023 to USD 550 million in fiscal year 2024.

Marvell previously announced plans to utilize TSMC’s process technology to produce a 2-nanometer chip optimized for accelerating infrastructure. Reports suggest that TSMC will be a primary beneficiary of Marvell’s chip fabrication business.

“The 2nm platform will enable Marvell to deliver highly differentiated analog, mixed-signal, and foundational IP to build accelerated infrastructure capable of delivering on the promise of AI. Our partnership with TSMC on our 5nm, 3nm and now 2nm platforms has been instrumental in helping Marvell expand the boundaries of what can be achieved in silicon,” said Sandeep Bharathi, chief development officer at Marvell, in Marvell’s previous press release.

In addition, Marvell holds a high market share in the global optical communication digital signal processor (DSP) field. Marvell pointed out that AI has accelerated the rate of transmission speed upgrades, reducing the doubling cycle from 4 years to 2 years, thereby driving rapid growth in the company’s performance.

During Marvell AI Day, company management expressed optimism about its AI business outlook and shared the positive news of receiving AI chip orders from large technology companies. At the time, industry sources have speculated that this customer could be Microsoft.

Marvell CEO Matt Murphy revealed that the company has acquired its third AI hyperscale customer and is developing an AI accelerator slated for production in 2026. These orders encompass customized AI training accelerators and AI inference accelerators for Customer A, a customized Arm architecture CPU for Customer B, and a new customized AI accelerator for Customer C.

Marvell indicates that the AI training accelerators for Customer A and the Arm architecture CPU for Customer B are currently in the ramp-up phase for production. The AI inference accelerator for Customer A and the AI accelerator for Customer C are scheduled for production in 2025 and 2026, respectively.

The report cites sources indicating that Marvell’s customer B is Google, and the Arm-based CPU in question is the recently unveiled Google Axion. However, Marvell has not responded to this information.

Marvell highlighted advancements in chip technology, including advanced packaging techniques that integrate multiple chips.

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• [News] The Imminent Arrival of 2-Nanometer Advanced Process
• [News]The 2nm Semiconductor Foundry Race Between TSMC, Samsung, Rapidus Begins with an Equipment Battle

(Photo credit: TSMC)

Amid the memory market’s gradual recovery, memory manufacturers are aggressively increasing prices back to pre-reduction levels and achieve profitability. According to a report from TechNews, however, module suppliers are reportedly resisting these price hikes and considering ways to negotiate with manufacturers, potentially through non-purchasing actions.

With the continued growth in demand for AI and high-performance computing, memory prices are on the rise. According to TrendForce, Kioxia and WDC have increased capacity utilization since Q1 2024, while others maintain low production strategies. Although NAND Flash procurement slightly decreased in the second quarter compared to the first quarter, the overall market sentiment continues to be influenced by reduced supplier inventory and production cut effects. As a result, NAND Flash contract prices for the second quarter are expected to see a strong increase of approximately 13-18%.

Apart from NAND Flash, in the realm of DRAM, although suppliers’ inventories have decreased, they have not yet returned to healthy levels. Moreover, in the context of improving losses, suppliers are increasing capacity utilization.

However, due to unfavorable overall demand prospects for 2024 and significant price hikes by suppliers since the fourth quarter of 2023, the momentum for inventory replenishment is expected to weaken gradually. Therefore, TrendForce predicts that the second-quarter contract price increase for DRAM will converge to 3% to 8%.

Despite the continuous rise in memory prices driven by applications in artificial intelligence and high-performance computing data centers, demand in the consumer market remains subdued. Manufacturers persist in strong pricing strategies, prompting backlash from module suppliers.

Additionally, it is reported that Micron is preparing to increase second-quarter quotes by over 25%, which is putting pressure on module suppliers and potentially leading to a standoff with manufacturers.

On the other hand, module suppliers are showing a lukewarm response to the price increases and are particularly hesitant to accept price increases themselves.

However, with the three major memory manufacturers facing constraints on adding new capacity in the short term, whether module suppliers will be forced to accept significant price increases remains to be seen.

Read more

• [News] Micron Expects 4-6% Quarterly DRAM Supply Impact Post Taiwan Earthquake
• [Insights] The Spot Price of DRAM Continues to Decline, Weak Trading Volume for NAND Flash

The Taiwanese semiconductor foundry Powerchip Semiconductor Manufacturing Corporation (PSMC) has held its earnings call and released its Q1 financial report. According to a report from Liberty Times Net citing information, with increasing capacity utilization, idle capacity costs decreased, boosting gross margin to 15.4%, up 12.3 percentage points from the previous year’s Q4. The net loss narrowed to NTD 439 million after tax, translating to a loss of NTD 0.11 per share.

Looking ahead to a potential turnaround this year, PSMC’s General Manager, Brian Shieh, highlighted that while large-size panel driver ICs are performing relatively well, Chinese foundries are exerting significant pricing pressure on mature processes, impacting average selling prices unfavorably. This remains a key variable affecting profitability.

In response to inflation-driven equipment cost adjustments and market demands, PSMC is revising its product portfolio. They also announced an increased capital expenditure of NTD 32 billion for 2024, which represents a 30% increase from the previously disclosed amount of NTD 24 billion. Powerchip’s Tainan fab has initiated trial production, with future investments focusing on power management IC, memory, and copper processes in the interposer.

Brian Shieh mentioned that PSMC’s capacity utilization rate was around 65% in the fourth quarter of last year. In the first quarter of this year, the utilization rate for logic products improved slightly, while memory product utilization reached 95% to 98%.

He expects memory product utilization to remain at first-quarter levels in the second quarter, with logic product utilization around 65% to 70%. Overall gross margin is anticipated to remain stable or improve compared to the first quarter.

According to TrendForce’s previous report on the fourth quarter of 2023, global semiconductor foundry revenue rankings showed that Intel Foundry Services (IFS), which ranked ninth globally in the third quarter of 2023, was pushed out of the top ten by PSMC and Nexchip due to factors such as the transition between old and new CPU generations and lackluster inventory momentum. At the same time, the top three semiconductor foundries globally were TSMC, Samsung, and GlobalFoundries.

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• [News] PSMC’s Frank Huang Explores Global Expansion through Fab IP, Diverging from TSMC’s Path
• [News] TSMC and PSMC Face Dilemma as Overseas Foundry Costs Skyrocket 2.5 to 4 Times

(Photo credit: PSMC)

The US government announced on April 15th that it will provide up to USD 6.4 billion in subsidies to South Korean semiconductor giant Samsung Electronics for expanding advanced chip production capacity at its Texas plant.

The US government previously approved subsidies of up to USD 8.5 billion for US chip giant Intel and USD 6.6 billion for TSMC to alleviate future semiconductor supply constraints. Semiconductors are currently considered the lifeblood of the global economy.

The Department of Commerce stated in a release, “…the U.S. Department of Commerce and Samsung Electronics (Samsung) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.4 billion in direct funding under the CHIPS and Science Act.”

The statement also mentioned that Samsung Electronics is expected to “invest more than $40 billion dollars in the region in the coming years, and the proposed investment would support the creation of over 20,000 jobs.”

US officials told reporters that this subsidy from the “Chips and Science Act” would assist Samsung Electronics in expanding chip production for use in aerospace, defense, and automotive industries, enhancing US national security.

Lael Brainard, the Director of the White House National Economic Council, emphasized that the resurgence of advanced chip manufacturing in the United States signifies a significant milestone for the domestic semiconductor industry.

US Commerce Secretary Gina Raimondo indicated that this subsidy would support two chip production facilities, one R&D fab, and one advanced packaging facility. She mentioned that this subsidy would also help Samsung expand its semiconductor facility in Austin, Texas.

Raimondo further stated, “…this proposed funding advances America’s leadership in semiconductor manufacturing on the world stage.”

Previously, the U.S. government announced that Intel would receive USD 8.5 billion in federal subsidies and USD 11 billion in loans. Intel is planning to invest USD 100 billion across four states in the U.S. for building and expanding fabs, and is also seeking an additional USD 25 billion in tax credits.

On the other hand, US administration is set to provide USD 6.6 billion in aid to TSMC, which plans to build a third chip plant in Arizona with a total investment of USD 65 billion.

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• [News] The US Administration Rumored to Announce USD 7 Billion Grant for Samsung to Boost Chip Capacity
• [News] TSMC Receives USD 6.6 Billion for Chipmaking from the US Government, Commits to Constructing Third Fab