Memory manufacturer Micron Technology stated on April 11 that the earthquake in Taiwan on April 3 has impacted its DRAM supply, estimated to be between 4-6% (mid-single digit percentage).

Micron emphasized in an 8-K filing with the U.S. Securities and Exchange Commission (SEC) that the earthquake did not cause permanent damage to its facilities, infrastructure, or equipment, and will not have a long-term effect on DRAM supply.

Micron noted that as of now, DRAM production post-earthquake has not fully recovered, but progress in facility restoration is promising thanks to efforts by the Taiwan team.

In February this year, Micron announced the commencement of mass production of high-bandwidth memory (HBM) chips, designed for use in NVIDIA’s H200 GPU for AI applications.

In March, Micron CEO Sanjay Mehrotra indicated that the company’s HBM chips earmarked for AI applications are sold out for 2024, with much of the 2025 supply already allocated.

Micron previously described HBM chips as utilizing stacked DRAM technology. The company did not specify whether the HBM supply would be affected by the earthquake.

Per a previous TrendForce press release, the three major original HBM manufacturers held market shares as follows in 2023: SK Hynix and Samsung were both around 47.5%, while Micron stood at roughly 5%.

As per Micron’s previous report, regarding growth outlooks for various end markets in 2024, the annual growth rate for the data center industry has been revised upward from mid-single digits to mid-to-high single digits, while the PC industry’s annual growth rate remains at low to mid-single digits. AI PCs are expected to capture a certain market share in 2025. The annual growth rate for the mobile phone industry has been adjusted upward from modest growth to low to mid-single digits.

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• [News] Micron’s Financial Report Reveals High Demand for HBM in 2025, Capacity Nears Full Allocation
• [News] Micron Begins Mass Production of HBM3e for NVIDIA’s H200

(Photo credit: Micron)

According to a report from Nikkei Asia, Chinese tech giant Huawei is building a semiconductor equipment research and development center in Shanghai to navigate U.S. export controls and strengthen its chip supply chain.

As per the same report from Nikkei Asia, Huawei is offering salaries double that of its competitors to recruit experienced talent. However, industry sources cited by the same report suggest that Huawei’s demanding work culture may make retaining talent challenging, despite the attractive pay.

The report further highlights the center’s crucial role in developing photolithography machines, essential for advanced chip production. U.S. export controls have made it difficult for Huawei to access such equipment, which is primarily manufactured by three global leaders: ASML from the Netherlands, Nikon, and Canon from Japan.

Sources cited in the report has revealed that Huawei’s new research center is located in the western Qingpu district of Shanghai, featuring spacious grounds housing the main chip development center and the new headquarters of HiSilicon, Huawei’s semiconductor design division.

The area also hosts wireless technology and smartphone development centers. As per the Qingpu District People’s Government in Shanghai, once completed, the park will accommodate over 35,000 high-tech workers.

To attract talent, Huawei reportedly offers salaries twice that of local chip manufacturers. Industry sources cited in the report further noted that Huawei has recruited engineers with experience collaborating with top global semiconductor equipment manufacturers like Applied Materials, Lam Research, KLA, and ASML. Engineers with over 15 years of experience at chip manufacturers such as TSMC, Intel, and Micron are also on Huawei’s potential recruitment list.

The export control measures implemented by the United States in recent years have made it more difficult for Chinese citizens to work for global chip companies in China. This has left Huawei and other Chinese semiconductor enterprises with a larger pool of top chip talent to choose from.

Regarding the matter, TrendForce has addressed the export restrictions on semiconductor equipment by the US and its allies present significant hurdles for Chinese foundries in obtaining essential tools. To counter these challenges, the Chinese government, alongside local suppliers, is intensifying R&D efforts to produce domestic semiconductor equipment, especially for 16/12nm processes and smaller.

This has led to increased collaboration between Chinese foundries and local suppliers in both R&D and qualification processes. Despite these efforts, China’s progress in lithography tools is limited to the 90nm node, which remains a significant obstacle in achieving complete self-sufficiency in semiconductor equipment.

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• [News] US Considers Sanctioning Huawei-Linked Chinese Chip Network, Huawei-Related Enterprises Blacklisted
• [News] US Government Considers Adding ChangXin Memory Technologies to Entity List, Imposing Further Sanctions on Chinese Firms

(Photo credit: Huawei)

The sweeping AI wave not only keeps AI chips in the market spotlight but also ushers in a new round of opportunities for the memory market. Recently, Citibank announced that SSD will replace HDD in the AI field, citing SSD’s faster speed, which are more suitable for AI training. It is reported that data centers of top US tech companies are shifting from HDD to enterprise SSD.

From consumer electronics to enterprise markets, and now in the era of AI, the battle between SSD and HDD is underway once again .

• Can SSD Fully Replace HDD?

Industry sources point out that SSD surpass HDD by nearly 10 times in terms of access speed, while HDD boasts the advantage of lower cost.

According to a previous report from Nikkei Asia, in recent years, as NAND Flash prices declined in a downward cycle, the cost gap between SSD and HDD has begun to narrow, enabling SSD to gradually replace HDD in some fields. For instance, in consumer PC storage devices below 2TB, HDD have been phased out and replaced by SSD.

This seems to indicate that SSD has significantly outpaced HDD, but it is still difficult to say that SSD will completely replace HDD. After all, compared to consumer products, data centers have higher performance requirements for SSD. Furthermore, from a cost perspective, enterprises face significant pressure if they want to fully substitute SSD for HDD.

The current AI boom has provided opportunities for the development of both HDD and SSD, with a surge in demand for high-capacity products leading to price increases.

Industry sources reveal that HDD manufacturers reduced supply due to poor market conditions last year. With the arrival of the AI wave, supply of HDD outbalanced demand in 2H23, driving prices higher. From 3Q23 to 1Q24, HDD prices have increased by 10-20% overall. The latest reports show that Western Digital has recently notified customers of continuous price increases for HDD products. Industry sources expect HDD market prices to continue to rise in 2Q24, with increases ranging from 5% to 10%.

Likewise, SSD market is also facing supply shortages, especially in the enterprise SSD segment. TrendForce predicts a strong increase of about 13-18% in NAND Flash contract prices in 2Q24, with enterprise SSD contract prices expected to increase by 20-25% QoQ, representing the highest among all product lines.

At present, SSD and HDD are expected to coexist and progress together. However, looking ahead to the future, some memory manufacturers hope that SSD can continue to advance and even replace HDD.

In 2023, Shawn Rosemarin, Vice President of Research and Development Department of Pure Storage, stated that HDD would be completely phased out within 5 years. HDD consume too much power; 3% of global electricity used for data centers, and one-third of this power consumption comes from storage systems, the majority of which are mechanical hard drives. The cost difference in operating such large-scale deployments is striking. If the storage device is shifted to SSD, power consumption will be reduced by 80-90%.

However, HDD manufacturers have countered this statement. Rainer Kaese, Senior Manager of HDD Business Development Department at Toshiba, believes that HDD will continue to exist for some time. In the long run, they will continue to be cheaper than SSD, and data center engineers will develop more efficient HDD to meet stricter power consumption requirements.

The debate between these two sides reveals the respective strengths and weaknesses of SSD and HDD. As manufacturers continue to enhance performance, reduce costs, and lower power consumption, the competition between SSD and HDD is expected to continue in the future.

Read more

• [News] Western Digital Customer Letter Confirms HDD Supply Shortage! NAND Flash and Hard Drive Prices Continue to Rise
• [News] SSD Prices Keep Rising

(Photo credit: Western Digital)

Meta Platform, parent company of Facebook, has announced its latest generation AI chip of its Training and Inference Accelerator (MTIA) on April 10th, fabricated using TSMC’s 5nm process. According to a report from Commercial Times, this move is expected to reduce Meta’s reliance on NVIDIA’s chips and enhance computational power for AI services.

In its shift towards AI services, Meta requires greater computational capabilities. Thus, last year, Meta introduced its AI models to compete with OpenAI’s ChatGPT. The latest AI chip, Artemis, is an upgraded version of MTIA introduced last year, assisting platforms like Facebook and Instagram with content ranking and recommendations.

Meta’s new generation AI chip will be produced by TSMC using the 5nm process. Meta reveals that Artemis offers triple the performance of the first-generation MTIA.

In October last year, Meta announced plans to invest USD 35 billion to establish infrastructure supporting AI, including data centers and hardware. CEO Mark Zuckerberg told investors, “In terms of investment priorities, AI will be our biggest investment area in 2024 for both engineering and compute resources.”

Meta’s proprietary AI chips are deployed in data centers to power AI applications. Meta has several ongoing projects aimed at expanding MTIA’s application scope, including supporting generative AI workloads.

The trend of tech giants developing their own AI chips is evident, with Meta joining competitors like Amazon, Microsoft, and Google in internal AI chip development to reduce reliance on NVIDIA. Google recently unveiled its latest data center AI chip, TPU v5p, on the 9th. Meanwhile, Intel is targeting NVIDIA’s H100 with its new AI chip, Gaudi 3.

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• [News] NVIDIA’s H100 AI Chip No Longer Out of Reach, Inventory Pressure Reportedly Forces Customers to Resell

(Photo credit: Meta)

According to a report by Nikkei News, Japan’s official support for the semiconductor industry expenditure, relative to its gross domestic product (GDP), is significantly higher than that of the United States and other major Western countries.

Figures submitted by a subcommittee under Japan’s Ministry of Finance’s Fiscal System Council show that Japan will invest JPY 3.9 trillion (approximately USD 25.7 billion) over the next three years, equivalent to 0.71% of its GDP. In comparison, the United States will invest more, with JPY 7.1 trillion over five years, but this represents only 0.21% of its GDP, less than one-third of Japan’s ratio.

Over the next five years, France’s expenditure amounts to JPY 700 billion, equivalent to 0.2% of its GDP. Germany’s expenditure stands at JPY 2.5 trillion, equivalent to 0.41% of its GDP.

On Monday, the U.S. Department of Commerce announced a direct subsidy of up to USD 6.6 billion to TSMC, aiming to attract more investments from TSMC within the United States. Meanwhile, in Japan, TSMC secured approximately JPY 1.2 trillion (USD 7.5 billion).

Nikkei notes that Japan’s JPY 3.9 trillion investment in the semiconductor industry involves supplementary budgets, leading to a sharp increase in spending. Thus, the Ministry of Finance is concerned about the lack of funding sources for official support of semiconductor manufacturing. According to Nikkei News, only over JPY 500 billion of Japan’s semiconductor industry expenditures have been covered by actual funds.

One funding source is GX bonds, which the government has started issuing for economic green transformation to achieve net-zero emissions by 2050. GX bonds are expected to raise approximately JPY 20 trillion over the next decade, to be repaid using carbon tax revenue.

TrendForce has previously reported that Japan’s resurgence in the semiconductor arena is palpable, with the Ministry of Economy, Trade, and Industry fostering multi-faceted collaborations with the private sector. With a favorable exchange rate policy aiding factory construction and investments, the future looks bright for exports.

Read more

• [News] TSMC Receives USD 6.6 Billion for Chipmaking from the US Government, Commits to Constructing Third Fab
• [News] Subsidies to TSMC from Japan and China Increase Over Fivefold Annually

(Photo credit: TSMC)