Semiconductors


2024-09-02

[News] NVIDIA and Apple May Follow Microsoft’s Footsteps in the New Round of OpenAI Investment

The Wall Street Journal reported that OpenAI is in talks for a new round of funding, with tech giants Apple and NVIDIA both interested in investing in the AI research company OpenAI.

It’s reported that this investment will be part of OpenAI’s new round of financing, which will bring its estimated value to exceed USD 100 billion.

Sources indicated that OpenAI plans to raise billions of dollars, and venture capital firm Thrive Capital will lead this round of funding with a USD 1 billion investment. Microsoft, OpenAI’s largest shareholder, will also be a part of this round.

Reportedly, sources have revealed that Apple is currently in talks with OpenAI for the potential investment, while NVIDIA has already discussed joining the latest round of funding, who reportedly considered investing USD 100 million.

Although it is not yet clear how much Apple and Microsoft plan to invest, the point is that the three most valuable tech giants in the world would all become shareholders of OpenAI if these negotiations end in success.

In a memo on Wednesday, OpenAI’s CFO Sarah Friar stated that the company is seeking new financing but did not disclose specific details. Friar mentioned that OpenAI would leverage this funding to strengthen computing power and cover other operational expenses.

With the rise of the AI industry, Microsoft, Apple, and NVIDIA have also accelerated their pace in developing AI technologies.

Microsoft has invested USD 13 billion in OpenAI since 2019, holding a stake of 49% in this company. Apple, at its Worldwide Developers Conference (WWDC) in June this year, launched the Apple Intelligence system and announced a partnership with OpenAI.

As for NVIDIA, it has long been closely collaborating with OpenAI and has been highly active in making investment in this field. Its investment arm, NVentures, has invested in several AI companies since 2023.

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(Photo credit: OpenAI)

Please note that this article cites information from the Wall Street Journal and WeChat account DRAMeXchange.

2024-09-02

[News] A 8-Inch SiC Wafer Fab Co-Built by San’an and ST to Start Production Soon

As per Chongqing News Broadcast, the San’an-ST project, with a total investment of approximately CNY 30 billion, is close to completion. The substrate factory is expected to start production this month, two months ahead of schedule.

The project, jointly developed by Chongqing San’an and ST, includes a chip factory and a substrate factory, focusing on the production of SiC power chips and substrates. The substrate factory, fully funded by San’an Semiconductor, is set to produce 480,000 8-inch SiC substrates annually.

The chip plant, a joint venture between San’an Semiconductor and ST, aims for an annual production capacity of 480,000 automotive-grade SiC MOSFET power chips.

San’an, through its wholly-owned subsidiary Hunan San’an, established Chongqing San’an for the substrate factory. The total investment for this factory is approximately CNY 7 billion, focusing on the growth and manufacturing of SiC substrates, with an annual production capacity of 480,000 8-inch SiC substrates.

San’an STMicroelectronics, a joint venture between Hunan San’an (51%) and ST (China) Investment (49%), was established in August 2023 with a registered capital of USD 612 million.

This chip factory has a total investment of USD 3.2 billion and aims for an annual revenue of CNY 13.9 billion, with an annual production capacity of 480,000 8-inch automotive-grade SiC MOSFETs.

San’an has disclosed that the project is currently in the critical stage of equipment installation and commissioning, and the substrate factory is expected to be ready for operation by the end of August, while the chip factory is projected to be fully operational by the end of November.

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(Photo credit: STMicroelectronics)

Please note that this article cites information from WeChat account DRAMeXchange.

2024-08-30

[News] Intel Reportedly Considering Foundry Spin-Off or Merger to Mitigate Losses

In a report by Bloomberg on August 29 citing sources, it’s rumored that Intel Corp. is working with investment bankers to navigate what is described as the most challenging period in its 56-year history.

Reportedly, Intel is said to be exploring various options, including spinning off its product design and foundry businesses, and canceling certain construction plans. Notably, Morgan Stanley and Goldman Sachs have been advising Intel, with merger being one of the options on the table.

Multiple options are expected to be presented at the board meeting in September. According to sources cited by Bloomberg, Intel is unlikely to spin off its foundry business unless absolutely necessary. The company is rumored to favor more moderate approaches, such as delaying certain expansion plans.

Per another report from CNBC, during the Deutsche Bank’s Technology Conference on August 29, Intel CEO Pat Gelsinger acknowledged that the past few weeks have been challenging. He then emphasized that the company is prepared to face the market’s criticism and tackle the challenges ahead.

Gelsinger further mentioned that the surge in AI has led to weaker performance in Intel’s server business, a challenge the company is still working to address. However, he remains optimistic about the future, noting that the finish line is already in sight.

He also mentioned that Intel will soon launch “Lunar Lake,” which he described as the most compelling PC product the company has ever developed.

Intel is currently facing significant challenges. On August 1, the company announced financial results that fell short of Wall Street expectations and revealed plans to cut over 15% of its workforce.

Gelsinger noted that the layoffs would impact approximately 15,000 employees. He acknowledged that Intel’s revenue growth has been below expectations and that the company has not yet benefited from trends like AI. Gelsinger highlighted issues with high costs and low profit margins as well, stating that he never anticipated an easy path ahead.

A report from Reuters also revealed that former Intel board member Lip-Bu Tan has stepped down after just two years. Tan, who was previously the CEO and executive chairman of electronic design automation (EDA) software company Cadence Design Systems Inc..

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(Photo credit: Intel)

Please note that this article cites information from BloombergCNBC and Reuters.

2024-08-30

[News] Taiwanese Supply Chain to Benefit from Supermicro’s Order Withdrawal, with Dell and HP as Potential Beneficiaries

On August 27, AI server giant Supermicro was accused of accounting violations, inadequate disclosure of related party transactions, and evading sanctions by selling products to Russia by short-seller Hindenburg Research.

In addition, Supermicro announced on August 28 that it would delay the release of its annual report, potentially facing order withdrawals. Industry sources also believe this news presents a chance for Supermicro’s competitor Dell to gain market share.

Besides Dell, a report from Commercial Times also points out that Hewlett Packard Enterprise (HPE) could benefit from the shift in orders, potentially boosting shipments for its Taiwanese supply chain partners such as Wistron, Inventec, Quanta, and Foxconn.

The report from Commercial Times also cite sources, suggesting that this shift could provide Gigabyte, which is actively promoting its liquid-cooled products for NVIDIA’s H200 series, with  opportunities in the second half of the year.

Wistron, as a key supplier of motherboard and GPU accelerator cards for NVIDIA’s Hopper and Blackwell GPU, is not only a major supplier for Supermicro’s server motherboards but also for Dell. Its clients include HPE and Lenovo as well, which makes the company one of the primary beneficiaries.

Similarly, Inventec, one of the server motherboard suppliers, is also expected to benefit if the shift in orders boosts Dell, HPE, and Lenovo.

Moreover, one of Supermicro’s largest clients, CoreWeave, is transitioning to become a cloud computing service provider specializing in GPU-accelerated computing.

This shift has increased demand for GPU-accelerated computing and liquid cooling solutions. Reportedly, it’s believed that Gigabyte, which holds orders from CoreWeave, could be one of the biggest beneficiaries of the upcoming order shift.

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(Photo credit: Supermicro)

Please note that this article cites information from Hindenburg ResearchSupermicro and Commercial Times.

2024-08-30

[News] ASML Might Not Be Able to Provide Advanced Chipmaking Maintenance Services to China as Early as 2025

Earlier in July, former ASML CEO Peter Wennick stated that the chip war between the U.S. and China may continue for quite a long time, even for decades. Now his prophecy seems to come true, as the Netherlands is said to ban the semiconductor equipment giant from conducting equipment maintenance and providing related backup components in China, according to the latest report by Bloomberg.

As the targets of the measure reportedly includes ASML’s deep ultraviolet (DUV) lithography systems, if implemented, the move would be a heavy blow to China’s semiconductor industry, especially on the development of advanced nodes, the report notes.

On the other hand, regarding ASML’s sales in lithography units in the second quarter of 2024, China emerged as the largest market, as it contributed 49% of the revenue, higher than South Korea’s 28% and Taiwan’s 11%. Therefore, the reported restriction will be a major setback for the company’s financial performance.

The report from Bloomberg, citing sources familiar with the matter, indicates that the government led by Dutch Prime Minister Dick Schoof is unlikely to renew some of ASML’s licenses for maintenance and the provision of backup components in China, which are set to expire at the end of 2024. These licenses include those related to ASML’s sale of DUV lithography equipment.

The report further suggests that ASML’s products are usually sold with maintenance agreements, which are crucial for the equipment to operate properly and continuously. Therefore, if ASML’s licenses for maintenance and the provision of backup components to China are no longer granted, some equipment may be unable to function properly as early as 2025.

In response to the rumors, both ASML and the Dutch Ministry of Foreign Affairs have declined to comment, Bloomberg notes.

In terms of the reason behind the move, the report states that the decision may be made after the Dutch government received pressure from the U.S. Citing a senior official from the Biden administration, if the super power’s allied countries do not agree to align with Washington on semiconductor controls against China, the U.S. government could propose certain unilateral measures against partner countries, including the use of the Foreign Direct Product Rule (FDPR).

The measure allows the U.S. to control transactions involving foreign products that use U.S. technology, thus is considered to be a tactic leveraged to push its allies, including the Netherlands, Japan and South Korea, to impose restrictions on semiconductor equipment exports to China.

According to a previous report by Reuters, since 2019, ASML has been prohibited from selling its most advanced EUV tool line in China as part of a U.S.-led effort to curb Beijing’s technological and military progress. Afterwards, China had to rely on ASML’s DUV lithography machines to advance in its semiconductor manufacturing technology.

As per a report by Wccftech in May, SMIC seems to be able to use ASML’s old DUV lithography machines to manufacture 5nm chips for Huawei. Therefore, if ASML stops servicing and supplying parts for DUV machines in China in the future, companies like Huawei and its foundry partner SMIC will find it increasingly difficult to make breakthroughs with their existing capabilities.

The latest report by Bloomberg emphasized that ASML’s CFO, Roger Dassen, confirmed in a July earnings call that the company still has employees in the fabs of Chinese customers. Therefore, if the maintenance ban is implemented, ASML will have to withdraw the employees who provide equipment services to Chinese semiconductor companies.

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(Photo credit: ASML)

Please note that this article cites information from BloombergReuters and Wccftech.
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