In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and processors needed for high-performance chips, in much smaller sizes. Now, at the Samsung Foundry Forum in San Jose taken place in June, the tech giant...

Taiwan's semiconductor giant, TSMC, faces overwhelming demand for its 3nm technology, with major clients like Apple and NVIDIA fully allocate its production capacity. According to a report from Commercial Times, orders are expected to be filled through 2026. Reportedly, TSMC is planning to raise ...

One major challenge for China's IC design industry is the lack of advanced domestic Electronic Design Automation (EDA) tools. Due to US export controls, suppliers like Cadence and Synopsys are unable to provide chip design software to China. Additionally, the absence of domestic EDA tools capable ...

Following US sanctions in August 2019, Huawei's internal operating system backup, HarmonyOS, emerged and has been in development for nearly 5 years. Currently, HarmonyOS is widely recognized, and its native version is set to launch on June 21st, marking the cornerstone of Huawei's ambitious HarmonyO...

The intense price competition among Chinese mature process foundries is nearing its end. According to a report from the Economic Daily News, it has indicated that Hua Hong Semiconductor, the second-largest foundry in China, plans to raise prices by 10% in the second half of the year. This marks t...