The application period for the tax incentives under Taiwan's Chip Act ended in late May. According to a report from the Economic Daily News, the Ministry of Economic Affairs announced on June 3rd that four semiconductor-related companies have applied, with the review process expected to be completed...

On May 31, STMicroelectronics announced to build a new high-volume 200mm silicon carbide (SiC) facility in Catania, Italy, for power devices and modules as well as test and packaging. According to a report from WeChat account DRAMeXchange, the new plant aims to commence production in 2026 and ra...

At TSMC’s 2024 Technology Symposium in late May, Kevin Zhang, TSMC Senior Vice President of Business Development, has shared the company’s latest development on advanced packaging. This article recaps the highlights in the forum, featuring TSMC's breakthroughs regarding advanced packaging. ...

AMD Chairman and CEO Lisa Su unveiled the company's latest AI chip, MI325X, at the opening of Computex Taipei on June 3. She emphasized that the MI325X boasts 30% faster computing speed compared to NVIDIA's H200. According to a report from CNA, Su also announced that AMD plans to release a new gener...

According to a report from Chinese media outlet "Phoenix New Media," Zhang Ping'an, Executive Director of Huawei and CEO of Huawei Cloud Computing Technologies, acknowledged that China is unlikely to achieve 3nm or 5nm processes and emphasized that solving issues relating to 7nm would be good enough...