With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power.

Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations and manufacturing costs have increased. Therefore, besides continuing to develop advanced processes, the semiconductor industry is also exploring other ways to maintain chip size while ensuring high efficiency.

The concept of “heterogeneous integration” has become a contemporary focus, leading to the transition of chips from single-layer to advanced packaging with multiple layers stacked together.

The term “CoWoS” can be broken down into the following definitions: “Cow” stands for “Chip-on-Wafer,” referring to the stacking of chips, while “WoS” stands for “Wafer-on-Substrate,” which involves stacking chips on a substrate.

Therefore, “CoWoS” collectively refers to stacking chips and packaging them onto a substrate. This approach reduces the space required for chips and offers benefits in reducing power consumption and costs.

Among these, CoWoS can be further divided into 2.5D horizontal stacking (most famously exemplified by TSMC’s CoWoS) and 3D vertical stacking versions. In these configurations, various processor and memory modules are stacked layer by layer to create chiplets. Because its primary application lies in advanced processes, it is also referred to as advanced packaging.

According to TrendForce’s data, it has provided insights into the heat of the AI chip market. In 2023, shipments of AI servers (including those equipped with GPU, FPGA, ASIC, etc.) reached nearly 1.2 million units, a 38.4% increase from 2022, accounting for nearly 9% of the overall server shipments.

Looking ahead to 2026, the proportion is expected to reach 15%, with a compound annual growth rate (CAGR) of AI server shipments from 2022 to 2026 reaching 22%.

Due to the advanced packaging requirements of AI chips, TSMC’s 2.5D advanced packaging CoWoS technology is currently the primary technology used for AI chips.

GPUs, in particular, utilize higher specifications of HBM, which require the integration of core dies using 2.5D advanced packaging technology. The initial stage of chip stacking in CoWoS packaging, known as Chip on Wafer (CoW), primarily undergoes manufacturing at the fab using a 65-nanometer process. Following this, through-silicon via (TSV) is carried out, and the finalized products are stacked and packaged onto the substrate, known as Wafer on Substrate (WoS).

As a result, the production capacity of CoWoS packaging technology has become a significant bottleneck in AI chip output over the past year, and it remains a key factor in whether AI chip demand can be met in 2024. Foreign analysts have previously pointed out that NVIDIA is currently the largest customer of TSMC’s 2.5D advanced packaging CoWoS technology.

This includes NVIDIA’s H100 GPU, which utilizes TSMC’s 4-nanometer advanced process, as well as the A100 GPU, which uses TSMC’s 7-nanometer process, both of which are packaged using CoWoS technology. As a result, NVIDIA’s chips account for 40% to 50% of TSMC’s CoWoS packaging capacity. This is also why the high demand for NVIDIA chips has led to tight capacity for TSMC’s CoWoS packaging.

TSMC’s Expansion Plans Expected to Ease Tight Supply Situation in 2024

During the earnings call held in July 2023, TSMC announced its plans to double the CoWoS capacity, indicating that the supply-demand imbalance in the market could be alleviated by the end of 2024.

Subsequently, in late July 2023, TSMC announced an investment of nearly NTD 90 billion (roughly USD 2.87 billion) to establish an advanced packaging fab in the Tongluo Science Park, with the construction expected to be completed by the end of 2026 and mass production scheduled for the second or third quarter of 2027.

In addition, during the earnings call on January 18, 2024, TSMC’s CFO, Wendell Huang, emphasized that TSMC would continue its expansion of advanced processes in 2024. Therefore, it is estimated that 10% of the total capital expenditure for the year will be allocated towards expanding capacity in advanced packaging, testing, photomasks, and other areas.

In fact, NVIDIA’s CFO, Colette Kress, stated during an investor conference that the key process of CoWoS advanced packaging has been developed and certified with other suppliers. Kress further anticipated that supply would gradually increase over the coming quarters.

Regarding this, J.P. Morgan, an investment firm, pointed out that the bottleneck in CoWoS capacity is primarily due to the supply-demand gap in the interposer. This is because the TSV process is complex, and expanding capacity requires more high-precision equipment. However, the long lead time for high-precision equipment, coupled with the need for regular cleaning and inspection of existing equipment, has resulted in supply shortages.

Apart from TSMC’s dominance in the CoWoS advanced packaging market, other Taiwanese companies such as UMC, ASE Technology Holding, and Powertek Technology are also gradually entering the CoWoS advanced packaging market.

Among them, UMC expressed during an investor conference in late July 2023 that it is accelerating the deployment of silicon interposer technology and capacity to meet customer needs in the 2.5D advanced packaging sector.

UMC Expands Interposer Capacity; ASE Pushes Forward with VIPack Advanced Packaging Platform

UMC emphasizes that it is the world’s first foundry to offer an open system solution for silicon interposer manufacturing. Through this open system collaboration (UMC+OSAT), UMC can provide a fully validated supply chain for rapid mass production implementation.

On the other hand, in terms of shipment volume, ASE Group currently holds approximately a 32% market share in the global Outsourced Semiconductor Assembly and Test (OSAT) industry and accounts for over 50% of the OSAT shipment volume in Taiwan. Its subsidiary, ASE Semiconductor, also notes the recent focus on CoWoS packaging technology. ASE Group has been strategically positioning itself in advanced packaging, working closely with TSMC as a key partner.

ASE underscores the significance of its VIPack advanced packaging platform, designed to provide vertical interconnect integration solutions. VIPack represents the next generation of 3D heterogeneous integration architecture.

Leveraging advanced redistribution layer (RDL) processes, embedded integration, and 2.5D/3D packaging technologies, VIPack enables customers to integrate multiple chips into a single package, unlocking unprecedented innovation in various applications.

Powertech Technology Seeks Collaboration with Foundries; Winbond Electronics Offers Heterogeneous Integration Packaging Technology

In addition, the OSAT player Powertech Technology is actively expanding its presence in advanced packaging for logic chips and AI applications.

The collaboration between Powertech and Winbond is expected to offer customers various options for CoWoS advanced packaging, indicating that CoWoS-related advanced packaging products could be available as early as the second half of 2024.

Winbond Electronics emphasizes that the collaboration project will involve Winbond Electronics providing CUBE (Customized Ultra-High Bandwidth Element) DRAM, as well as customized silicon interposers and integrated decoupling capacitors, among other advanced technologies. These will be complemented by Powertech Technology’s 2.5D and 3D packaging services.

Read more

• [News] AMD Eyes CoWoS-like Supply for AI Chips with TSMC Full Capacity
• [News] Samsung Boosts 2.5D Packaging Equipment to Compete for TSMC’s CoWoS Orders

(Photo credit: TSMC)

Industry sources cited by the Liberty Times Net have pointed out that the Kumamoto plant holds significant importance for both Taiwan and Japan, as Japan is expected to look for attracting investments from TSMC, Intel, and Samsung to establish manufacturing facilities in the country.

TSMC stands out as essential due to its critical role as a key supplier to Apple, whose products are also utilized by the US military. Under geopolitical considerations, Apple needs to diversify its production beyond Taiwan and China. Therefore, it may hope TSMC can provide chip production in Japan soon and establish comprehensive advanced packaging services in the future. It seems inevitable that TSMC will eventually invest in setting up advanced packaging facilities in Japan.

Establishing Comprehensive Advanced Packaging Services

The TSMC Kumamoto plant commenced construction in April 2022 and was completed in just one year and eight months. While the construction of the US plant began in early 2021, setbacks in construction has led to the postponement of the production schedule from this year to the next.

Japan is also facing severe labor shortages, but the construction industry in Japan has made significant progress. It is highly industrialized, utilizing modular structures prefabricated in plants and then transported to construction sites for installation, thus reducing the need for on-site labor. In the construction of the Kumamoto plant, Japan’s construction firm, Kajima Corporation, was the general contractor.

German Construction Firm Sends Team to Learn from Japan

The German government actively subsidizes efforts to attract TSMC to invest in establishing  plants. In August last year, TSMC finalized partnerships with Bosch, Infineon, and NXP Semiconductors to form the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany.

According to a report from Liberty Times Net, construction is expected to begin in the second half of this year, with mass production slated to start by the end of 2027. It is also reported that Exyte, a German engineering services firm (formerly known as M+W), has recently sent a team to learn from the Kumamoto plant.

Read more

• 2024 Apple Vision Pro Shipments Estimated Between 500–600 Thousand Units, Micro OLED Key to Cost and Volume, Says TrendForce
• [News] Market Rumors Suggest Apple Vision Pro Stock Limited to 60-80K Units, Expected to Quickly Sell Out Post-Launch

(Photo credit: TSMC)

The latest financial reports for 4Q23 from six leading global semiconductor foundries signal optimism for the semiconductor industry’s recovery in 2024.

In 2023, the semiconductor sector underwent significant adjustments. As the industry worked towards normalizing its inventory levels amidst ongoing high inflation risks, the short-term market outlook remained unclear. #TrendForce has analyzed the latest financials from these six foundries to provide insights into what 2024 might hold for the industry.

TSMC

TSMC reported a slight YoY revenue decrease of 1.5% to US$19.62 billion in 4Q23, though it saw a 13.6% increase from the previous quarter. With an anticipated CAGR of 15–20%, TSMC’s 2024 capital expenditures are expected to be between $28 billion and $32 billion.

The company forecasts more than 10% growth in the semiconductor market (excluding memory) and around 20% growth in the wafer fabrication sector for 2024.

Samsung Electronics

Samsung Electronics’ 4Q23 consolidated revenue fell 3.81% YoY to ₩67.78 trillion. Its DS division reported revenues of ₩21.69 trillion but faced an operating loss of ₩2.18 trillion.

Despite the challenges, Samsung is focusing on advancing 3nm and 2nm GAA process technologies, expecting a revival in smartphone and PC demand in 2024 to rejuvenate the foundry market to its former prosperity.

Intel

Intel’s 4Q23 earnings saw a 10% revenue increase to $15.406 billion, with its foundry business, Intel Foundry Services, jumping 63% to $291 million in revenue.

Despite seasonal demand slumps in its core PC and server segments, Intel’s AI chips have accumulated $2 billion in orders, with sales forecast to improve in the second half of the year.

Global Foundries

GlobalFoundries reported a 12% revenue drop in 4Q23 to $1.85 billion, with a net income of $356 million. The company anticipates 1Q24 revenues to range between $1.5 billion and $1.54 billion, primarily due to the current industry-wide chip inventory adjustments.

Nevertheless, GlobalFoundries expects its 2023 automotive market revenue to surpass $1 billion, forecasting continued growth into 2024.

UMC

UMC disclosed a 19% YoY decrease in 4Q23 revenues to $1.79 billion. The company cited an extended semiconductor industry inventory adjustment period due to a challenging global economic climate, leading to a slight reduction in wafer shipments and capacity utilization. UMC expects a gradual uptick in wafer demand through 1Q24.

SMIC

SMIC reported a modest increase in 4Q23 revenues to $1.68 billion, with a 0-2% growth projection for 1Q24. Despite last year’s cyclical lows and competitive pressures, SMIC anticipates its 2024 revenue growth will at least match the industry average, with capital expenditures mirroring those of 2023.

TrendForce had earlier forecasted a delayed recovery in the end-market by the fourth quarter of 2023. However, they noted that inventory stocking by Chinese Android firms for the year-end sales rush—particularly for mid-to-low-end 5G and 4G smartphone application processors—alongside the influence of new Apple iPhone releases, might surpass initial expectations.

This indicates that the revenues of the world’s top ten semiconductor foundries are poised for growth, potentially surpassing the growth rates observed in the third quarter.

(Photo credit: Samsung)

According to TrendForce’s compilation and analysis of various industry data and the recent financial reports of major representative companies, it appears that China’s local equipment industry can cover the various stages required in semiconductor manufacturing processes (excluding lithography machines).

Overall, locally produced equipment in China shows relatively high localization rates in processes such as photoresist stripping, cleaning, and etching. In recent years, there has been significant progress in processes like CMP, thermal processing, and deposition. However, in equipment related to measurement, coating and developing, lithography, and ion implantation, the Chinese equipment manufacturers still face challenges.

As per SEMI data, the semiconductor equipment market, including wafer processing, fab facilities, and mask/reticle equipment, is projected to decline by 3.7% to USD 90.6 billion in 2023. Looking ahead, semiconductor manufacturing equipment is expected to rebound in 2024, driven by both front-end and back-end market demands. Sales are forecasted to reach a new high of USD 124 billion in 2025.

The growth in the equipment market is closely tied to the extensive expansion of foundries. It is reported that approximately 70%-80% of the capital expenditure for fab expansion is allocated to the purchase of semiconductor equipment.

According to statistics from TrendForce, China currently operates 44 fabs (25 of which are 12-inch fabs, 4 are 6-inch fabs, and 15 are 8-inch fabs/lines).

Additionally, there are 22 fabs under construction (15 of which are 12-inch fabs, and 8 are 8-inch fabs). Furthermore, companies including SMIC, Nexchip, and Silan Micro are planning to construct 10 additional fabs (9 of which are 12-inch fabs, and 1 is an 8-inch fab). Overall, China is expected to establish 32 large-scale fabs focused entirely on mature processes by the end of 2024.

Per TrendForce’s data, from 2023 to 2027, the global mature process (28nm and above) and advanced process (16nm and below) capacities are expected to maintain a ratio of approximately 7:3.

Due to policies promoting localization and subsidies, China has shown the most proactive expansion progress. It is estimated that the proportion of mature process capacity in China will increase from 29% in this year to 33% by 2027, with SMIC, Hua Hong Group, and Nexchip being the most active in expanding production.

Despite rapid development in China’s equipment industry in recent years, Chinese semiconductor manufacturers still have room to catch up compared to international giants like Applied Materials, Tokyo Electron, Lam Research, ASML, and KLA Corporation, which boast billion-dollar scales and diverse high-end product lines.

Read more

• [News] China’s Chip Equipment Imports Surge 14% to Nearly USD 40 Billion in 2023
• [News] Surge in Chip Manufacturing Equipment Imports from the Netherlands to China, Soaring Tenfold After U.S. Tightens Restrictions

The world’s top five semiconductor equipment manufacturers have released their latest financial reports, signaling a surge in demand for advanced manufacturing equipment and positive signs of industry recovery.

The US has continuously thwarted efforts by equipment suppliers to export advanced machinery to China—citing national security concerns—mid its ongoing tech conflict. How have companies like Applied Materials, ASML, TEL, Lam Research, and KLA been impacted by the US’s stringent export controls on China?

Applied Materials

Applied Materials reported US$6.71B in 1Q24 earnings—marking a less than 1% decline in revenue. The Chinese market, doubling its revenue to $3B last quarter, emerged as a bright spot, jumping from a 17% share a year ago to 45%.

This surge is primarily due to China’s urgent push to build capacity for internet devices, telecommunications, automotive, power, and sensors. Despite not expecting to maintain the current growth rate, Applied Materials believes the continued demand for more chips will drive market development.

ASML

ASML, seen as a weathervane for the industry, reported 4Q23 net sales of €7.2B, up from €6.7B in Q3. With annual sales reaching €27.6B in 2023 and a 26.3% sales share in China, ASML has surpassed South Korea to become its second-largest market.

However, ASML warns that geopolitical tensions and potential US export control expansions to China remain operational risks. The company estimates that US and Dutch export controls could reduce its sales of mid-range DUV equipment to China by about 10–15% this year.

TEL

TEL posted 3Q24 revenues of ¥463.6B, with China accounting for 46.9% of its revenue, a 42.8% QoQ increase. TEL expects continued strong demand from China, noting that the country produces only a small portion of the chips it needs and will actively invest to reduce reliance on foreign technology. This momentum is expected to continue into 2025.

Lam Research

Lam Research saw a 7.9% QoQ increase in 2Q24 revenue to $3.76B, with the share of revenue from the Chinese market decreasing from 48% to 40%. With the semiconductor industry expected to grow robustly in the coming years, driven by innovations like AI, Lam Research is poised to benefit.

The company expects equipment expenditures by DRAM manufacturers to grow due to increased HBM production and process transitions, while NAND manufacturers’ expenditures will strengthen with technological upgrades.

KLA

KLA reported a 16.7% YoY decrease in 2Q24 revenue to $2.487B, with China remaining its largest revenue contributor, though its share dropped from 43% in Q1 to 41%. KLA estimates a mid-point revenue of $2.3B for this quarter.

The demand for wafer fabrication equipment is expected to reach the higher end of the $80B range in 2024, with the second half of the year anticipated to outperform the first.

(Photo credit: iStock)