It was reported earlier that during Samsung Electronics’ fourth-quarter financial announcement in 2023, the company revealed that its foundry division had secured orders for 2-nanometer AI chips. However, at the time, Samsung did not disclose the name of the relevant customer. Now, according to a report from the Business Korea, the customer is the Japanese AI startup Preferred Networks.

The report indicates that Preferred Networks, which placed an order with Samsung’s foundry division for 2-nanometer AI chips, was founded in 2014 and is in the field of AI deep learning development.

The company has attracted significant investments from major Japanese industrial enterprises such as Toyota, NTT, and Fanuc. The order placed with Samsung’s foundry division for 2-nanometer AI chips also includes HBM and advanced packaging.

As per Samsung’s previous roadmap, the 2-nanometer SF2 process is set to debut in 2025. Compared to the second-generation 3GAP process at 3 nanometers, it offers a 25% improvement in power efficiency at the same frequency and complexity, as well as a 12% performance boost at the same power consumption and complexity, while reducing chip area by 5%.

As stated in Samsung’s Foundry Forum (SFF) plan, Samsung will begin mass production of the 2nm process (SF2) in 2025 for mobile applications, expand to high-performance computing (HPC) applications in 2026, and further extend to the automotive sector and the expected 1.4nm process by 2027.

According to previous reports, the leading foundry TSMC has already disclosed the test results of its 2-nanometer prototype process to major clients such as Apple and NVIDIA, with the goal of commencing mass production by 2025. Apple is set to become TSMC’s inaugural customer for the 2-nanometer process, positioning TSMC at the forefront of competition in the 2-nanometer advanced process technology.

However, according to a previous report from the Financial Times, Samsung is preparing to attract customers to place orders for its 2-nanometer process at lower prices. The move is expected to compete for a portion of Qualcomm’s flagship chip production, as Qualcomm, a major customer of TSMC, may consider shifting some of its flagship chip production to Samsung’s 2-nanometer process.

Read more

• [News] Samsung’s Discount Strategy Challenges TSMC as the Battle for 2nm Orders Heats Up
• [News] Intense Competition in Advancing Processes at the 2nm by Samsung, Intel, and TSMC

(Photo credit: Samsung)

On February 15^th, U.S. chip equipment giant Applied Materials released financial results that surpassed expectations, accompanied by an optimistic revenue forecast for the current quarter.

In the previous quarter (Q1 of the fiscal year), Applied Materials recorded a revenue decline of less than 1%, totaling USD 6.71 billion, surpassing the market anticipated USD 6.48 billion. Net profit amounted to USD 2.02 billion or USD 2.41 per share, exceeding the USD 1.72 billion or USD 2.02 per share reported in the same period last year. On an adjusted basis, earnings per share stood at USD 2.13, compared to USD 2.03 in the corresponding period last year, surpassing the previous market expectation of USD 1.90 per share.

Applied Materials forecasts sales for the current quarter (Q2) to range between USD 6.1 billion and USD 6.9 billion, with the midpoint of USD 6.5 billion exceeding market consensus projection of USD 6.34 billion.

Excluding certain items, earnings per share for the quarter ending in April are expected to be between USD 1.79 and USD 2.15. The market anticipated earnings per share of USD 1.80, is at the lower end of this range.

This optimistic outlook suggests a faster-than-expected rebound in the chip industry. As Applied Materials provides equipment to major semiconductor manufacturers, including Samsung Electronics, TSMC, and Intel, its financial forecasts serve as a crucial indicator of future demand in the semiconductor industry’s supply chain.

China emerged as a notable highlight, with sales more than doubling to USD 3 billion, comprising 45% of the company’s overall revenue. CEO Gary Dickerson attributed this surge to a rush to enhance capacity for IoT appliances, communications, the automotive industry, as well as power and sensors. In the telephone interview, Dickerson mentioned this sector as ICAPS.

Although the growth rate in this sector may not be sustained at its current level, the requirement for more chips per device will continue to propel the market forward, indicating that the current expansion is not a bubble.

Read more

• [News] ASML Points to Chip Industry Recovery Amid Export Control Risks

(Photo credit: Applied Materials)

Apple’s product line is rumored to set for a significant upgrade. According to a report from Economic Daily News, the next-generation M4 and A18 processors, slated for iPads, MacBooks, and iPhones, are expected to increase the number of built-in AI computing cores, leading to a substantial growth in orders to TSMC. Consequently, TSMC’s production volume for its enhanced 3-nanometer process this year is forecasted to surge by over 50% compared to last year.

As per a report cited by the Economic Daily News, Apple, recognizing the significant AI trend, is not only significantly enhancing the AI computing power of the M3 and A17 processors this year, but also increasing the number and efficiency of AI computing cores in the next-generation M4 and A18 processors. The AI application adoption rate across all product lines is expected to greatly increase.

Apple is strengthening the AI computing performance of its terminal devices and significantly increasing the computational power of its in-house processors, resulting in a simultaneous substantial increase in orders to TSMC.

The report further cited sources indicating that Apple’s orders for TSMC’s enhanced 3nm process this year are rumored to increase by over 50% compared to last year, solidifying its position as TSMC’s largest customer.

In addition to increasing orders for TSMC’s wafer production, reportedly, Apple has also secured a significant amount of advanced packaging capacity from TSMC. Industry sources cited by the Economic Daily News has indicated that Apple primarily places orders with TSMC for advanced packaging processes such as InFO and CoWoS, which are 2.5D advanced packaging technologies.

This year, there is a possibility that Apple will push its advanced packaging requirements to the highest price and difficulty level, such as the 3D structure SoIC advanced packaging.

TSMC, reportedly, is expanding its production capacity for the 3nm family and advanced packaging this year to meet the large orders from major clients such as Apple, NVIDIA, and AMD in the coming years.

As per TrendForce’s data, the 3nm process alone contributed 6% to TSMC’s Q3 revenue, with advanced processes (≤7nm) accounting for nearly 60% of its total revenue.

TSMC had previously announced during its earnings call that its capital budget for this year is expected to fall between USD 28 billion to USD 32 billion, with 70% to 80% allocated for advanced processes, 10% to 20% for specialty processes, and the remaining 10% for advanced packaging, testing, and mask production.

Read more

• [News] NVIDIA Expands Advanced Packaging Supply Chain with Intel’s Inclusion, Diverting Orders from TSMC
• [News] TSMC’s Primary Client for 2nm Chips Expected to be Apple, Set to Debut with iPhone 17 Lineup Next Year

(Photo credit: TSMC)

The demand for Dutch semiconductor equipment manufacturer ASML serves as a trend indicator for the industry. The company optimistically stated in its annual report that the chip industry has hit rock bottom and is beginning to show signs of recovery. However, it also cautioned that geopolitical tensions and the potential expansion of US export controls on China remain operational risks.

ASML’s Chief Financial Officer, Roger Dassen, stated in the annual report for 2023 released on the 14th, “We believe that the market has now reached the lowest point of the dip, and although we cannot predict the exact nature of the slope ahead, the recovery is nascent.”

He further pointed out, “The longer-term trends are unmistakable – artificial intelligence, electrification, and the energy transition are happening,” which bodes well for ASML’s business.

However, the ASML annual report mentioned, “The list of Chinese entities impacted by export control restrictions has increased since 2022,” and “The list of restricted customers and the scope of the restrictions were subject to change.”

According to TrendForce’s analysis, while Chinese semiconductor fabs will be unable to purchase NXT:2000i series tools and newer from 2024 onwards, they will still have access to older models like the NXT1980i. This allows them to continue expanding their capacity for manufacturing processes of 28nm and above.

In last month’s financial report announcement, ASML indicated that it anticipates export controls from both the United States and the Netherlands to result in a decrease of approximately 10% to 15% in sales of its mid-range DUV equipment to China this year.

Regarding the 2023 record of ASML’s DUV sales, Dassen also explained in the interview accompanying the financial report that the strong performance in China’s business in 2023 actually stemmed from orders placed at the end of 2022, with the execution of these orders taking place in 2023.

In 2023, China surpassed South Korea to become ASML’s second-largest market, accounting for 26.3% of sales, while Taiwan maintained its leading position with sales accounting for 29.3%.

Read more

• [News] Despite U.S. Semiconductor Export Restrictions, ASML Reports Doubling of Revenue Share from China in 2023
• [News] ASML Reports Partial Revocation of Export Licenses for DUV Equipment

(Photo credit: ASML)

US Commerce Secretary Gina Raimondo has announced on February 5th that the Commerce Department would distribute substantial subsidies to chipmakers investing in the US within the next two months. The subsidy recipients are expected to include companies like TSMC and Intel.

As per a report from Reuters, Raimondo discussed the progress of subsidies under the US CHIPS and Science Act. “We’re in the process of really complicated, challenging negotiations with these companies. In the next six to eight weeks, you will see several more announcements. That’s what we’re striving for,” she stated.

Raimondo did not specify which chipmakers she is negotiating with, but she mentioned in an interview cited by Reuters,”These are highly complex, first-of-their-kind facilities. The kind of facilities that TSMC, Samsung, Intel are proposing to do in the United States — these are new-generation investments — size, scale complexity that’s never been done before in this country.”

Last month, as per Bloomberg cited industry sources in a report, plans for the United States to announce substantial chip subsidies by the end of March are revealed, targeting companies such as TSMC and Intel. The US CHIPS and Science Act reportedly includes a USD 39 billion manufacturing subsidy, providing 15% of the total cost for each independent project. Each fab can receive up to USD 3 billion in subsidies, along with loans, loan guarantees, and tax exemptions.

Read more

• [News] TSMC Reportedly Announcing Kumamoto Plant 2 in Japan, while U.S. Subsidies Expected by End of March
• [News] Subsidies from the U.S. Legislation “NAPMP” Potentially Expected to Cover IC Substrates

(Photo credit: TSMC)