The semiconductor foundry, United Microelectronics Corporation (UMC), held an online briefing on October 25th to unveil its 3Q 2023 operational report. UMC achieved consolidated revenue of NT$57.07 billion, marking a 1.4% growth compared to the previous quarter’s NT$56.3 billion in 3Q23. However, it’s essential to note that this quarter’s revenue decreased by 24.3% in comparison to 3Q 2022.

In 3Q, a 35.9% gross margin yielded a net profit of NT$15.97 billion and an EPS of NT$1.29. The first three quarters of 2023 saw revenue at NT$167.575 billion, marking a 20.5% decline from 2022. The gross margin for this period remained at 35.8%, resulting in a net profit of NT$47.795 billion and an EPS of NT$3.87.

UMC’s Co-president, Jason Wang, highlighted that the company’s performance in the 3Q was boosted by the growing demand in the computer and communication sectors. This was further enhanced by ongoing improvements in product offerings and favorable exchange rates. Notably, despite a 2.3% decrease in overall wafer shipments, the revenue and gross margin remained robust compared to the previous quarter.

Delving into the terminal product market, products like LCD controllers, Wi-Fi, encoders and decoders, and touch IC controllers stimulated demand in the computer application sector. Additionally, the demand for RF front-end ICs and network chips contributed to the shipment volume in the communication sector.

Looking ahead to the 4Q, Wang said that the computer and communication sectors are gradually recovering in terms of short-term demand. In contrast, the automotive market remains challenging, and customers are adopting a cautious approach in managing inventory levels.

UMC foresees that the expansion of capacity at Fab 12A P6 in Nanjing in 2024 will provide significant support, further boosting revenue contributions for 22/28-nanometer technologies.

UMC’s estimate for the 4Q indicates that wafer shipments are projected to decline by 5%, with the average selling price remaining stable. Capacity utilization is expected to decrease from 67% in the previous quarter to a range of 61-63%, which will consequently impact the gross margin. It is estimated to decrease from 35.9% in the 3Q to a range of 31-33%.

Regarding capital expenditure, Q3 saw approximately $570 million spent, a 30.49% decrease from the previous quarter and a 25.39% decrease from 3Q 2022. Cumulative capital expenditure for the first three quarters reached around $2.4 billion, showing a 52.69% increase compared to 2022. The total 2023 capital expenditure remains at $3 billion, with 90% allocated to 12-inch capacity and 10% to 8-inch capacity.

(Image: UMC)

SK hynix today reported the financial results for the third quarter ended September 30, 2023. The company recorded revenues of 9.066 trillion won, operating losses of 1.792 trillion won and net losses of 2.185 trillion won in the three-month period. The operating and net margins were a negative 20% and 24%, respectively.

After bottoming out in the first quarter, the business has been on a steady recovery track, helped by growing demand for products such as high-performance memory chips, the company said.

“Revenues grew 24%, while operating losses narrowed 38%, compared with the previous quarter, thanks to strong demand for high-performance mobile flagship products and HBM3, a key product for AI applications, and high-capacity DDR5,” the company said, adding that a turnaround of the DRAM business following two quarters of losses is particularly hopeful.

SK hynix attributed the growth in sales to increased shipments of both DRAM and NAND and a rise in the average selling price.

By products, shipments of DRAM increased 20% from the three months earlier, thanks to strong sales of high-performance products for server applications such as the AI with the average selling price also recording a 10% rise. Shipments of NAND also rose with high-capacity mobile products and solid state drive products taking the lead.

Following a turnaround, an improvement in the DRAM business is forecast to gain speed, backed by popularity of the generative AI technology, while there are looming signs of a steady recovery in the NAND space as well.

With the effect of the production reduction by global memory providers starting to be seen and customers, following efforts to reduce inventories, placing new orders now, semiconductor prices are starting to stabilize, the company said.

To meet new demands, SK hynix plans to increase investments in high-value flagship products such as HBM, DDR5, and LPDDR5. The company will increase the share of the products manufactured from the 1anm and 1bnm, the fourth and the fifth generations of the 10nm process, respectively, while increasing investments in HBM and TSV.

(Image: SK hynix)

Vanguard International Semiconductor (VIS) has unveiled plans to establish a state-of-the-art 12-inch semiconductor plant in Singapore, reigniting discussions about expanding to Singapore within the semiconductor industry. As per Economic Daily News, while Taiwan and South Korea continue to lead in semiconductor manufacturing in Asia, an increasing number of semiconductor companies have strategically chosen Singapore as their Southeast Asian hub in recent years.

This strategic positioning enables them to reach markets in Vietnam, Thailand, India, and beyond, which is particularly valuable in the context of heightened geopolitical tensions. Singapore’s strategic geographical advantage highlights its remarkable flexibility as a stronghold, uniquely positioned to adapt to meet various demands.

Nonetheless, Singapore grapples with certain challenges, including higher production costs and an aging workforce. Statistics reveal that semiconductors contributed approximately 7% to Singapore’s domestic gross production last year. S&P Global Analytics also notes that the contribution of Singapore’s semiconductor industry to the Asian region is relatively modest. Moreover, the nation faces a significant long-term challenge, one that many economies share: an aging population. Singapore ranks among the fastest-aging populations worldwide.

Turning the attention to key players in Singapore’s semiconductor landscape, companies like TSMC, UMC, ASE, and Micron have established a strong presence. Notably, TSMC collaborated with NXP (formerly Philips Semiconductor) and the Singapore Economic Development Board Investment Corporation (EDBI) back in 2000 to establish SSMC, an 8-inch fab located in the Wafer Fab Park in Singapore.

In a parallel endeavor, UMC invested in Singapore in 2003 and is currently in the midst of an ambitious expansion, including their Fab12i P3 fab, situated in the Pasir Ris Wafer Fab Park in Singapore. The physical infrastructure is expected to be completed by mid-2024, with mass production of 22nm and 28nm chips set to commence in early 2025.

(Image: Wafer Fab Parks)

A senior government official in Malaysia has stated that the country will prioritize attracting investments in high-tech industries such as semiconductor and electric vehicles to solidify its status as a manufacturing hub in Southeast Asia within the global supply chain.

Sikh Shamsul Ibrahim, the Senior Executive Director of the Malaysian Investment Development Authority (MIDA), made this announcement during the Kuala Lumpur Economic Forum. He emphasized that in the face of ongoing trade wars and geopolitical tensions, Malaysia’s goal is to leverage the realignment and redistribution of global supply chains.

Ibrahim further stated that they are placing a strong emphasis on enhancing supply chain resilience and fostering closer collaborations with their trade partners. He also pointed out that they are actively exploring priority sectors with a particular focus on high-growth industries, including semiconductors, electric vehicles, and renewable energy.

In addition, Sikh Shamsul Ibrahim highlighted the government’s objective to introduce tiered corporate tax incentive measures, as per the 2024 budget plan, to attract investments in high-value and high-growth industries.

In September of this year, Malaysia unveiled a new industrial master plan that includes a $19.91 billion investment over seven years to advance its manufacturing capabilities. Key sectors in this initiative encompass electronics, chemicals, and electric vehicles, with the country also aiming to create 3.3 million new job opportunities.

(Image credit: Pixabay)

What started as a groundbreaking acquisition in the SiC/GaN third-generation semiconductor and power semiconductor sector came to a satisfying conclusion on October 24th.

In March 2023, the leading power semiconductor manufacturer, Infineon, announced its plan to acquire GaN Systems, a top Canadian producer of GaN chips, for $830 million. After over half a year of negotiations and regulatory approvals, the transaction officially closed on October 24, 2023. With this, GaN Systems is now officially part of Infineon, and the synergistic effect of this powerhouse alliance is set to make a significant impact.

Currently, Infineon boasts a workforce of 450 GaN technology experts and holds more than 350 GaN technology patents. GaN Systems, on the other hand, ranks among the world’s top five GaN power device manufacturers. According to TrendForce’s “2023 GaN Power Device Market Analysis Report-Part 1,” GaN Systems held a 12% market share based on revenue in 2022, securing the fifth spot globally. In addition, GaN Systems made early inroads into the high-growth automotive power semiconductor market and secured orders from renowned automaker BMW.

From a technological, application, customer base, and market influence perspective, it’s evident that the acquisition of GaN Systems complements Infineon’s position in compound semiconductor and power semiconductor market. This collaboration creates synergies that significantly benefit Infineon.

As Infineon stated, this move further expands their leadership in the power semiconductor sector and substantially reduces the time to market for new products. Both companies complement each other in terms of intellectual property, a deep understanding of applications, and well-established customer project planning, providing a highly favorable environment for Infineon to meet the demands of various rapidly growing applications.

The landscape of the GaN power semiconductor market may undergo significant changes

In the future, the competition landscape within the entire compound semiconductor market, especially in the GaN power semiconductor sector, is likely to undergo significant changes, marking the onset of an integration phase in industry chain competition.

As for the GaN power component market, up until 2023, Infineon had not secured a position among the world’s top manufacturers. However, following the merger, Infineon is poised to join the top ranks. Based on 2022 data, TrendForce’s estimate indicate that the combined market share of both companies could reach 15%, on par with EPC’s 2022 market share of 15%, and there is a potential for surpassing it in the future.

For the compound semiconductor market, it’s worth noting that, in addition to acquiring GaN Systems this year, Infineon has been making further inroads into the GaN field. In simple terms, its involvement in the GaN power semiconductor market is continuously strengthening.

In May of this year, Infineon announced its participation in a collaborative European research project named “ALL2GaN,” joined by 45 partner organizations, with a project budget of €60 million. The project is focused on developing integrated GaN power designs from chips to modules, primarily catering to applications in telecommunications, data centers, and server facilities. Infineon leads the ALL2GaN project, with other participants including imec, a Belgian microelectronics research center, Nexperia, Ericsson, and other enterprises.

Through accumulating expertise from this project, Infineon’s influence in the European GaN power semiconductor field is expected to further enhance. In the Asian market, Infineon operates a factory in Malaysia, with a current focus on SiC (Silicon Carbide). GaN Systems has established offices in Shenzhen and Taiwan, demonstrating an increased commitment to the Asia-Pacific region.

GaN Systems has also reinforced its presence in the European and American markets. Firstly, its Canadian headquarters in Ottawa has undergone a threefold expansion. Secondly, GaN Systems has inaugurated a new design center in Dallas, Texas, gradually expanding its business scope in North America and Europe, while comprehensively advancing its global expansion plan.

Considering these developments, Infineon is poised to conduct its global operations more effectively, gaining a more influential role in the GaN power semiconductor market. This is expected to lead to a gradual increase in business scale and market share.

Furthermore, the collaboration between these two industry giants is set to catalyze the industrialization of GaN, particularly in high-power applications such as automotive and data centers. According to TrendForce’s estimates, the global GaN power component market is projected to grow from $180 million in 2022 to $1.33 billion by 2026, with a remarkable compound annual growth rate of 65%. With proactive efforts from industry leaders like Infineon and GaN Systems, power applications are poised to become the primary growth engine in the GaN domain, accelerating the overall expansion of the GaN market size.