TrendForce reports that from 2023 to 2027, the global ratio of mature (>28nm) to advanced (<16nm) processes is projected to hover around 7:3. Propelled by policies and incentives promoting local production and domestic IC development, China’s mature process capacity is anticipated to grow from 29% this year to 33% by 2027. Leading the charge are giants like SMIC, HuaHong Group, and Nexchip, while Taiwan’s share is estimated to consolidate from 49% down to 42%.

Expansion predominantly targets specialty processes such as Driver ICs, CIS/ISPs, and Power Discretes, with second and third-tier Taiwanese manufacturers at the forefront

Within the Driver IC sector, the spotlight is on high voltage (HV) specialty processes. As companies aggressively pursue the 40/28nm HV process, UMC currently dominates, trailed by GlobalFoundries. Yet, SMIC’s 28HV and Nexchip’s 40HV are gearing up for mass production in 4Q23 and 1H24, respectively—narrowing their technological gap with other foundries. Notably, competitors with similar process capabilities and capacities, such as PSMC, and those without twelve-inch factories like Vanguard and DBHitek, are poised to face challenges head-on in the short term. This trend may also have long-term implications for UMC and GlobalFoundries.

In the realm of CIS/ISP, 3D CIS structure comprises a logic layer ISP and CIS pixel layer. The primary demarcation for mainstream processes is around 45/40nm range for the logic layer ISP, which continues to progress toward more advanced nodes. Meanwhile, the CIS pixel layer, along with FSI/BSI CIS, predominantly uses 65/55nm and above processes. Currently, TSMC, UMC, and Samsung are the frontrunners in this technology. Yet, Chinese players like SMIC and Nexchip are hot on their heels, swiftly closing the gap. Their ascent is further fueled by Chinese smartphone titans OPPO, Vivo, and Xiaomi. Additionally, domestic shifts prompted by governmental policies are positioning Chinese CIS companies like OmniVision, Galaxycore, and SmartSens to rally behind local production.

Power Discretes mainly encompass products like MOSFETs and IGBTs. Vanguard and HHGrace have been deeply involved in Power Discrete processes for some time, boasting a more comprehensive process platform and vehicle certification than many competitors. However, a wave of Chinese contenders, backed by national policies favoring EVs and solar initiatives, are ready to stake their claim, intensifying global competition in this sector. This includes mainstream foundries like HHGrace, SMIC, Nexchip, and CanSemi. Additionally, smaller Chinese IDMs and foundries, such as GTA and CRMicro, are also entering the competitive landscape. If China massively ramps up its production capacity, it will intensify global competition in Power Discrete manufacturing. The impact will not only spark price wars among local Chinese businesses but could also erode the order books and clientele of Taiwanese companies.

In a nutshell, while China actively courts both global and domestic IC designers to bolster its local manufacturing presence, the ensuing massive expansion could flood the global market with mature processes, potentially igniting a price war. TrendForce notes that as China’s mature process capacities continue to emerge, the localization trends for Driver IC, CIS/ISP, and Power Discretes will become more pronounced. Second and third-tier foundries with similar process platforms and capacities might face risks of client attrition and pricing pressures. Taiwan’s industry leaders, renowned for their specialty processes—UMC, PSMC, Vanguard to name a few—will find themselves in the eye of the storm. The battle ahead will hinge on technological prowess and efficient production yields.

The U.S. government tightened its control over exports of advanced computing and semiconductor manufacturing products to China on October 17th. The Entity List now includes more Chinese companies, including two prominent Chinese GPU manufacturers, Biren Technology and Moore Threads. These new restrictions further limit the export of Nvidia A800 and H800 chips.

The new regulations also block chips transferring to China through third-party countries, broadening the export restrictions to include Chinese overseas subsidiaries companies and additional 21 countries.

As reported from TechNews, Nomura Securities are unsurprising to Biren Technology and Moore Threads’ addition to the Entity List. These two chip makers primarily rely on TSMC as their main partner. Due to their limited production capacity, the influence on TSMC is anticipated to be minimal.

Since the U.S. initiated export controls on AI chips in October last year, operations of Biren Technology have continuously been affected. This new development is anticipated to have a relatively limited impact on the Chinese IC design market.

However, the import of ASML’s 1980i DUV model into China may be restricted without U.S. approval. Nomura Securities believe that this could negatively affect the Chinese semiconductor market, potentially causing delays in the expansion plans for 28nm production capacity for some Chinese semiconductor companies. These companies will also likely continue to postpone the purchase of domestic equipment.

Since the import of Nvidia A800, H800, and L40S into China might not be allowed, Nomura Securities consider this unfavorable news for the market. Nvidia may soon introduce new versions to comply with the new regulations. In this scenario, Huawei, with its capacity to design and manufacture advanced chips within China, may ultimately emerge as the most significant beneficiary in the Chinese market, as most Chinese GPU companies are already under sanctions.

The updated U.S. export restrictions also imply that more foreign manufacturers of AI chips will need to adjust their product specifications to meet the new requirements.

Explore more 

• Biden Tightens Export Restrictions to China, Nvidia’s Chips Impacted Most

(Image: Flickr)

Is the merger between NAND flash memory chipmakers Kioxia and Western Digital (WD) , which was expected to be finalized this month, facing a twist? According to media reports, South Korean memory giant SK Hynix is opposing this merger and is considering a collaboration with Japan’s SoftBank to invest in Kioxia.

As reported by Yomiuri Shimbun on the 18th, insiders reveal that the merger negotiations between Kioxia and WD might be at an impasse. Although both sides aimed to reach a merger agreement this month, SK Hynix, which plans to indirectly invest in Kioxia, doesn’t concur with the merger. In anticipation of negotiations collapsing, SK Hynix considers partnering with SoftBank to invest in Kioxia.

Kioxia, a spin-off from Toshiba’s memory business, was sold in 2018 to a Bain-Capital-lead consortium, including SK Hynix, and Hoya. At that time, regulations stipulated that the largest shareholder, Bain, must secure the consent of contributors like SK Hynix to promote this merger. It’s reported that SK Hynix is apprehensive that WD’s dominance will increase in this merger.

Reports suggest that SoftBank is currently bolstering its AI-related ventures. Therefore, by investing and enhancing relationships, SoftBank may secure a stable memory supply from Kioxia and SK Hynix.

Throne Shift for memory business? Mergers May Reshape Rankings

Nikkei reported on the 17th that SK Hynix does not approve of the Kioxia and WD merger. At this stage, SoftBank is not directly involved in the merger talks between Kioxia and WD. Kioxia and WD aim to secure a financing agreement with financial institutions this week to facilitate the merger. However, the lack of consent from SK Hynix may impact negotiations with financial institutions.

The report points out that in the NAND flash market, SK Hynix is the world’s second-largest manufacturer, trailing only Samsung. If Kioxia, the world’s third-largest manufacturer, and WD, the fourth-largest, were to merge, they would nearly match Samsung’s scale. This would create a significant gap between SK Hynix, which holds the third position, and raise concerns for SK Hynix.

Toshiba, currently holding approximately 40% of Kioxia, will also become a shareholder in the holding company, with Kioxia’s President, Nobuo Hayasaka, assuming the role of President for the holding company. Additionally, Kioxia will have the majority of seats on the board, granting substantial operational authority

According to data from TrendForce, In Q2 2023, Samsung leads the NAND memory market with 31.1% market share, while Kioxia holds 19.6%, and Western Digital has 14.7%. After the Kioxia-WD merger, their combined market share could exceed 34.3%, establishing them as the dominant force in the NAND memory market.

Explore more

• [News] Updates: Kioxia and Western Digital’s NAND Flash Progress towards Merger
• Q2 NAND Flash Revenue Up 7.4%, Anticipated to Exceed 3% Growth in Q3, Says TrendForce

(Image: SK Hynix )

DRAM Spot Market:

Even though the National Day holiday period has ended in China, the situation in the spot market is similar to that in the contract market. Specifically, spot trading has slightly declined due to insufficient actual demand. However, spot prices remain relatively high despite the lack of procurement activities. This is because sellers have not been actively offering price concessions to stimulate sales. The average spot price of mainstream chips (i.e., DDR4 1Gx8 2666MT/s) rose by 1.96% from US$1.533 last week to US$1.563 this week.

NAND Flash Spot Market:

Spot buyers are carrying on with their enlarged replenishment of inventory as buyers are generally dedicated to dropping wafer provision. With that being said, spot price for 512Gb that has now risen to US$2 has somewhat slowed down the speed of price increment, which led to a price consolidation this week. 512Gb TLC wafer spots have dropped by 0.21% this week, arriving at US$1.931.

According to TechNews on October 18th, The Biden administration has once again tightened restrictions on chip exports to China, and this includes Nvidia’s advanced AI chips.

In a recent press release, the U.S. government announced a renewed restrictions on exports of advanced computing and semiconductor manufacturing products to China. Notably, this includes Nvidia’s cutting-edge AI chips, which will be impacted and could potentially face restrictions on sales to China. The motive behind this action by the Biden administration is to prevent China from bolstering its military capabilities by accessing advanced U.S. technology.

Apart from Nvidia, chip products from industry giants like Intel and AMD might also encounter hurdles in their journey to China. In addition to the actual chips, products from semiconductor equipment manufacturers such as Lam Research, KLA, and Applied Materials may also face increased limitations when destined for China.

These new restrictions, as revealed by the U.S. government, are even more stringent than previous limitations on chip exports. Nvidia’s A800 and H800 chips are among those falling under these tightened restrictions. As a direct consequence, Nvidia’s stock price took a sharp dip, decreasing by nearly 5% on Tuesday.

Following the recent U.S. government ban, Nvidia’s spokesperson, Ken Brown, promptly assured that the company strictly adheres to all relevant regulations. Nvidia is committed to supporting a wide array of products across diverse industries. Given the global demand for Nvidia’s offerings, it’s anticipated that these restrictions will have no immediate, substantial impact on Nvidia’s financial performance.

In a bid to curtail China’s potential access to U.S. chips through third-party channels, these limitations now extend to include the overseas subsidiaries of Chinese firms. Furthermore, the updated regulations expand the list of countries subject to additional export license requirements for advanced chips to over 40 more nations. This expansion is driven by the concern that these countries might transfer chips to China and their presence on the U.S. arms embargo list.

Notably, the interim final rule revises ECCN 3A090 and 4A090 and enforces extra licensing prerequisites for exports to China and the D1, D4, and D5 country groups. These groups include nations like Saudi Arabia, the United Arab Emirates, and Vietnam, though Israel remains excluded.

To safeguard against China’s potential acquisition of U.S. chips through alternative routes, these restrictions have been extended to encompass overseas subsidiaries of Chinese corporations and involve 21 other countries.

However, reports from foreign media indicating that this new U.S. regulation will exempt certain consumer chips used in laptops, smartphones, and gaming consoles. Nonetheless, some chips may still necessitate prior notification and licensing from the U.S. government to be exported.

It’s noteworthy that the U.S. government’s list of newly restricted entities includes two prominent local GPU companies, Moore Thread Technology and Biren Technology. Following the U.S. ban, both firms promptly issued statements of strong protest.

Moore Thread expressed their strong objection, saying, “We are deeply concerned about the inclusion of Moore Thread in the Entity List by the U.S. Department of Commerce. Our company is actively engaging with various stakeholders, and we are assessing the impact of this development.”

Biren Technology also issued a statement, stating, “We vehemently oppose the U.S. Department of Commerce’s actions and will proactively appeal to relevant U.S. government departments, urging them to reconsider their stance.”
(Image: Nvidia)

(Data: US BIS)