This May, we have witnessed two different approaches to the new High-NA EUV (high-numerical aperture extreme ultraviolet) lithography equipment between semiconductor giants. Intel has secured the first batch of High-NA EUV kits from ASML, which will allegedly be used on its 18A (1.8nm) and 14A (1.4n...

In response to US export bans, NVIDIA, the global leader in AI chips, has commenced to sell H20, its AI chip tailored for the Chinese market earlier this year. However, an oversupply caused the chip to be priced lower than its rival, Huawei, in some cases even at an over 10% discount, according to t...

According to a report from CNA, the South Korean government has announced a comprehensive support plan for the semiconductor industry, amounting to KRW 26 trillion (roughly USD 19 billion). The plan includes substantial financial support, expansion of semiconductor parks, infrastructure development...

TSMC’s Nanjing plant has averted an export permit expiration crisis. On May 23rd, TSMC confirmed that it has recently received the "Validated End-User" (VEU) authorization from the U.S. Department of Commerce for TSMC (Nanjing) Co., Ltd., according to a report by Commercial Times. Currently, th...

To alleviate the capacity constraints of CoWoS advanced packaging, NVIDIA is reportedly planning to accelerate the introduction of its GB200, into panel-level fan-out packaging. According to a report from Economic Daily News, originally scheduled for 2026, this shift has been moved up to 2025, spark...