According to a report from Taiwan’s TechNews, Huawei’s Mate 60 Pro smartphone, powered by its in-house Kirin 9000S processor, quietly appeared on the market recently, testing has shown that its network speed approaches that of 5G. This development has sparked enthusiastic discussions in the market about the manufacturing and development of this chip.

Prominent analyst Andrew Lu also expressed that if the semiconductor manufacturer, SMIC, which handles the production of the Kirin 9000S processor, makes significant breakthroughs in both 7nm process technology and capacity, it should not be underestimated. Additionally, with Huawei’s reintroduction of the Kirin 9000S processor through the Mate 60 Pro, they are expected to continue launching products that are likely to have an impact on the mobile phone and mobile chip market.

Andrew Lu outlined the following points on his personal Facebook fan page:

1. The Kirin 9000S processor is likely manufactured by SMIC using N+2 process technology, with N+1 being a pseudo-7nm process that is closer to 8-9nm. N+2 is a 7nm process (not the rumored 5nm), but it does not use EUV, so multiple exposures are needed. Due to insufficient capacity, shipping 40 million units would likely take several months. Assuming a die size of 169mm² and an 80% yield rate, SMIC would need to prepare 144k N+2 capacity, this indicates a monthly production capacity requirement of 24,000 units. The monthly production capacity appears significantly higher than what was previously anticipated. If these assumptions hold, it indicates that SMIC has made significant breakthroughs in 7nm process technology and capacity.
2. Apple’s iPhone doesn’t emphasize Antutu benchmark scores as much, and Android phones typically fine-tune their systems for benchmarking, making comparisons between iOS and Android phones less fair. However, compared to other Android flagship phones scoring around 1.5-1.6 million, the Mate 60’s 1.1 million still falls short, but it excels in satellite phone functionality.
3. Huawei/Huawei’s HiSilicon’s return is likely to continue with the release of new devices, aiming to reach annual sales of 100 million phones within 5 years, which should not be difficult. This means Huawei/Huawei’s HiSilicon will regain approximately 5-10% of the global market share, while other phone and chip manufacturers will lose 5-10% of their market share with flagship brands likely being more affected.
4. Despite the U.S. putting SMIC on the Entity List, how does SMIC still have so much advanced process capacity? Lu Xingzhi believes that being placed on the Entity List doesn’t entirely prohibit companies from purchasing all advanced U.S. equipment (EUV scanners are absolutely prohibited), but it requires approval from the U.S. Department of Commerce to purchase such equipment. Additionally, the rapid emergence of many semiconductor startups in China (some of which disappear shortly after) makes it challenging for U.S. equipment manufacturers and the U.S. Department of Commerce to determine if the purchased equipment is being resold to SMIC. Therefore, SMIC’s expansion of advanced process capacity is not surprising. According to Lu’s data, SMIC’s capital intensity, capital expenditure as a percentage of revenue, was 110% over the past year, significantly higher than TSMC’s 50% and Samsung LSI’s and GlobalFoundries’ 40% range, indicating that capacity expansion is likely to be considerably higher than peers in the industry.

(Photo credit: Huawei)

According to a report by Taiwan’s Commercial Times, Wistron AI server orders are surging. Following their successful acquisition of orders for NVIDIA’s next-generation DGX/HGX H100 series AI server GPU baseboards, there are industry sources suggesting that Wistron has secured orders for AMD’s next-generation MI300 series AI server baseboards. The earliest shipments are expected before the end of the year, making Wistron the first company to win orders from both major AI server providers. Wistron has refrained from commenting on specific products and individual customers.

The global AI server market is experiencing rapid growth. Industry estimates global production capacity to reach 500,000 units next year, with a market value exceeding a trillion NT dollars. NVIDIA still holds the dominant position in the AI chip market with a market share of over 90%. However, with the launch of AMD’s new products, they are poised to capture nearly 10% of the market share.

There have been recent reports of production yield issues with AMD’s MI300 series, potentially delaying the originally planned fourth-quarter shipments. Nevertheless, supply chain sources reveal that Wistron has secured exclusive large orders for MI300 series GPU baseboards and will begin supplying AMD in the fourth quarter. Meanwhile, in NVIDIA’s L10, Wistron has recently received an urgent order from a non-U.S. CSP (Cloud Service Provider) for at least 3,000 AI servers, expected to be delivered in February of next year.

Supply chain analysts note that while time is tight, Wistron is not billing its customers using the NRE (Non-Recurring Engineering), indicating their confidence in order visibility and customer demand growth. They aim to boost revenue and profit contributions through a “quantity-based” approach.

On another front, Wistron is currently accelerating shipments for not only NVIDIA DGX/HGX architecture’s H100-GPU baseboards but also exclusive supply orders for NVIDIA DGX architecture and AI server front-end L6 mainboard (SMT PCBA) orders for both NVIDIA and AMD architectures under the Dell brand. These orders have been steadily increasing Wistron’s shipment momentum since the third quarter.

(Photo credit: NVIDIA)

According to Liberty Times Net, Inventec, a prominent player in the realm of digital technology, is making significant strides in research and development across various domains, including artificial intelligence, automotive electronics, 5G, and the metaverse. The company has recently introduced a new all-aluminum liquid-cooled module for its general-purpose graphics processing units (GPGPU) powered by NVIDIA’s A100 chips. Additionally, this innovative technology is being applied to AI server products featuring AMD’s 4th Gen EPYC dual processors, marking a significant step towards the AI revolution.

Inventec has announced that their Rhyperior general-purpose graphics processors previously offered two cooling solutions: air cooling and air cooling with liquid cooling. The new all-aluminum liquid-cooled module not only reduces material costs by more than 30% compared to traditional copper cooling plates but also comes with 8 graphics processors (GPUs) and includes 6 NVIDIA NVSwitch nodes. This open-loop cooling system eliminates the need for external refrigeration units and reduces fan power consumption by approximately 50%.

Moreover, Inventec’s AI server product, the K885G6, equipped with AMD’s 4th Gen EPYC dual processors, has demonstrated a significant reduction in data center air conditioning energy consumption of approximately 40% after implementing this new cooling solution. The use of water as a coolant, rather than environmentally damaging and costlier chemical fluids, further enhances the product’s appeal, as it can support a variety of hardware configurations to meet the diverse needs of AI customers.

Inventec’s new facility in Mexico has commenced mass production, with plans to begin supplying high-end NVIDIA AI chips, specifically the H100 motherboards, in September. They are poised to increase production further in the fourth quarter. Additionally, in the coming year, the company is set to release more Application-Specific Integrated Circuit (ASIC) products, alongside new offerings from NVIDIA and AMD. Orders for server system assembly from U.S. customers (L11 assembly line) are steadily growing. The management team anticipates showcasing their innovations at the Taiwan Excellence Exhibition in Dongguan, China, starting on October 7th, as they continue to deepen their collaboration with international customers.

(Source: https://ec.ltn.com.tw/article/breakingnews/4412765)

TSMC’s CoWoS advanced packaging capacity shortage is causing limitations in NVIDIA’s AI chip output. Reports are emerging that NVIDIA is willing to pay a premium for alternative manufacturing capacity outside of TSMC, setting off a surge in massive overflow orders. UMC, the supplier of interposer materials for CoWoS, has reportedly raised prices for super hot runs and initiated plans to double its production capacity to meet client demand. ASE, an advanced packaging provider, is also seeing movement in its pricing.

In response to this, both UMC and ASE declined to comment on pricing and market rumors. In addressing the CoWoS advanced packaging capacity issue, NVIDIA previously confirmed during its financial report conference that it had certified other CoWoS packaging suppliers for capacity support and would collaborate with them to increase production, with industry speculation pointing towards ASE and other professional packaging factories.

TSMC’s CEO, C.C. Wei, openly stated that their advanced packaging capacity is at full utilization, and as the company actively expands its capacity, they will also outsource to professional packaging and testing factories.

It’s understood that the overflow effect from the inadequate CoWoS advanced packaging capacity at TSMC is gradually spreading. As the semiconductor industry as a whole adjusts its inventory, advanced packaging has become a market favorite.

Industry insiders point out that the interposer, acting as a communication medium within small chips, is a critical material in advanced packaging. With a broad uptick in demand for advanced packaging, the market for interposer materials is growing in parallel. Faced with high demand and limited supply, UMC has raised prices for super-hot-run interposer components.

UMC revealed that it has a comprehensive solution in the interposer field, including carriers, customed ASICs, and memory, with cooperation from multiple factories forming a substantial advantage. If other competitors are entering this space now, they might not have the quick responsiveness or abundant peripheral resources that UMC does.

UMC emphasized that compared to competitors, its competitive advantage in the interposer field lies in its open architecture. Currently, UMC’s interposer production primarily takes place in its Singapore plant, with a current capacity of about 3,000 units, with a target of doubling to six or seven thousand to meet customer demand.

Industry analysts attribute TSMC’s tight CoWoS advanced packaging capacity to a sudden surge in NVIDIA’s orders. TSMC’s CoWoS packaging had primarily catered to long-term partners, with production schedules already set, making it unable to provide NVIDIA with additional capacity. Moreover, even with tight capacity, TSMC won’t arbitrarily raise prices, as it would disrupt existing client production schedules. Therefore, NVIDIA’s move to secure additional capacity support through a premium likely involves temporary outsourced partners.

(Photo credit: NVIDIA)

According to a report by Taiwan’s Commercial Times, NVIDIA is facing repercussions from the US chip restriction, leading to controls on the export of high-end AI GPU chips to certain countries in the Middle East. Although NVIDIA claims that these controls won’t have an immediate impact on its performance, and industry insiders in the Taiwanese supply chain believe the initial effects are minimal. However, looking at the past practice of prohibiting exports to China, this could potentially trigger another wave of preemptive stockpiling.

Industry sources from the supply chain note that following the US restrictions on exporting chips to China last year, the purchasing power of Chinese clients increased rather than decreased, resulting in a surge in demand for secondary-level and below chip products, setting off a wave of stockpiling.

Take NVIDIA’s previous generation A100 chip for instance. After the US implemented export restrictions on China, NVIDIA replaced it with the lower-tier A800 chip, which quickly became a sought-after product in the Chinese market, driving prices to surge. It’s reported that the A800 has seen a cumulative price increase of 60% from the start of the year to late August, and it remains one of the primary products ordered by major Chinese CSPs.

Furthermore, the recently launched L40S GPU server by NVIDIA in August has become a market focal point. While it may not match the performance of systems like HGX H100/A100 in large-scale AI algorithm training, it outperforms the A100 in AI inference or small-scale AI algorithm training. As the L40S GPU is positioned in the mid-to-low range, it is currently not included in the list of chips subject to export controls to China.

Supply chain insiders suggest that even if the control measures on exporting AI chips to the Middle East are further enforced, local clients are likely to turn to alternatives like the A800 and  L40S. However, with uncertainty about whether the US will extend the scope of controlled chip categories, this could potentially trigger another wave of purchasing and stockpiling.

The primary direct beneficiaries in this scenario are still the chip manufacturers. Within the Taiwanese supply chain, Wistron, which supplies chip brands in the AI server front-end GPU board sector, stands to gain. Taiwanese supply chain companies producing A800 series AI servers and the upcoming L40S GPU servers, such as Quanta, Inventec, Gigabyte, and ASUS, have the opportunity to benefit as well.

(Photo credit: NVIDIA)