According to a report from Taiwan’s Economic Daily, the construction of TSMC’s 2-nanometer fab in the Central Taiwan Science Park (CSTP) is confirmed to be delayed until next year due to land acquisition and construction timelines.

The Taiwan Central Science Park Administration indicated that this project has been delayed by a year and a half, and the operational schedule is now too tight. After receiving approval from the Taichung City government, it still needs to undergo review by the Construction and Planning Agency Ministry of the Interior. It is anticipated that the urban planning announcement by the Taichung City government will be made by the end of the year, a prerequisite for initiating land acquisition procedures. However, meeting this year’s end deadline for land acquisition is now deemed unfeasible.

The Central Science Park Administration was notified by the Taichung City government today that the expansion project for Phase 2 of the CSTP, crucial for TSMC’s 2-nanometer fab, has been scheduled for urban planning review on the 25th of this month.

Due to repeated delays in the urban planning approval process for the CSTP Phase 2 expansion, TSMC recently made the decision to plan for the construction of a 2-nanometer fab in Kaohsiung.

It’s worth noting that the inclusion of the CSTP Phase 2 expansion project in this month’s urban planning review hinges on TSMC’s announcement of its 2-nanometer fab plans in Kaohsiung. The breakthrough came after Taiwan Power Company and Taiwan Water Corporation finally issued assurances that TSMC’s CSTP 2-nanometer fab’s development and operation would not compromise the assurance of power and water supply for Taichung residents, which provided a turning point for the project.

(Photo credit: TSMC)

According to a report by Taiwan’s Economic Daily, Foxconn Group has achieved another triumph in its AI endeavors. The company has secured orders for over 50% of NVIDIA’s HGX GPU base boards, marking the first instance of such an achievement. Adding to this success, Foxconn had previously acquired an order for another NVIDIA DGX GPU base board, solidifying its pivotal role in NVIDIA’s two most crucial AI chip base board orders.

The report highlights that in terms of supply chain source, Foxconn Group stands as the exclusive provider of NVIDIA’s AI chip modules (GPU Modules). As for NVIDIA’s AI motherboards, the suppliers encompass Foxconn, Quanta, Inventec, and Super Micro.

Industry experts analyze that DGX and HGX are currently NVIDIA’s two most essential AI servers, and Foxconn Group has undertaken the monumental task of fulfilling the large order for NVIDIA’s AI chipboards through its subsidiary, Foxconn Industrial Internet (FII). Having previously secured orders for NVIDIA’s DGX base boards, Foxconn Group has now garnered additional orders from FII for the HGX base boards. This expanded supply constitutes more than half of the total, solidifying Foxconn Group’s role as a primary supplier for NVIDIA’s two critical AI chip base board orders.

Furthermore, Foxconn’s involvement doesn’t end with AI chip modules, base boards, and motherboards. The company’s engagement extends downstream to servers and server cabinets, creating a vertically integrated approach that covers the entire AI ecosystem.

(Photo credit: Nvidia)

According to the news from Mydrivers.com, TSMC announced its ambitious plans for constructing cutting-edge 4nm and 3nm chip fabs in the United States. The move is expected to generate tens of thousands of job opportunities in the US job market. However, TSMC’s timeline for commencing production at its inaugural 4nm fab has been pushed back from 2024 to 2025. The attributed cause behind this delay is the insufficient availability of skilled American workers, causing setbacks in equipment installation.

This situation has led to a heated dispute between TSMC and local labor unions. TSMC’s assertion of a skilled worker deficit in the US has sparked disagreement from the unions. They assert that TSMC’s stance is a pretext for bringing in lower-wage overseas labor to vie for domestic employment opportunities. TSMC, on the other hand, refutes these claims, emphasizing that employing local staff on assignment doesn’t undermine their US-based operations or recruitment efforts.

Apart from the skill-related quandary, the delay in TSMC’s factory plans may have an underlying factor – the scorching conditions in Phoenix, Arizona. Sources report that the city has experienced an unbroken streak of over 20 days with temperatures hovering around 43 degrees Celsius. Notably, this heat wave has raised internal questioning within TSMC about the wisdom of selecting a desert-adjacent location for their facility.

According to this industry insider, the intense heat seemingly played a role in impeding progress. The sweltering climate of over 40 degrees Celsius undoubtedly hampers worker productivity, particularly for outdoor tasks.

The informer indicated that TSMC had an alternative option when choosing a location for its US facility. Aside from Arizona, they could have set up shop in Portland, the capital of Oregon, which is also a hub for the semiconductor industry. However, TSMC’s rationale for settling in Arizona remains undisclosed.

Notably, Phoenix, Arizona, is also a focal point for Intel’s chip investments, with the company injecting 20 billion USD into the establishment of new wafer fabs over the past couple of years.

(Source: https://news.mydrivers.com/1/928/928753.htm)

According to the news from Money UDN, amid a tough semiconductor market, once-stable long-term contracts for silicon wafer makers have turned uncertain. A major Taiwanese foundry seeks price cuts in upcoming contracts from a Japanese supplier. Intense negotiations are ongoing, potentially affecting industry dynamics and pricing strategies due to the Japanese suppliers’ pivotal role in the supply chain.

Market insiders suggest silicon wafer makers may resist price reductions due to their vital role in foundries. Reports hint at foundries’ challenges and the ripple effects on critical materials suppliers.

Globally, Japan’s Shin-Etsu and SUMCO are top silicon wafer suppliers, trailed by Taiwan’s GlobalWafers, Germany’s Siltronic, and South Korea’s SK Siltron. And Taiwan SUMCO joint venture with Formosa Plastics Group as “Formosa Sumco Technology”, and other companies like Wafer Works. With over 30% market share, Shin-Etsu leads, closely followed by SUMCO, combining for around 55% to 60% global share.

Taiwan’s foundries include TSMC, UMC, VIS, and PSMC, among others. TSMC, with a global market share exceeding 50%, holds a leading position in the industry.

Silicon wafers are essential raw materials for semiconductor foundries, integrated device manufacturers (IDMs), and memory manufacturers. Presently, the standard duration for silicon wafer long-term contracts ranges from three to 8 years, specifying annual supply and demand quantities. In the previous semiconductor boom, these long-term contracts often featured escalating prices year by year.

Semiconductor market shifts led to reduced foundry capacity use, heightening tensions with silicon wafer makers’ clients. Delays emerged in the last quarter, leading to agreements between manufacturers and clients. This trend has persisted into the first half of this year. Silicon wafer industry insiders acknowledge slow end-market demand recovery and relatively high client inventories.

Amidst this situation of overflowing inventories, reports indicate that a major Taiwanese silicon wafer foundry is requesting Japanese silicon wafer suppliers to not only agree to further delays in this year’s contracted shipments but also to lower prices for next year. However, no formal agreement has been reached by the silicon wafer manufacturers at this stage.

A juridical person suggests that the negotiations are currently at a deadlock, and the situation might become clearer in the fourth quarter. If the silicon wafer manufacturers eventually concede, they are unlikely to publicly admit it, in order to prevent other clients from seeking similar adjustments and causing wider disruptions.

Market insiders also reveal that the Japanese silicon wafer manufacturers facing price reduction demands are currently operating relatively well and are adopting a firm stance. From the perspective of the foundries, they are hoping for support from their supply chain partners to alleviate the pressure. Normal silicon wafer inventories typically span two to three months, yet certain silicon wafer foundries are already grappling with high inventory levels, particularly for 8-inch wafers, which might persist throughout this year.

(Source: https://money.udn.com/money/story/5612/7366962)

According to a report by Taiwan’s Economic Daily, the revival of the smartphone market has fallen short of expectations. Industry sources have indicated that in order to stimulate customer demand and expedite inventory clearance, Qualcomm has recently initiated a price war, targeting mid- to- low-range 5G smartphone chips. The price reduction is substantial, ranging from 10% to 20%. It is anticipated that Qualcomm’s price reduction strategy will extend into the fourth quarter.

The consumer electronics market began to slump in the fourth quarter of last year. Downstream inventory levels began to visibly dissipate in the first half of this year, gradually returning to normal. There was optimism in the market that the Chinese smartphone market would improve in the second half of this year, and there were even reports of a slight resurgence in Qualcomm’s chip shipments during the second quarter.

However, even after China’s 618 shopping festival, the downturn in the consumer electronics market has not shown significant improvement. This has led to Qualcomm’s inventory levels rising to nearly two quarters’ worth.

With low order visibility and high inventory, the supply chain has reported that Qualcomm has recently decided to initiate a price war, primarily focusing on the mid- to low-range market segment. If the pace of inventory clearance falls short of expectations, there is a possibility of further intensifying the price reduction efforts.

Industry analysts suggest that Qualcomm’s extensive price cuts underscore the challenging situation in the mid- to low-range 5G smartphone market, where demand has been lackluster.

(Photo credit: Qualcomm)