Under the grand banner of China’s domestic substitution policy, the wave of locally produced chips is swiftly spreading to the realm of Power Management ICs (PMICs).

Over the past three years, the number of fundraisings for Chinese PMIC manufacturers has shot up. We’ve seen an increase from 18 rounds in 2020 and 19 rounds in 2021 to a whopping 24 rounds in 2022 – a substantial leap from the figures in 2018 and 2019.

Looking at the number of IPO last year, 23 Chinese automotive-grade chip companies went public, with another 25 poised to follow suit. Among these 48 automotive chip firms, 12 boast PMICs, making it the largest product sector in these investments.

New Energy Vehicles Fuel China’s PMIC Market

Both the data points signal a golden era for Chinese PMIC industry, with the new energy vehicles(NEV)emerging as a key driving force.

Compared to traditional vehicles with internal combustion engines, NEV requires a greater number of PMICs, like DC/DC converters, to manage voltage conversions. This, in turn, propels overall PMIC growth. From 2021, automotive PMICs have entered a phase of rapid growth. TrendForce forecasts that the scale of automotive PMICs will reach $7.65 billion by 2023, marking a year-on-year growth of 4.2%.

Government’s subsidy incentives and a booming domestic demand for NEV are the primary reasons for nudging the Chinese semiconductor industry to embrace PMICs more quickly. This trend aligns perfectly with the growth trajectory of China’s power semiconductors.

Chinese Manufacturers Plant Flags in Automotive PMICs

Over the past year, several domestic PMIC manufacturers, including SG Micro, Etek, Shanghai Belling, and Halo Micro, have rolled out automotive-grade PMICs. Some of these chips have even entered mass production and are being adopted by domestic vehicle bands.

Foundries are equally keen to seize the golden opportunity. For instance, GTA Semiconductor has successfully raised over 10 billion yuan in recent years. The company has earmarked a portion of the funds specifically for the R&D of automotive-grade PMIC.

However, the opportunities come with their fair share of challenges. New entrants must navigate stringent automotive certifications, ensure product resilience across extreme temperature ranges from -40°C to 125°C, guarantee a product lifespan exceeding ten years, and manage prolonged validation cycles. These demanding requirements significantly raise the entry barriers for newcomers.

On a global scale, international IDM giants like Infineon, NXP, TI, and Renesas are well entrenched in the PMIC sector, boasting a diverse range of products. In contrast, Chinese PMICs supply chain are just off the starting blocks of the race. To gain trust from customers, expand their product portfolio, and penetrate the global market, they are bound to confront a succession of hurdles, which will persistently scrutinise the enduring R&D capabilities and business strategies of each manufacturer.

YMTC has officially notified a 3~5% price increase for NAND Flash in mid-May. However, the initial impact of the price hike is expected to be felt in the enterprise market, and it may take some time to reflect in the consumer spot market.

The semiconductor industry is in the midst of a correction period aimed at tackling inventory challenges, and the memory sector is feeling the impact. Major players in global memory manufacturing, including Samsung, SK Hynix, Micron, and YMTC, have recently disclosed substantial cuts in CAPEX, ranging from 45~50% starting from 4Q22. The most recent financial reports from Micron and Samsung further underscore the industry’s downward trend.

TrendForce highlights that YMTC’s decision to raise prices comes amidst market conditions marked by substantial oversupply in the second quarter. Despite Samsung’s efforts to curtail production, the positive effects of this reduction are not anticipated to materialize until the latter part of the year. Consequently, experts predict a more substantial decline in contract prices for the second quarter of 2023 than initially expected.

The market situation in 2Q23 is still oversupplied, leading to further price declines. Since October of last year, the market transaction price for wafers has been lower than the supplier’s cash cost due to selling pressure. Some suppliers used the opportunity when Samsung announced production cuts to raise the wafer price, which is likely why YMTC made this announcement. TrendForce predicts that as demand gradually recovers in the second half of the year, wafer prices will become more resilient. (Photo credit: YMTC LinkedIn)

According to the weekly memory spot price trends released by TrendForce, apart from a slight increase in the price of DDR5 chips due to shortages, the spot prices of other memory products continue to decline. The detailed situation is as follows:

DRAM Spot Market

Spot prices of DDR5 chips have risen slightly due to the frequent occurrence of quality-related issues and their impact on the overall supply of DDR5 products. As for the rest of DRAM products, their spot prices have returned to the trend of incremental daily decline. The overall transaction volume has yet to pick up. Some traders appear to be more willing to stock up, but there are no signs of a price rebound because the demand outlook is uncertain and supply is plentiful. The average spot price of mainstream chips (i.e., DDR4 1Gx8 2666MT/s) fell by 1.62% from US$1.603 last week to US$1.577 this week.

NAND Flash Spot Market

Purchase sentiment for spots is rather torpid this week, where the overall sufficient volume in the market is not received with buyer inquiries and aggressive transactions, which explains how prices are maintained on a slow reduction on the whole, and wafer prices are slowly falling to the level of contract prices. 512Gb TLC wafer has dropped by 0.07% in spot prices this week, arriving at US$1.430.

Over the past few years, the US Department of Commerce has imposed export restrictions and the CHIPS Act, causing political tensions to rise between China and the US. To mitigate geopolitical risks, customers are beginning to diversify the proportion of Chinese and non-Chinese suppliers, with Taiwanese foundries expected to benefit.

Industry sources claim that one of the world’s top three CMOS image sensor manufacturers, which previously produced CIS chips for laptops at Hua Hong, has reportedly shifted its orders to PSMC at the request of its customers. Another major power discrete manufacturer is also reportedly considering discussions with PSMC for related cooperation due to geopolitical concerns.

The subsidy regulations of the CHIPS Act prohibit subsidy recipients from transferring funds to related foreign entities, expanding semiconductor manufacturing capacity in “related countries” within 10 years, or engaging in any form of joint research or technology licensing with foreign entities involved in sensitive technology or products.

China’s advanced process capacity will only account for 1% in 2025

TrendForce predicts that the CHIPS Act may further reduce the willingness of multinational semiconductor companies to invest in China. Japan and the Netherlands have also joined the sanctions, which may hinder the expansion plans of both Chinese and multinational foundries in China. Chinese foundries are more active in expanding mature process capacity, with a projected growth of 27% from 2022~2025, but the advanced process has only 1% in 2025. However, the US is expected to have the highest growth rate in advanced processes (7nm and below), reaching 12% by 2025.

China’s memory production capacity will decline annually

SK hynix is the only one of the top three DRAM manufacturers with a production facility in China’s Wuxi. Due to factors such as oversupply and geopolitics, Wuxi’s DRAM production has decreased from 48% to 44%. The company’s new plant is expected to be located in Korea. Meanwhile, Samsung and Micron have no DRAM production in China, and their expansion plans will focus on Korea and the United States respectively. According to TrendForce, as DRAM production in Korea continues to rise, China’s global share of DRAM production capacity will gradually decline from 14% to 12% between 2023 and 2025.

Samsung and SK Hynix are reportedly unlikely to expand their legacy-process production lines for NAND flash memory as they approach manufacturing of 200-layer and higher products, making sub-128-layer processes uncompetitive. Instead, they are planning to establish new production facilities in South Korea or other regions. This move could restrict China’s NAND flash production capacity expansion and process upgrades, causing its global market share to drop from an estimated 31% to 18% between 2023 and 2025.

(Image credit: SMIC)

Global PCB market revenue will decline by 3.4% in 2023 due to low demand for consumer electronics, reaching around USD 80.5 billion, down from approximately USD 83.3 billion in 2022. However, the industry is expected to rebound, with a potential to reach USD 100 billion by 2027, with a CAGR of 3.7% from 2022~2027, led by automotive PCBs of USD 9.2 billion accounting for the largest part in 2022, and will reach USD 15.6 billion in 2027. TrendForce research shows that China dominates PCB production with a 53% market share in 2023, followed by Taiwan at 13%, Korea at 10%, Japan at 9%, and SEA at 8%.

China’s rising labor costs, environmental regulations, and geopolitical tensions have led to a shift in the PCB supply chain outside of China. SEA, with its labor advantages and free trade benefits, has become a popular destination for PCB manufacturers. TrendForce says that Thailand currently accounts for 50% of the total PCB production value in SEA. Major Taiwanese manufacturers have established factories in Thailand to establish complete industry chains. With an average monthly salary level of $8,800, Thailand is well-positioned to become a key production base for the PCB industry in Southeast Asia.

SEA PCB Production Value to Follow China’s Closely in the Next 10 Years

SEA such as Thailand, Malaysia, and Vietnam have an average manufacturing labor cost of about half of that in China, but their production efficiency is still 20% lower than China’s. In addition, SEA is limited by a shortage of industry talents and incomplete supply chains, resulting in high procurement costs, especially for mid-to-high-level engineering and management personnel. Therefore, large-scale investment in the region is still unlikely at this stage. As the PCB industry chain relocation requires a long time due to its cluster effect, China is expected to remain the world’s largest PCB producer in the next 10 years, accounting for over 40% of the global PCB production value, while SEA is expected to become the 2^nd largest producer.

Taiwanese companies are leading the expansion of PCB factories in Southeast Asia.

Taiwanese PCB manufacturers have the highest market share at 34%, but only 38% of their production capacity is located in Taiwan, with the majority around 60% being concentrated in China. To follow the trend of supply chain relocation, 9 Taiwanese PCB manufacturers, including Elite Material, ITEQ, and CCL, plan to establish factories in Thailand, while Chinese manufacturers like Shenzhen Jove Enterprise, and China Eagle Electronic have all set up factories in Thailand. International ones like CMK and Kyoden have also set up factories in Thailand, while TTM, Simmtech, and AT&S focus on Malaysia, and Vector Fabrication has chosen Vietnam.