During the Snapdragon Summit 2023 in October, Qualcomm made a big announcement by introducing the Snapdragon X Elite chip, built on TSMC’s cutting-edge 4nm process. Qualcomm’s claim is bold; they assert that the chip will deliver superior performance compared to Intel’s x86 architecture and Apple’s M2 chip. Simultaneously, towards the end of October, Apple revealed its own Arm-based M3 chip. Notably, semiconductor giants AMD and NVIDIA are rumored to be exploring the development of new PC processors on the Arm architecture. The future outlook suggests that Arm-based processors may gradually cut in the market share traditionally held by x86 architecture processors.

TrendForce’s Insights:

1. Qualcomm’s New PC Processor Poised to Expand the Arm-Based PC Processor Market

Following Intel’s September 2023 Meteor Lake processor release, Qualcomm introduced the Snapdragon X Elite, its latest Arm-based PC processor in October. This chip leverages TSMC’s advanced 4nm technology. Qualcomm is forging partnerships with Taiwanese heavyweights such as Quanta, Compal, Wistron, Acer, Asus, Realtek, Nuvoton and others, aiming to secure a foothold in the CPU market within the PC supply chain. This collaborative effort is expected to yield new PC products hitting the market in 2024.

As of 2023, Arm commands approximately 11% of the market share. Apple, a pioneer in PC chips built on the Arm architecture, has seen success with the release of three generations of processors since the 2020 debut of M1 chip.

With Qualcomm entering the Arm architecture group, AMD also intends to step into Arm architecture with the upcoming Phoenix processor, set for launch in 2025. There are also whispers of NVIDIA partnering with MediaTek to develop a chip processor featuring SoC+GPU capabilities on the Arm architecture, with an initial focus on ChromeBook market, where MediaTek boasts years of experience.

In the PC market, significant factors include processor development timelines, product performance, power efficiency, extended battery life, and compatibility with software and hardware. High-end CPUs and GPUs have become indispensable components for high-end computers. Currently, Intel leads the CPU market, with AMD following closely in the x86 landscape. As more companies delve into the development of Arm-based processors, there is potential for them to carve a share from the x86 market in the future.

2. Arm Architecture Processors Gain Momentum, Intel Focusing on AI Software Application Processor Development

Apple’s M-series chips demonstrate their efficiency and extended battery life. Microsoft recognizes the advantages of the Arm architecture and is dedicated to fostering a strategic collaboration for Windows on Arm. This collaboration involves integrating operating systems with processors to attract leading manufacturers to engage in Arm-based processor development, aligning with the growing demands for AI PCs.

In the realm of x86 architecture, Intel enjoys a dominant position in the CPU market. To tap into the opportunities arising from AI PCs, Intel has integrated AI acceleration engine features into its processors, introducing a new generation of AI application processors that combine CPU, GPU, and NPU (Neural Processing Unit) functionalities. This caters to the growing demand for generative AI applications in enterprise mobile PCs. Furthermore, Intel has joined forces with major laptop brands to launch new AI PCs, aiming to seize a substantial share of the market.

As momentum grows in Arm-based processor development, Intel maintains confidence that their immediate effect on the demand for x86 architecture processors will be restrained. It is unlikely to hinder Intel’s continuous advancement in developing new processors. Unlike competitors concentrating on Arm architecture processor development, Intel places a stronger focus on AI software applications and the market opportunities arising from its partnership with the Microsoft platform.

Explore more:

• [News] Qualcomm Challenges Intel & AMD in AI PC Chip Race
• [News] Intel, Samsung, TSMC Race in Cutting-Edge Processes

Non-Apple IC manufacturers are reporting positive business performance this quarter. Chinese brands are experiencing a revival driven by the release of new Huawei smartphones, and a resolution in inventory clearance in emerging markets. This has led to an increase in orders. Additionally, Samsung’s success in foldable phones is contributing to the upsurge. This overall trend is benefiting companies like MediaTek and Novatek in the smartphone-related IC manufacturing sector.

As reported by CTEE, China holds about 25% of the global smartphone market, with industry analysts predicting sales of 260 million units in China for 2023. Huawei’s re-entry into the smartphone market will significantly impact the smartphone SoC market share in 2024. This development will challenge Apple’s market share in China, and Huawei’s upcoming Nova mid-range smartphones will also affect brands like Honor, OPPO, Vivo, Xiaomi, and others, as they vie for market share.

Key drivers of the smartphone industry’s recovery

According to Economic Daily News, many Chinese smartphone brands are optimistic about the local market’s improvement following the launch of Huawei’s new smartphones. Beyond flagship models like the Mate 60, mid-range series like Nova are also showing increased activity. Leading non-Apple smartphone manufacturers are gearing up for a surge in demand and are actively stocking up on top-tier flagship chips, thus stimulating the supply chain’s demand for additional orders.

At the same time, Taiwanese manufacturers mention that Chinese smartphone brands that primarily target emerging markets have already digested their accumulated inventory and are now starting to replenish their stocks. Some smartphone-related chip manufacturers have also pointed out that Samsung and other Korean smartphone giants are enjoying good sales of foldable phones and have recently conveyed messages about increasing orders.

TrendForce notes that the current revival on demand side in the global smartphone market is primarily driven by inventory restocking. The potential for sustained orders remains uncertain due to the prevailing economic challenges.

(Image: MediaTek)

Explore more:

• [News] Oppo and Transsion Expand to Southeast Asia, with a Focus on Foldable Phones
• [News] Industry Insiders Report Huawei’s Target of Shipping 100 Million Smartphones Next Year
• [News] Xiaomi’s Second Chip Company Founded with a Capital of 3 Billion Yuan
• OLED Penetration in Smartphones to Exceed 50% in 2023

In TrendForce’s latest solar energy pricing, it is revealed that upstream polysilicon and wafer transactions have reached a standstill, while downstream cell and module prices continue to decline.

• Polysilicon

Polysilicon prices continue to decline throughout the week. The mainstream concluded price for mono recharge polysilicon is RMB 70/KG, while mono dense polysilicon is priced at RMB 68/KG and N-type polysilicon is currently priced at RMB 75/KG.

In terms of trading, this week has shown a slight improvement compared to the stagnation of the previous week. Some small orders have been placed, but the majority of companies are still in the negotiation process. Additionally, there are ongoing discussions about transaction prices for polysilicon and crystal pulling.

Examining the price trends, there’s a notable divergence between leading manufacturers and second-tier manufacturers, with the current prices approaching the cost threshold for the latter and older capacity.

When we analyze the supply and demand dynamics, it becomes evident that as polysilicon prices continue to decline, downstream manufacturers are considering production cuts, and new production capacity might face the challenge of running at a loss right after starting operations.

Moreover, considering the projected oversupply in the future and the potential for prices to hit rock bottom, some manufacturers have realized that the profits from new production capacity may differ significantly from their expectations, prompting them to adjust their production schedules.

However, in the short term, polysilicon output is showing a month-on-month growth trend this quarter. As downstream demand decreases, polysilicon prices will likely continue to face pressure. Overall, this week has seen a decline in quoted polysilicon prices, and the price gap between N-type and P-type polysilicon continues to narrow.

• Wafer

The prices of wafer have still reduced throughout the week. The mainstream concluded price for M10 wafer is RMB 2.30/Pc, while G12 wafer is priced at RMB 3.30/Pc. The current cell prices are causing significant losses in the cell business, leading to a substantial reduction in activation rates.

The overall market turnover is currently sluggish. Additionally, the quoted prices only reflect the trend of declining wafer prices and may not accurately represent the actual transaction prices for spot goods.

On the supply side, wafer prices have continued to decline over the past two weeks. If the prices of different types of wafers keep dropping, manufacturers may find themselves in a situation where their costs exceed their selling prices.

Consequently, wafer production schedules have seen a significant reduction, forcing some second and third-tier manufacturers to maintain OEM business for meager profits. The current wafer inventory level has decreased to 1.9-2.1 billion pieces, and there are indications that prices are reaching a bottom in the market.

On the demand side, downstream cell manufacturers are gradually reducing their production schedules, and inventory issues have not been effectively resolved. As a result, cell manufacturers are becoming more cautious when it comes to purchasing wafers. This week, wafer prices have continued to decline, but the rate of decline will narrow with cost support.

However, considering the price pressure imposed by downstream consumers, their high inventory levels, and other factors, wafer prices have yet to stabilize and are likely to continue falling in the future.

• Cell

Cell prices have still declined this week. The mainstream concluded price for M10 cell is RMB 0.48/W, while G12 cell is priced at RMB 0.52/W. The price of M10 mono TOPCon cell is RMB 0.49/W.

On the supply side, current cell inventory has remained high for more than seven days. Consequently, facing pressure from both the elevated inventory levels and downstream module manufacturers, cell prices have experienced a decline.

The current price of M10 P-type cells stands at 0.48 yuan per watt, which is approaching the production cost of leading integrated manufacturers. The reduction in cell production is the current scenario.

However, the shipment pressures haven’t been alleviated, and the price gap between N-type and P-type cells has narrowed, putting both types at risk of operating at a loss due to costs exceeding their prices. On the demand side, the domestic peak season for centralized cell procurement has concluded, and there has been no significant uptick in demand in overseas markets or the distributed PV sector.

As a result, the demand for cells has weakened. With module prices also under pressure, module manufacturers are inclined to push down cell prices. Although there has been some improvement in the rate of decline for cells this week, the accumulation of cell inventory, falling upstream material prices, and sluggish downstream demand continue to exert constant pressure on cell prices.

• Module

Module prices have gone down slightly throughout the week. The mainstream concluded price for 182mm facial mono PERC module is RMB 1.08/W, 210mm facial mono PERC module is priced at RMB 1.11/W, 182mm bifacial glass PERC module at RMB 1.09/W, and 210mm bifacial glass PERC module at RMB 1.12/W.

On the supply side, module prices are persistently decreasing and have come close to the cost price of integrated manufacturers. Specialized module manufacturers, in response to module prices falling below their cost, have had to reduce their production rates to avoid losses. This is evident from the reduced demand for various auxiliary materials associated with module production.

On the demand side, the primary driver of demand continues to be large domestic projects, whereas overseas demand has not shown any significant increase. The overseas market is still working through its high inventory. In domestic bidding projects, there’s a noticeable shift toward an increased proportion of N-type modules, indicating a faster transition in demand toward N-type technologies.

In the third round of centralized procurement for PV modules by Huadian Group, the quoted price stands at 0.9933 yuan per watt. In the same month, the bidding price for modules in the centralized procurement tender by CHN Energy is 0.945 yuan per watt, marking a record low within a single month.

This price trend underscores the inevitable intense competition within the module sector, as excess production capacity is evident throughout the entire industry chain. This week, module prices have continued their descent. In summary, it’s probable that module prices will remain volatile in the future, especially considering that bidding prices for modules are swiftly approaching the 1 yuan mark.

Read more

• PV Industry Supply Chain Price Update

The research institution TrendForce held its AnnualForecast 2024 Seminar on November 3, where they delved into discussions about global wafer foundry trends, the applications of AI, the dynamics of AI servers, and the demand for High Bandwidth Memory (HBM).

Joanne Chiao, analyst from TrendForce, observed that while AI servers have experienced robust growth over the past two years, AI chips account for just 4% of wafer consumption, limiting their impact on the overall wafer industry. Nevertheless, both advanced and mature processes offer business opportunities. The former benefits from the desire of companies like CSPs to develop customized chips, leading them to seek the assistance of design service providers; while the latter can consider venturing into sector such as power management ICs and I/O solutions.

Persisting US export restrictions continue to affect China’s foundries, causing delays in their expansion plans. Furthermore, the regionalisation of wafer foundry services is exacerbating issues related to uneven resource distribution.

Due to lackluster end-market demand and fierce market competition, the capacity utilization rate of 8-inch wafer foundries continue to decline until the first quarter of the upcoming year. Inventory adjustments are underway in the fields of industrial control and automotive electronics. Chinese foundries are more willing to offer competitive prices, and outperforming their counterparts in Taiwan and Korea in terms of order performance.

In the realm of 12-inch wafer foundry services, success relies on technological leadership and exclusivity. Competition isn’t as intense as it is with 8-inch wafers. This resurgence is driven by inventory replenishment, the demand for iPhone 15, select Android smartphone brands, and the need for AI chips. A moderate recovery is expected in the latter part of this year.

TrendForce indicates that, with the expansion of processes beyond 28nm, mature process capacity is expected to occupy less than 70% of the capacity of the top ten foundries by 2027. Under the pressure to transition towards mature processes, China is anticipated to account for 33% of mature process capacity by 2027, with the possibility of further increases.

It’s noteworthy that Japan is actively promoting the revival of its semiconductor industry and, through incentives for foreign companies establishing fabs, may secure 3% of advanced process capacity.

TrendForce’s analyst, Frank Kung, predicts that the shipment of Nvidia’s high-end GPU processors will exceed 1.5 million units this year, with a YoY growth rate of over 70%, expected to reach 90% by 2024. Starting from the latter half of this year, Nvidia’s high-end GPU market will transition primarily to H100. As for AMD, its high-end AI solutions are mainly targeted at CSPs and supercomputers. The AI server market, equipped with MI300, is expected to experience significant expansion in the latter half of this year.

In the 2023-2024 period, major CSPs are poised to become the primary drivers of AI server demand, with Microsoft, Google, and AWS ranking among the top three. Additionally, the robust demand for cloud-based AI training is expected to propel the growth of advanced AI chips, which may, in turn, stimulate growth in power management or high-speed transmission-related ICs in the future.

Lastly, concerning HBM, TrendForce’s senior research vice president, Avril Wu, mentioned that as Nvidia’s H100 gradually gains momentum, HBM3 is set to become the industry standard in the latter half of this year. With the launch of B100 next year, HBM3e is poised to replace HBM3 as the mainstream memory in the latter half of the following year. Overall, HBM plays a pivotal role in DRAM revenue, with expectations of an increase from 9% in 2023 to 18% in 2024, potentially leading to higher DRAM prices in the coming year.
(Image: TechNews)