The global new energy vehicle (NEV) industry has grown by leaps and bounds over the past two years, especially in Chinese markets where 6.46 million NEVs were sold in 2022 — an impressive 89.5% YoY growth. The penetration rate of NEVs jumped from 14.3% in 2021 to 25.6% in 2022.

The global automotive MCU industry has also grown hand in hand, largely in part due to the explosive growth of NEVs and their tight supply-demand relationship. In 2022, the global automotive MCU market generated US$8.286 billion in revenue — an 11.4% YoY growth. Looking ahead to 2023, the market is predicted to grow 4.35%, reaching a value estimation of US$8.646 billion as a result of continued market expansion and technological advancements in the NEV industry.

Automotive MCUs to undergo a technological and demand revolution

More advanced NEVs will demand higher processing power from MCUs, requiring them to bear heavier performance loads. Foundries such as NXP, Renesas, and Infineon are working to improve the performance of their automotive MCUs through a two-pronged approach: Upgrading the manufacturing process and testing out new forms of storage to prevent a performance bottleneck.

Demand for automotive MCUs will be significantly boosted in the short term as NEVs become more intelligent, functional, complex, and comfortable. In the long-term, the electrical architecture of NEVs plans to shift from a decentralized to a more centralized design, consolidating multiple functions into one domain controller. While this will increase performance loads for MCUs, it also means a fewer number will be needed.

Chinese automotive MCU market experiences boom as domestic production ramps up in the face of a global shortage

China’s automotive MCU market has rapidly expanded in the past three years due to two factors: First, a global shortage has provided Chinese manufacturers an opportunity to break into the market. Especially since China is the world’s largest producer of NEVs, which translates to a higher demand for MCUs than any other region. In the past year alone, 16 Chinese manufacturers have launched their own MCUs; while some are currently in the certification process, others have already entered production.

Second, in the midst of a domestic production boom, an increasing number of Chinese automakers have switched to using domestic MCUs. Domestic NEVs account for more than half of China’s market share, providing Chinese MCU manufacturers with more opportunities to cooperate with Chinese automakers. A number of Chinese automakers have even begun investing in domestic MCU manufacturers.

Over the past three years, the rapid expansion of China’s automotive MCU industry has helped them gain a competitive edge within the market. In the mid- to long-term, China’s MCU market will continue to grow thanks to ramped up domestic production and a thriving NEV market.

On October 7, 2022, the U.S. government imposed export regulations restricting China’s access to semiconductor technology. In particular, the sanctions pertained to manufacturing equipment required in the production of 16nm/14nm or more advanced logic chips (FinFet, GAAFET), 18nm or more advanced DRAM chips, and NAND Flash with 128 or more layers. It’s evident that the U.S. intends to restrict China’s semiconductor manufacturing to 1Xnm. Moving forward, 28nm processes are likely to be included in the next set of regulations as some equipment used in manufacturing 28nm nodes can also be utilized in more advanced processes.

TrendForce predicts that upcoming U.S. export regulations will further focus on 28nm processes. Not only can 28nm manufacturing equipment be used in more advanced processes, but tight restrictions have forced Chinese companies to focus their efforts on expanding their 28nm operations. 28nm processes can be used to produce a large variety of other products: SoCs, ASIC AI chips, FPGAs, DRAMs, NAND Flash, ISPs, DSPs, Wi-Fi chips, RF components, Driver ICs, MCUs, CISs, DAC/ADC chips, PMICs, and other core components in a wide range of applications. If the U.S. allows Chinese companies to accelerate the expansion of their 28nm processes, China’s importance in the supply chain for terminal products will continue to climb — ultimately setting back the U.S’s efforts to decouple itself from China.

China still unable to fully manufacture 28nm chips domestically as expansion exhibits signs of slowing down

China cannot fully rely on domestic production for their 28nm semiconductors. If the U.S. chooses to move forward with restricting China’s access to 28nm manufacturing equipment, expansion will surely grind to a halt. China currently possesses equipment that is able to clean, backgrind, etch, and sediment for 16nm/14nm or more advanced processes. However, this is not enough for China to achieve semiconductor autonomy. Semiconductor manufacturing is relatively complicated as it involves thousands of processes; Chinese factories are only involved in a few of the processes — the majority of which depend on American and Japanese factories. All in all, with China’s semiconductor industry largely focused on 28nm/40nm and more mature processes, it will be difficult for them to achieve semiconductor autonomy for processes more advanced than 28nm by 2028.

According to TrendForce’s latest investigation, Chinese foundries have already suspended plans to expand production capacity for advanced processes after the US government began restricting the exportation of equipment and technical support for processes related to non-planar architectures. TrendForce believes that a further tightening of the restrictions on lithography equipment will mainly affect mature processes, especially the 28nm. Chinese foundries might proceed more slowly in adding new production capacity or raising output for the 28nm process due to the prolonged reviews on their equipment purchases.

TrendForce semiconductor analyst, Joanne Chiao, said that Chinese semiconductor companies have already suspended the development of chips featuring the GAA architecture (i.e., nodes that are generally ≤3nm) after the US government began restricting the exportation of EDA tools and related technical support. If we talk about the FinFET architecture that Chinese foundries are able to produce for now, it is possible to achieve the faster computing speed of the more advanced chips by combining multiple lower-end chips. However, it might also be very challenging to raise the production yield rate of a solution that integrates multiple chips, not to mention that the power consumption of such solution might be very high as well.

Seeing the US export control, for now, US government has not imposed restrictions on the exportation of technical support for processes related to planar architectures. On the other hand, Chinese foundries might halt their advanced chip (14nm) production at any time if they encounter an equipment malfunction or another problem that requires technical support from US equipment providers.

At last, Chiao emphasized that the US sanction has definitely accelerated the development of an “all-China” semiconductor manufacturing supply chain. Nevertheless, the world’s top eight semiconductor equipment providers all come from Japan or the US. From the perspective of the foundry industry, it will be hard for China to realize a wholly or mostly native semiconductor supply chain within the foreseeable future.

The market started worrying about the oversupply in semiconductor 2023, when the demand will start growing again depends on two factors: the situation of the macroeconomy and the inventory status.

Since foundries’ capacity utilization rates started drop in 3Q22, chip supply as a whole has decreased significantly. This, in turn, has helped limit inventory growth across the supply chain. However, the global economy is still at risk of a mild recession, so consumers may allocate more of their spending to daily necessities. They may also spend more on tourism due to easing of the pandemic. This could lead to weak sales for consumer electronic products.

Not to mention that most consumers already purchased the electronic products that they need for working or studying at home during the pandemic. Assuming that the overall inventory level of the supply chain will return to a healthier level, TrendForce believes that chip demand will begin to rebound to a certain extent in 2Q23. Then, the demand growth will become more obvious from 3Q23 onward. Nevertheless, this demand growth may not be too strong due to uncertainties in the global economy.

If we observe the situation from the perspective of the foundry industry, smartphones represent the largest application segment in terms of wafer consumption. The smartphone supply chain started inventory correction earlier, so demand rebound might be more obvious initially for smartphone-related chips compared with chips used in other consumer devices. On the other hand, with different benchmarks, the demand for HPC chips will show more significant growth compared with the demand for smartphone chips.

On December 6, TSMC held a ceremony for the first tool-in of its new Arizona fab. This event came after the foundry giant had publicized a series of overseas expansion projects. Within Taiwan, TSMC’s recent announcements have caused a stir in public opinion. Concerns have been raised about the possibility of a hollowing out of the island’s semiconductor industry due to a mass exodus of professionals involved in chip manufacturing.

TSMC’s Overseas Expansion Plan

TSMC actually embarked on the path to internationalize its business operations much earlier in 2015, when it made the announcement to build a fab in Nanjing, Mainland China. At that time, the chief reason behind this expansion project was that Huawei had become the second most important client next to Apple. Also, TSMC planned to have its 16nm node serve as the main manufacturing technology of the Nanjing fab. This decision was in line with the semiconductor technology export rules enforced by Taiwan’s Ministry of Economic Affairs. Specifically, domestic chipmakers are only allowed to deploy “n-1” technologies at overseas manufacturing sites. Despite being in compliance with all domestic laws and regulations, TSMC still attracted a lot of controversies with establishing a base of operation in Mainland China, and there were speculations that more advanced semiconductor technologies will be leaving Taiwan with the “westward expansion”.

Fast-forward to present day, China is not the only one that is focusing on the development of a homegrown semiconductor industry. After witnessing the impact of the COVID-19 pandemic on the global supply chain, many other countries are reconsidering the importance of semiconductor supply in their own industries. From the US to Japan and European countries, governments have begun to offer various subsidies and market-based incentives in order to entice major semiconductor manufacturers such as TSMC to build fabs in their territories.

A detailed survey of TSMC’s overseas expansion activities from 2015 onwards finds that the construction of the Nanjing fab commenced in 2016 a year after the announcement of the project. The fab then celebrated the formal start of mass production with a ceremony in 2018. Two years later, in 2020, TSMC revealed the plan to build a 12-inch wafer fab that deploys advanced nodes in Arizona. Moving into 2021, the foundry giant unveiled two more expansion projects in Japan. The plan to open a “3D IC material R&D center” in Tsukuba (Ibaraki Prefecture) was announced first. Later in October of that same year, TSMC said it will set up a fab in Kumamoto.

Where Will TSMC Go After US?

Regarding the locations of TSMC’s fabs worldwide, TrendForce’s latest research reveals that for 12-inch wafer foundry, TSMC has four fabs in Taiwan, including including two upcoming greenfield projects respectively located in Hsinchu and Kaohsiung. Outside Taiwan, TSMC has one operational 12-inch wafer fabs in Mainland China and two more under construction in the US and Japan. Besides these existing and planned fabs, a close eye is also being kept on TSMC’s possible expansion into the EU states. Germany has long been rumored to be TSMC’s candidate for setting up a fab in Europe. However, Ireland has a lot of potential as well since Intel previously announced its intention to expand its existing manufacturing operation in this country. Currently, TSMC is internally assessing the feasibility of landing a project in Ireland.

Taiwan Still Has Advantages in Talents, Business Culture, and Complete Industry Ecosystem

Going back to the issue of whether TSMC’s overseas expansion activities will negatively affect Taiwan’s semiconductor industry by causing an outward migration of related professionals or a weakening of the industry’s competitive advantage. According to TrendForce analyst Joanne Chiao, the deglobalization trend is gradually emerging in the supply-demand dynamics of the semiconductor market. Based on the latest data, the geographical distribution of TSMC’s production capacity (that is calculated in thousands of 12-inch wafer equivalents per month) for 2022 is estimated as follows: 93% in Taiwan, about 6% in Mainland China, and 1% in the US. The short-term effects of TSMC’s overseas projects will thus be very limited as the majority share of the foundry’s production capacity is going to stay in Taiwan.

As for the effects on the competitiveness of the domestic semiconductor industry in the long run, Chiao believes that deglobalization will lead to a general rise in operating costs for foundries worldwide. This means that every foundry will be facing increasing pressure related to pricing regardless of where they put their fabs. On the other hand, Taiwan’s importance as the world’s main chip production base will diminish somewhat over time because of the deglobalization trend.

Nevertheless, the foundry industry depends on tight relations with clients as well as highly synchronized and meticulous services among all participants across the supply chain. This is where Taiwan shines because the island is home to a complete ecosystem for the foundry industry. All participants in this ecosystem advance together when it comes to upgrading technological capabilities or overcoming technological bottlenecks. Apart from these advantages, a system of management has been well established on the island for the various aspects of fab operation. As foundries keep their fabs running 24/7, they are constantly tested in manpower scheduling. Therefore, they have to rely on locally cultivated talents and local experience that have taken decades to amass. In other words, fabs in Taiwan are performing at the highest level because of the local business and work culture.

（Image credit: TSMC Linkedin）