Chip giant NVIDIA kicked off its annual Graphics Processing Unit (GPU) Technology Conference (GTC) today, with CEO Jensen Huang announcing the launch of the new artificial intelligence chip, Blackwell B200. According to a report from TechNews, this new architecture, Blackwell, boasts a massive GP...

Benefited from robust demand in downstream application markets, the silicon carbide (SiC) industry is in high gear. According to TrendForce, the SiC power device market is expected to reach USD 5.33 billion by 2026, with its mainstream applications still highly reliant on electric vehicles and renew...

According to sources cited by Reuters,  TSMC is reportedly considering plans to establish a production line for its CoWoS technology in Japan. However, TSMC has yet to make any further decisions, and they have declined to comment on the matter. CoWoS is an advanced packaging technology that stac...

The Executive Yuan and TSMC have reportedly reached a consensus on the investment project for the new advanced packaging plant at the TSMC Science Park in Chiayi. According to a report from Economic Daily News, six new plant sites will be allocated to TSMC in the Science Park, two more than original...

"It is not the shortage of AI chips, it is the shortage of our CoWoS capacity," replied TSMC Chairman Mark Liu during an interview in September last year, propelling this technology that TSMC had quietly cultivated for over a decade into a global spotlight. As per a report from TechNews, the hard...