Semiconductors


2024-03-25

[News] The Intense Battle of 2-Nanometer Technology Set to Escalate Next Year

As the demand for AI is becoming urgent, according to industry sources cited by the ChinaTimes News, TSMC's Fab20 P1 plant in Hsinchu's Baoshan area will undergo equipment installation engineering in April to warm up for mass production of the GAA (gate-all-around) architecture. Reportedly, it is...

2024-03-25

[News] Texas Instruments Plans Large-Scale Transition of GaN Chip Production from 6-inch to 8-inch Wafers

According to a report from Korean media outlet THE ELEC, a senior executive at analog chip manufacturer Texas Instruments (TI) stated that the company is transitioning its production of gallium nitride (GaN) chips from several 6-inch fabs to 8-inch fabs. The same report further noted that Jerome ...

2024-03-22

[News] Micron’s Financial Report Reveals High Demand for HBM in 2025, Capacity Nears Full Allocation

Micron, the major memory manufacturer in the United States, has benefited from AI demand, turning losses into profits last quarter (ending in February) and issuing optimistic financial forecasts. During its earnings call on March 20th, Micron CEO Sanjay Mehrotra stated that the company's HBM (Hig...

2024-03-22

[News] Samsung Reportedly Commits to Advanced Packaging, Targets Over USD100 Million in Related Revenue This Year

Amid the AI boom driving a surge in demand for advanced packaging, South Korean semiconductor giant Samsung Electronics is aggressively entering the advanced packaging arena. On the 20th, it announced its ambitions to achieve record-high revenue in advanced packaging this year, aiming to surpass the...

2024-03-21

[News] MediaTek Partners with Ranovus to Enter Niche Market, Expands into Heterogeneous Integration Co-Packaged Optics Industry

MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This pla...

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